| Voltage Rating | 6.3V |
| Capacitance | 4.7uF |
| Temperature Coefficient | X5R |
| Tolerance | ±10% |
| Description | 6.3V 4.7uF X5R ±10% 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603X5R475K6R3NT |
| Package | 0603 |
| Model Number | 0603X5R475K6R3NT |
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Product Specification
| Voltage Rating | 6.3V | Capacitance | 4.7uF |
| Temperature Coefficient | X5R | Tolerance | ±10% |
| Description | 6.3V 4.7uF X5R ±10% 0603 Ceramic Capacitors RoHS | Mfr. Part # | 0603X5R475K6R3NT |
| Package | 0603 | Model Number | 0603X5R475K6R3NT |
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier | ||
| AC-DC power charger | ||
| DC-DC power charger | ||
| Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| Part Number Breakdown | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Construction | Ceramic dielectric | N/A |
| Inner electrode | N/A | |
| Dimension (mm) | British System | Metric System |
| 0201 (0603) L*W*T: 0.600.10 * 0.300.05 * 0.300.05 | N/A | |
| 0402 (1005) L*W*T: 1.000.15 * 0.500.15 * 0.500.10 | N/A | |
| 0603 (1608) L*W*T: 1.600.20 * 0.800.15 * 0.800.15 | N/A | |
| 0805 (2012) L*W*T: 2.000.20 * 1.250.20 * 0.800.20 | N/A | |
| 1206 (3216) L*W*T: 3.200.30 * 1.600.30 * 1.000.20 | N/A | |
| 1210 (3225) L*W*T: 3.200.30 * 2.500.30 * 2.70 | N/A | |
| 1808 (4520) L*W*T: 4.500.40 * 2.000.20 * 2.70 | N/A | |
| 1812 (4532) L*W*T: 4.500.40 * 3.200.30 * 3.50 | N/A | |
| 1825 (4563) L*W*T: 4.500.40 * 6.300.50 * 3.50 | N/A | |
| 2220 (5750) L*W*T: 5.700.50 * 5.000.50 * 3.50 | N/A | |
| 2225 (5763) L*W*T: 5.700.50 * 6.300.50 * 6.20 | N/A | |
| Specifications and Testing Methods | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec | |
| Static Capacity | Meets standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | |
| Dissipation Factor (DF) | NPO Characteristic: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) | |
| X7R/X7T/X7P Characteristic: See Note 1 | ||
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF | |
| X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | ||
| Hi-pot (DC) | No dielectric breakdown or damage (Voltage varies based on rated voltage Ur) | |
| Solderability | Soldering area90%, Visual-No damage | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | No damage, Electro static capacity change rate C/C10% | |
| Terminal Bonding Strength | No visual damage | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | |
| Temperature Moisture Exposure | Visual: No visual damage; Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | |
| High Temperature Exposure | Visual: No visual damage; Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | |
| PCB Flexural Strength | No crack and other defect | |
| Embossed Plastic Taping | Tapesize | 0805: 1.550.20, 1206: 1.950.20, 1210: 2.700.10, 1808: 2.200.10, 1812: 3.660.10 |
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | |
| Paper Tape Reel Packing | Paper Size | 1005: 0.240.02, 0201: 0.370.10, 0402: 0.650.10, 0603: 1.100.10, 0805: 1.450.15, 1206: 1.800.20 |
| Top tape peeling strength | N/A | |
| Packing Quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000 |
| Plastic T/R (Pcs) | 0805: 3000, 1206 (T1.35mm): 3000, 1206 (T>1.35mm): 2000, 1210 (T1.60mm): 3000, 1210 (T>1.60mm): 2000, 1808: 1000, 1812 (T1.85mm): 1000, 1812 (T>1.85mm): 800, 1812: 500 | |
| Precautions for Use | MLCCs may fail in short or open circuit modes under severe conditions. Follow soldering profiles, handle with care during manual soldering, and use recommended solder amounts. Avoid sudden temperature changes to prevent cracks. | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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