Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 10uF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 50V 10uF X7R ±10% 1210 Ceramic Capacitors RoHS |
| Mfr. Part # | 1210X7R106K500NT |
| Package | 1210 |
| Model Number | 1210X7R106K500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 10uF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 50V 10uF X7R ±10% 1210 Ceramic Capacitors RoHS | Mfr. Part # | 1210X7R106K500NT |
| Package | 1210 | Model Number | 1210X7R106K500NT |
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
| Item | Description | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | ||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | 1. Dimension Code |
| |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | ||||
| Construction | Ceramic dielectric | - | |||
| Inner electrode | - | ||||
| Outer electrode | - | ||||
| Nickle layer | - | ||||
| Tin layer | - | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specifications and Testing Methods | 1. Temperature | -55~+125 | |||
| 2. Visual / Dimension | 1. No Damage, 2. Dimension meet Spec. Testing: Naked eye (Visual inspection), Digital caliper | ||||
| 3. Static Capacity | Meet standard specification and tolerance. Testing frequency and voltage vary by characteristic (NPO, X7R/X7T/X7P) and capacity. | ||||
| 4. Dissipation Factor (DF) | Specification varies by characteristic (NPO, X7R/X7T/X7P) and capacity. Testing frequency and voltage vary. | ||||
| 5. IR Insulation Resistance | Specification varies by characteristic (NPO, X7R/X7T/X7P) and capacity. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (Ur) depending on Ur value. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||||
| 7. Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| 9. Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. | ||||
| 10. Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||
| 11. Thermal Shock | Capacity change rate and DF specification vary by characteristic (NPO, X7R/X7P, X7T). Test after 5 cycles of thermal shock. | ||||
| 12. Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate, DF, and IR specifications vary by characteristic (NPO, X7R/X7T/X7P). Test conditions: 402, 90~95%RH, 50024 hours. | ||||
| 13. High Temperature Exposure | Visual: No visual damage. Capacity change rate, DF, and IR specifications vary by characteristic (NPO, X7R/X7T/X7P). Test conditions: 1253, 100048 hours, Voltage based on rated voltage. | ||||
| 14. PCB Flexural Strength | No crack and other defect. IR tested after soldering MLCC on PCB. Dimensions A, B, C provided for different sizes (0805 to 2220). | ||||
| Embossed Plastic Taping | Taping Specification | Dimensions A, B, C, D, E, F, G, H, J, T provided for sizes 0805 to 1812. | |||
| Reel Dimensions | 7' REEL (1782.0mm), 13' REEL (3302.0mm). | ||||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. | ||||
| Paper Tape Reel Packing | Taping Specification | Dimensions W1, L1, D, C, B, P1, P2, P0, d, t provided for sizes 1005, 0201, 0402, 0603, 0805, 1206. | |||
| Reel Dimensions | 7' REEL (1782.0mm), 13' REEL (3302.0mm). | ||||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. | ||||
| Packing Quantity | Quantities provided for Paper T/R and Plastic T/R for various sizes (e.g., 0603 Paper T/R: 4000 Pcs). | ||||
| Recommended Soldering Method | Methods (R-Reflow, W-Wave) specified for different sizes, temperature characteristics, rated voltage, and capacitance. | ||||
| Soldering Profile | Recommended soldering profiles for various sizes are available (refer to adjacent graph). Preheating temperature difference T 150. | ||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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