| Voltage Rating | 500V |
| Capacitance | 1nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 1nF ±10% 500V Ceramic Capacitor X7R 0603 |
| Mfr. Part # | 0603X7R102K501NT |
| Package | 0603 |
| Model Number | 0603X7R102K501NT |
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Product Specification
| Voltage Rating | 500V | Capacitance | 1nF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 1nF ±10% 500V Ceramic Capacitor X7R 0603 | Mfr. Part # | 0603X7R102K501NT |
| Package | 0603 | Model Number | 0603X7R102K501NT |
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage applications.
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier | ||
| AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||
| Testing Condition (Normal) | Temperature | 15~35 |
| Humidity | 45~75%RH | |
| Testing Condition (Relative) | Temperature | 252 |
| Humidity | 60~70%RH | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |
| Terminal Composition | Au/Ag-Ni-Sn | |
| Packing | T Tape/Reel, P Bag packing(PE) | |
| Construction and Dimension | Construction Item | Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer |
| Dimension (mm) - British System | 0201 (0603): 0.600.10 L, 0.300.05 W, 0.300.05 T, 0.100.05 WB 0402 (1005): 1.000.15 L, 0.500.15 W, 0.500.10 T, 0.200.10 WB 0603 (1608): 1.600.20 L, 0.800.15 W, 0.800.15 T, 0.300.10 WB 0805 (2012): 2.000.20 L, 1.250.20 W, 0.800.20 T, 1.000.20 WB 1206 (3216): 3.200.30 L, 1.600.30 W, 1.000.20 T, 1.250.20 WB 1210 (3225): 3.200.30 L, 2.500.30 W, 2.70 T, 0.800.30 WB 1808 (4520): 4.500.40 L, 2.000.20 W, 2.70 T, 0.800.30 WB 1812 (4532): 4.500.40 L, 3.200.30 W, 3.50 T, 0.800.30 WB 1825 (4563): 4.500.40 L, 6.300.50 W, 3.50 T, 0.800.30 WB 2220 (5750): 5.700.50 L, 5.000.50 W, 3.50 T, 1.000.40 WB 2225 (5763): 5.700.50 L, 6.300.50 W, 6.20 T, 1.000.40 WB | |
| Dimension (mm) - Metric System | 0603: 0.600.10 L, 0.300.05 W, 0.300.05 T, 0.100.05 WB 1005: 1.000.15 L, 0.500.15 W, 0.500.10 T, 0.200.10 WB 1608: 1.600.20 L, 0.800.15 W, 0.800.15 T, 0.300.10 WB 2012: 2.000.20 L, 1.250.20 W, 0.800.20 T, 1.000.20 WB 3216: 3.200.30 L, 1.600.30 W, 1.000.20 T, 1.250.20 WB 3225: 3.200.30 L, 2.500.30 W, 2.70 T, 0.800.30 WB 4520: 4.500.40 L, 2.000.20 W, 2.70 T, 0.800.30 WB 4532: 4.500.40 L, 3.200.30 W, 3.50 T, 0.800.30 WB 4563: 4.500.40 L, 6.300.50 W, 3.50 T, 0.800.30 WB 5750: 5.700.50 L, 5.000.50 W, 3.50 T, 1.000.40 WB 5763: 5.700.50 L, 6.300.50 W, 6.20 T, 1.000.40 WB | |
| Temperature | -55~+125 | |
| Static Capacity | NPO: 1000pF 1MHz10% 1.00.2Vrms; >1000pF 1KHz10% 1.00.2Vrms X7R/X7T/X7P: 10uF 1KHz10% 1.00.2Vrms; >10uF 120Hz24 0.50.1Vrms | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF) | |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage | |
| Solderability | Soldering area 90%, Visual-No damage | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | Electro static capacity change rate C/C10% | |
| Terminal Bonding Strength | No visual damage, Applied Force: 5N Duration: 101S | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | |
| Temperature Moisture Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | |
