Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 510pF |
| Temperature Coefficient | C0G |
| Tolerance | ±5% |
| Description | 50V 510pF C0G ±5% 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603C0G511J500NT |
| Package | 0603 |
| Model Number | 0603C0G511J500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 510pF |
| Temperature Coefficient | C0G | Tolerance | ±5% |
| Description | 50V 510pF C0G ±5% 0603 Ceramic Capacitors RoHS | Mfr. Part # | 0603C0G511J500NT |
| Package | 0603 | Model Number | 0603C0G511J500NT |
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
| Item | Description/Specification | Testing Method | ||||
|---|---|---|---|---|---|---|
| 1. Application Field | ||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||
| 2. Testing Conditions | ||||||
| 2.1 Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||
| 2.2 Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||
| Item | Description | |||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||
| 7. Packing | T Tape/Reel, P Bag packing(PE) | |||||
| 4. Construction and Dimension | ||||||
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | |||||
| Dimension (mm) | Code | British system | Metric system | L | W | T | WB | |||||
| 0201 | 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 | 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 | 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 | 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 | 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 | 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 | 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 | 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 | 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 | 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 | 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| 5. Specification and Testing Method | ||||||
| Item | Specification/Requirement | Testing method | ||||
| Temperature | -55~+125 | |||||
| Visual/Dimension | 1, No Damage; 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||
| Static Capacity | Meet standard specification and tolerance | |||||
| NPO characteristic: 1000pF 1MHz10% 1.00.2Vrms; 1000 pF 1KHz10% 1.00.2Vrms | ||||||
| X7R/X7T/X7P characteristic: 10uF 1KHz10% 1.00.2Vrms; 10uF 120Hz24 0.50.1Vrms | ||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms | ||||
| X7R/X7T/X7P characteristic: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms | See Note 1 | |||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||
| X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | ||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||
| Note 1: X7R/X5R/X6S/X7S Y5V Rated vol. DF Exception | ||||||
| Refer to detailed table for DF exceptions based on rated voltage and capacitance. | ||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | DF Refer to NO#4, IR Refer to NO#5 | ||||
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452. | ||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||
| Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours normal temp & humidity. | ||||
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours normal temp & humidity. | ||||
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Charging and discharging current 50mA Max. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test after placing 48 hours under normal pressure & temperature. | ||||
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. IR test. | ||||
| 6. EMBOSSED PLASTIC TAPING | ||||||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | Refer to detailed table for dimensions (A, B, C, D, E, F, G, H, J, T) for codes 0805, 1206, 1210, 1808, 1812. | |||||
| 7. Paper tape reel packing | ||||||
| Paper tape reel packing for 10050402~12063216 | Refer to detailed table for dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for codes 1005, 0201, 0402. | |||||
| Paper tape reel packing for 0603, 0805, 1206 types | Refer to detailed table for dimensions (A, B, C, D, E, F, G, H, J, T) for codes 0603, 0805, 1206. | |||||
| 8. Taping specification | ||||||
| Top tape peeling strength | (a) Paper Taping Reel type: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||
| 9. Packing quantity | ||||||
| Refer to table for Paper T/R (Pcs) and Plastic T/R (Pcs) quantities based on size and thickness. | ||||||
| 10. Precautions For Use | ||||||
| Soldering Profile | Follow the temperature profile in the adjacent graph to avoid cracks due to sudden temperature change. | |||||
| Manual Soldering | Handle soldering iron carefully to avoid thermal cracks. Pay attention to soldering iron tip selection and temperature. | |||||
| Optimum Solder Amount for Reflow Soldering | ||||||
| Recommended Soldering Method | Refer to table for recommended soldering methods (R-Reflow, W-Wave) based on size, temperature characteristics, rated voltage, and capacitance. | |||||
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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