Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 450V |
| Capacitance | 100nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 450V 100nF X7R ±10% 1206 Ceramic Capacitors RoHS |
| Mfr. Part # | 1206X7R104K451NT |
| Package | 1206 |
| Model Number | 1206X7R104K451NT |
View Detail Information
Explore similar products
Ceramic capacitor AIDE CAPACITOR 1210X7R476K100NT designed for switch power
ceramic capacitor AIDE CAPACITOR 0603X7R105K100NT for energy saving lamps and
Multi Layer Ceramic Capacitors with CCTC TCC0603X5R105K500CT Specification and
Surface mount multilayer ceramic capacitors Chinocera HHV0805R7102K201NTHJ with
Product Specification
| Voltage Rating | 450V | Capacitance | 100nF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 450V 100nF X7R ±10% 1206 Ceramic Capacitors RoHS | Mfr. Part # | 1206X7R104K451NT |
| Package | 1206 | Model Number | 1206X7R104K451NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
| Item | Description | Details | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | High voltage circuits: switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, energy saving lamps. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Functions: Coupling, wave filtering, resonant. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Range | -55~+125 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Composition | Au/Ag-Ni-Sn | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing | T (Tape/Reel), P (Bag packing) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Construction and Dimension | Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimensions (mm) |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Testing frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C10nF). Testing condition: Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA. X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur): 2.5x Ur (Ur=100V), 2.0x Ur (Ur=200V/250V), 1.5x Ur (Ur=450/500/630V), 1.2x Ur (1KVUr2KV), 1.1x Ur (Ur>2KV). Voltage raising time: 110S, maintaining time: 2S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area 90%, Visual-No damage. Pre-heating: 80-120, 10-30s. Lead free solder, flux. Soldering temp: 2455, Time: 20.5s. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200, 102s. Soldering temp: 2655, Time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF. X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electrostatic capacity change rate: C/C10%. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. 5 cycles. Test after 242 hours at normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacity change: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | Visual: No visual damage. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacity change: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect. IR. Test involves soldering MLCC on PCB and applying force. Dimensions A, B, C provided for various sizes (0805 to 2220). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Embossed Plastic Taping | Details for tape size (A, B, C, D, E, F, G, H, J, T) provided for sizes 0805 to 1812. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Paper Tape Reel Packing | Details for paper size (W1, L1, D, C, B, P1, P2, P0, d, t) and dimensions (A, B, C, D, E, F, G, H, J, T) provided for sizes 1005, 0201, 0402, 0603, 0805, 1206. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reel Dimensions | 7REEL (1782.0), 13REEL (3302.0). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity | Paper T/R: 4000 pcs (0805, 0402), 3000 pcs (0603, 0805), 2000 pcs (1206). Plastic T/R: 3000 pcs (0805, 1206), 2000 pcs (1210, 1812), 1000 pcs (1812+), 800 pcs, 500 pcs. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Method | RReflow Soldering, WWave Soldering. Recommended methods provided for various sizes, temperature characteristics, rated voltage, and capacitance. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Temperature Profile | Preheating temperature difference T 150. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling concerns. Avoid sudden temperature changes during soldering to prevent cracks. Handle soldering irons carefully during manual soldering. Ensure optimum solder amount for reflow soldering.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
Get in touch with us
Leave a Message, we will call you back quickly!