| High Temperature Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | |
| PCB Flexural Strength | No crack and other defect | |
| Embossed Plastic Taping | Tape size (0805) | A:1.550.20, B:2.350.20, C:8.000.20, D:3.500.05, E:1.750.10, F:4.000.10, G:2.000.10, H:4.000.10, J:1.50 -0/+0.10, T:1.50 Max |
| Tape size (1206) | A:1.950.20, B:3.600.20, C:8.000.20, D:3.500.05, E:1.750.10, F:4.000.10, G:2.000.10, H:4.000.1, J:1.50 -0/+0.10, T:1.85 Max | |
| Tape size (1210) | A:2.700.10, B:3.420.10, C:8.000.10, D:3.500.05, E:1.750.10, F:4.000.10, G:2.000.05, H:4.000.10, J:1.55 -0/+0.10, T:3.2 Max | |
| Tape size (1812) | A:3.660.10, B:4.950.10, C:12.000.10, D:5.500.05, E:1.750.10, F:8.000.10, G:2.000.05, H:4.000.10, J:1.55 -0/+0.10, T:4.0 Max | |
| Paper Tape Reel Packing | Paper size (1005) | W1:0.240.02, L1:0.450.02, D:8.000.10, C:3.500.05, B:1.750.10, P1:2.000.05, P2:2.000.05, P0:4.000.10, d:1.50 -0/+0.10, t:0.30 Below |
| Paper size (0201) | W1:0.370.10, L1:0.670.10, D:8.000.10, C:3.500.05, B:1.750.10, P1:2.000.05, P2:2.000.05, P0:4.000.10, d:1.50 -0/+0.10, t:0.80 Below | |
| Paper size (0402) | W1:0.650.10, L1:1.150.10, D:8.000.10, C:3.500.05, B:1.750.10, P1:2.000.05, P2:2.000.05, P0:4.000.10, d:1.50 -0/+0.10, t:0.80 Below | |
| Packing Quantity | 0603: Paper T/R (Pcs) 4000, Plastic T/R (Pcs) 3000 (T1.35mm) 0805: Paper T/R (Pcs) 4000, Plastic T/R (Pcs) 3000 1206: Paper T/R (Pcs) 3000, Plastic T/R (Pcs) 2000 (T1.60mm) 1210: Paper T/R (Pcs) 2000, Plastic T/R (Pcs) 3000 (T>1.60mm) 1808: Paper T/R (Pcs) 1000, Plastic T/R (Pcs) 2000 1812: Paper T/R (Pcs) 800, Plastic T/R (Pcs) 1000 (T1.85mm) 1812: Plastic T/R (Pcs) 800 (T>1.85mm), 500 | |
| Soldering Method | RReflow Soldering, WWave Soldering | |
Note 1: X7R/X5R/X6S/X7S Y5V Rated vol. DF Exception of D.F. 50V 5% 7% 06030.1F; 08050.47F; 12064.7F; 12.5% 12106.8F 35V 7% --- --- 25V 5% 7% 04020.047F;06030.1F; 08050.33F; 12061F; 1210 4.7F 9% 04020.068F;06030.47F; 12064.7F; 121022F; 16V (C<1.0F) 7% 9% 04020.068F; 06030.68F 12.5% 04020.22F 16V (C1.0F) 9% 12.5% 06032.2F; 08053.3F;120610F; 121022F; 181247F; 10V 12.5% 20% 04020.47F 6.3V 20% --- --- Rated vol. DF Exception of D.F. 100V 2.5% 3% 12060.47F 5% 08050.1F;06030.068F;1206>1F;12102.2F; 10% 08050.22F;12103.3F 50V 2.5% 3% 0201(50V); 06030.047F; 08050.18F;12060.47F 5% 02010.01uF; 12104.7F 10% 04020.012F;0603>0.1F; 08051F;12062.2F; 121010F; 35V 3.5% 10% 06031F;08052.2F;12062.2F;121010F 25V 3.5% 5% 02010.01F;08051F; 121010F 7% 06030.33F; 12064.7F 10% 02010.1F;04020.10F;06030.47F; 08052.2F; 1206 6.8F ; 121022F ; 12.5% 04020.47F 16V 3.5% 5% 02010.01F;04020.033F;06030.15F; 08050.68F;12062.2F;12104.7F 10% 02010.1uF(0201/X7R0.022F); 04020.22uF; 06031206 4.7F; 121022F; 10V 5% 10% 02010.012F;04020.33F(0402/X7R0.22F); 06030.33F; 08052.2F;12062.2F;121022F 15% 02010.1F; 04021F 6.3V 10% 15% 02010.1F;04021F;060310F; 08054.7F; 1206 47F :1210100F; 20% 04022.2F 4V 15% --- ---
Note 2: Initial capacitance testing: Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature.
Note 3: Soldering Profile to avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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