Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 16V |
| Capacitance | 10uF |
| Temperature Coefficient | X6S |
| Tolerance | ±20% |
| Description | 16V 10uF X6S ±20% 0805 Ceramic Capacitors RoHS |
| Mfr. Part # | 0805X6S106M160NT |
| Package | 0805 |
| Model Number | 0805X6S106M160NT |
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Product Specification
| Voltage Rating | 16V | Capacitance | 10uF |
| Temperature Coefficient | X6S | Tolerance | ±20% |
| Description | 16V 10uF X6S ±20% 0805 Ceramic Capacitors RoHS | Mfr. Part # | 0805X6S106M160NT |
| Package | 0805 | Model Number | 0805X6S106M160NT |
This series of 0805 (X6S) surface mount ceramic capacitors (MLCC) is designed for high-voltage electronic circuits, serving functions such as coupling, filtering, and resonance. They are suitable for applications including switching power supplies, AC-DC and DC-DC converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts.
| Item | Specification | Test Method |
|---|---|---|
| Test Conditions | ||
| Standard State | Ambient Temperature: 15~35 Ambient Humidity: 45~75%RH Atmospheric Pressure: 86~106kPa | N/A |
| Standard Relative State | Ambient Temperature: 252 Ambient Humidity: 60~70%RH Atmospheric Pressure: 86~106kPa | N/A |
| Product Structure and Dimensions | ||
| Product Structure | 1. Ceramic Dielectric 2. Inner Electrode 3. Outer Electrode 4. Nickel Layer 5. Tin Layer | N/A |
| Product Dimensions (0805) | L: 2.000.20 mm W: 1.250.20 mm T: 0.800.20 mm WB: 1.000.20 mm | Inch: 0.08*0.05 |
| Specifications and Test Methods | ||
| 1. Operating Temperature Range | -55~+105 | N/A |
| 2. Appearance and Dimensions | 1. No visible damage 2. Dimensions meet specifications | Visual inspection; Caliper measurement |
| 3. Capacitance | Within specified tolerance | Frequency and voltage vary by characteristic (e.g., 1MHz10%, 1.00.2Vrms for NPO 1000pF; 1KHz10%, 1.00.2Vrms for X7R/X5R 10uF) |
| 4. Dissipation Factor (DF Value) | NPO: DF0.56% (Cr5 pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X5R/X6S/X7S/Y5V: See Note 1 | Frequency and voltage vary by capacitance (e.g., 110%MHz, 1V0.2rms for Cr1000pF NPO) |
| 5. Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X6S/X5R: IR10000M, C25nF; IR*Cr100S, C25nF | Test voltage: 500V or rated voltage (if <500V); Duration: 605 sec; Humidity: 75%; Temp: 255; Current: 50mA |
| 6. Dielectric Strength (DC) | No dielectric breakdown or damage | 2.5x rated voltage (Ur=100V), 2.0x (Ur=200V/250V), 1.5x (Ur=450/500/630V), 1.2x (1KVUr2KV), 1.1x (Ur>2KV). Ramp time: 1-10s, Hold time: 2s. |
| 7. Solderability | >90% tinning rate; No visible damage | Preheat: 80-120 for 10-30s; Solder temp: 2455; Solder time: 20.5s |
| 8. Solder Heat Resistance | No visible damage, 90% tinning rate; Capacitance change rate: NPO 0.5% or 0.5pF, X7R 15%, X6S 22%; DF value: As per No. 4; IR: As per No. 5 | Preheat: 100-200 for 102s; Immersion temp: 2605; Immersion time: 51s. Rest for 242 hours at room temp. |
| 9. Bending Strength | No visible damage; Capacitance change rate: 10% | Test substrate: Al2O3 or PCB (1.6mm thick). Bending depth: 1mm. Press speed: 0.5mm/sec. Measurement in bent state. |
| 10. Terminal Bond Strength | No visible damage | N/A |
| 11. Temperature Cycling | Capacitance change rate: NPO 2.5% or 0.25pF, X7R/X5R 7.5%, X6S 10% | 5 cycles: Lower temp (303 min) -> Room temp (2-3 min) -> Upper temp (303 min) -> Room temp (2-3 min). Post-test at room temp/humidity for 242 hrs. |
| 12. Humidity Resistance | No visible damage; Capacitance change rate: NPO 2% or 1pF, X7R/X6S/X5R 10%; DF value: 2x initial standard; IR: NPO 2500M or IR*Cr25S, X7R/X6S/X5R 1000M or IR*Cr25S | Temp: 402; Humidity: 90~95%RH; Time: 50024 hours. Post-test at room temp/humidity for 24 hrs. |
| 13. High Temperature Load Test | No visible damage; Capacitance change rate: NPO 2% or 1pF, X7R/X6S/X5R 20%; DF value: 2x initial standard; IR: NPO 4000M or IR*Cr40S, X7R/X6S/X5R 2000M or IR*Cr50S | Temp: 853; Time: 100048 hours. Voltage: 2x rated voltage (100VV250V), 1.5x (250V |
| 14. PCB Bending Resistance | No cracks or defects | Capacitor soldered onto fixture (Fig. 1) and subjected to force (Fig. 2). Reflow soldering recommended. |
| Packaging Information | ||
| Packaging Type | T: Tape Reel Packaging, P: Bulk Packaging (PE Bag) | Optional |
| Tape Reel Packaging (Pcs) - 0805 | 3000 (T1.35mm), 2000 (T>1.35mm) | N/A |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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