Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 2kV |
| Capacitance | 270pF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 270pF ±10% 2kV Ceramic Capacitor X7R 1206 |
| Mfr. Part # | 1206X7R271K202NT |
| Package | 1206 |
| Model Number | 1206X7R271K202NT |
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Product Specification
| Voltage Rating | 2kV | Capacitance | 270pF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 270pF ±10% 2kV Ceramic Capacitor X7R 1206 | Mfr. Part # | 1206X7R271K202NT |
| Package | 1206 | Model Number | 1206X7R271K202NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in medium and high voltage ratings and are constructed with ceramic dielectric, inner and outer electrodes, a nickel layer, and a tin layer.
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. (Medium and High voltage MLCC). | ||||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | |||||
| Dimension Code | Inch (L*W) | mm (L*W) | Codes | ||
| 0.02*0.01 | 0.50*0.25 | 0201 | |||
| 0.04*0.02 | 1.00*0.50 | 0402 | |||
| 0.06*0.03 | 1.60*0.80 | 0603 | |||
| 0.08*0.05 | 2.00*1.25 | 0805 | |||
| 0.12*0.06 | 3.20*1.60 | 1206 | |||
| 0.12*0.10 | 3.20*2.50 | 1210 | |||
| 0.18*0.08 | 4.50*2.00 | 1808 | |||
| 0.18*0.12 | 4.50*3.20 | 1812 | |||
| 0.18*0.25 | 4.50*6.30 | 1825 | |||
| 0.22*0.11 | 5.70*2.8 | 2211 | |||
| 0.22*0.25 | 5.70*6.30 | 2225 | |||
| Temperature characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal electrostatic capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of electrostatic capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated voltage (DC) | 250 25, 251 250, 252 2500 (V) | ||||
| Packing | T Tape/Reel, P Bag packing (PE) | ||||
| 4. Construction and Dimension | Construction: 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickle layer 5. Tin layer | ||||
| Dimension (mm): | L | W | T | ||
| Part number | British system | Metric system | WB | ||
| 0201 | 0603 | 0.600.10 | 0.300.05 | 0.300.05 | |
| 0402 | 1005 | 1.000.15 | 0.500.15 | 0.500.10 | |
| 0603 | 1608 | 1.600.20 | 0.800.15 | 0.800.15 | |
| 0805 | 2012 | 2.000.20 | 1.250.20 | 0.800.20 | |
| 1206 | 3216 | 3.200.30 | 1.600.30 | 1.000.20 | |
| 1210 | 3225 | 3.200.30 | 2.500.30 | 2.70 | |
| 1808 | 4520 | 4.500.40 | 2.000.20 | 2.70 | |
| 1812 | 4532 | 4.500.40 | 3.200.30 | 3.50 | |
| 1825 | 4563 | 4.500.40 | 6.300.50 | 3.50 | |
| 2220 | 5750 | 5.700.50 | 5.000.50 | 3.50 | |
| 2225 | 5763 | 5.700.50 | 6.300.50 | 6.20 | |
| 5. Specification and testing method | Temperature | -55~+125 | Naked eye (Visual inspection) | ||
| Visual/ Dimension | 1. No Damage 2. Dimension meet Spec | Digital calliper | |||
| Static capacity | Meet standard specification and tolerance | ||||
| NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms 1000 pF: 1KHz10%, 1.00.2Vrms | |||||
| X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | |||||
| Dissipation factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms. | ||||
| X7R/X7T/X7P characteristic: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. | |||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF IR*Cr500S, C10nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||
| X7R/X7T/X7P Characteristic: IR10000M, C25nF IR*Cr100S, C25nF | |||||
| Hi-pot (DC) | No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||
| Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF larger reading X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Pre-heating 150 1 hour, then place 48 hours under normal pressure & temperature. | |||
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452. | |||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P- characteristic: C/C0.5% X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||
| Temperature moisture exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading), X7R/X7T/X7P characteristic: C/C10% DF: 2 times initial standard IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading), X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||
| High temperature exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading), X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. | |||
| PCB flexural strength | No crack and other defect | IR. Soldering the MLCC on the PCB. Pressing direction based on the photo. | |||
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||
| 0603 | 4000 | ||||
| 0805 | 4000 | 3000 (T1.35mm) | |||
| 1206 | 3000 (T>1.35mm) | ||||
| 1210 | 2000 (T1.60mm) | ||||
| 1808 | 3000 (T>1.60mm) | ||||
| 1812 | 2000 | ||||
| 1812 above | 1000 (T1.85mm) | ||||
| 1000 (T>1.85mm) | |||||
| 800 | |||||
| 500 | |||||
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
During preheating, maintain the temperature difference between soldering temperature and chip surface temperature as T 150.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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