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Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R154K500NT suitable for AC DC

China Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R154K500NT suitable for AC DC

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Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R154K500NT suitable for AC DC

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Voltage Rating	50V
Capacitance	150nF
Temperature Coefficient	X7R
Tolerance	±10%
Description	50V 150nF X7R ±10% 0603 Ceramic Capacitors RoHS
Mfr. Part #	0603X7R154K500NT
Package	0603
Model Number	0603X7R154K500NT

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Product Details
Company Details

Product Specification


Voltage Rating	50V	Capacitance	150nF
Temperature Coefficient	X7R	Tolerance	±10%
Description	50V 150nF X7R ±10% 0603 Ceramic Capacitors RoHS	Mfr. Part #	0603X7R154K500NT
Package	0603	Model Number	0603X7R154K500NT

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.

Product Attributes

Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
Certifications: ROHS/REACH compliant

Technical Specifications

Part Number Description Example: 1812 X7R 684 M 251 N T

Item	Description
1. Dimension Code	0201 (0.02"x0.01" / 0.50x0.25mm) 0402 (0.04"x0.02" / 1.00x0.50mm) 0603 (0.06"x0.03" / 1.60x0.80mm) 0805 (0.08"x0.05" / 2.00x1.25mm) 1206 (0.12"x0.06" / 3.20x1.60mm) 1210 (0.12"x0.10" / 3.20x2.50mm) 1808 (0.18"x0.08" / 4.50x2.00mm) 1812 (0.18"x0.12" / 4.50x3.20mm) 1825 (0.18"x0.25" / 4.50x6.30mm) 2211 (0.22"x0.11" / 5.70x2.8mm) 2225 (0.22"x0.25" / 5.70x6.30mm)
2. Temperature Characteristic	C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity	e.g., 8R0=8.0pF, 100=10pF, 101=100pF
4. Tolerance of Electrostatic Capacity	B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC)	e.g., 250=25V, 251=250V, 252=2500V
6. Terminal Composition	Au/Ag-Ni-Sn (From the inside out)
7. Packing	T Tape/Reel, P Bag packing (PE)

Construction and Dimension

Item

Description

Construction

1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer

Dimension (mm)

Part number	British system	Metric system	L	W	T
0201	0603	0.600.10	0.300.05	0.300.05	0.100.05
0402	1005	1.000.15	0.500.15	0.500.10	0.200.10
0603	1608	1.600.20	0.800.15	0.800.15	0.300.10
0805	2012	2.000.20	1.250.20	0.800.20	1.000.20
1206	3216	3.200.30	1.600.30	1.000.20	1.250.20
1210	3225	3.200.30	2.500.30	2.70	0.800.30
1808	4520	4.500.40	2.000.20	2.70	0.800.30
1812	4532	4.500.40	3.200.30	3.50	0.800.30
1825	4563	4.500.40	6.300.50	3.50	0.800.30
2220	5750	5.700.50	5.000.50	3.50	1.000.40
2225	5763	5.700.50	6.300.50	6.20	1.000.40

Specification and Testing Method

No.	Item	Specification/Requirement	Testing method
1	Temperature	-55~+125
2	Visual/ Dimension	1. No Damage, 2. Dimension meet Spec	Naked eye (Visual inspection), Digital caliper
3	Static Capacity	Meet standard specification and tolerance	NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; 1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms; 10uF: 120Hz24, 0.50.1Vrms
4	Dissipation Factor (DF)	NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms. Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. X7R/X7T/X7P characteristic: see Note 1 Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms.
5	IR Insulation Resistance	NPO Characteristic: IR50000M, C10nF; IRCr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IRCr100S, C25nF Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA
6	Hi-pot (DC)	Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S
7	Solderability	Soldering area90%	Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
8	Resistance to the heat of soldering	Visual-No damage, soldering area90%	Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9	Flexural strength	No damage	Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural depth 452.
10	Terminal bonding strength	No visual damage	Applied Force: 5N, Duration: 101S
11	Thermal shock	NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P characteristic: C/C0.5% X7T characteristic: C/C10% Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
12	Temperature moisture exposure	Visual: No visual damage Electrost atic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10% DF: 2 times initial standard IR: NPO characteristic: IR2500M or IRCr25S (Lower reading); X7R/X7T/X7P: IR1000M or IRCr25S (Lower reading) Test it after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 500+24 hours.
13	High temperature exposure	Visual: No visual damage Electrost atic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IRCr40S (Lower reading); X7R/X7T/X7P: IR2000M or IRCr50S (Lower reading) Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage).
14	PCB flexural strength	No crack and other defect	IR Soldering the MLCC on the PCB. Then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6

Embossed Plastic Taping

Code	Tape size	A	B	C	D	E	F	G	H	J
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10	3.0 Max
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max

Paper Tape Reel Packing

Code	Paper size	W1	L1	D	C	B	P1	P2	P0	d
1005	0.240.02	0.450.02	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.30 Below
0201	0.370.10	0.670.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below
0402	0.650.10	1.150.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below

Code	Paper size	A	B	C	D	E	F	G	H	J
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max

Reel Dimensions

Unit: mm	A	B	C	D	E	F	G
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max

Packing Quantity

Dimension	Paper T/R (Pcs)	Plastic T/R (Pcs)
0603	4000
0805	4000	3000 (T1.35mm)
1206		3000 (T>1.35mm)
1210		2000 (T1.60mm)
1808		3000 (T>1.60mm)
1812		2000
1812		1000 (T1.85mm)
		1000 (T>1.85mm)
		800
		500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.

Soldering Profile: Follow the temperature profile to avoid cracks from sudden temperature changes.
Manual Soldering: Manual soldering carries a risk of creating thermal cracks. Handle soldering irons carefully, paying attention to tip selection and temperature contact.
Optimum Solder Amount for Reflow Soldering
Recommended Soldering amounts

Recommended Soldering Method

Size	Temperature Characteristics	Rated Voltage	Capacitance	Soldering Method
1005	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
0201	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0402	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0603	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C1uf	R
		/	C1uf	R/W
	Y5V	/	C1uf	R
		/	C1uf	R/W
0805	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C4.7uf	R
		/	C4.7uf	R/W
	Y5V	/	C1uf	R
		/	C1uf	R/W
1206	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C10uf	R
		/	C10uf	R/W
	Y5V	/	C10uf	R
		/	C10uf	R/W
1210	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

While preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X7R154K500NT_C49326619.pdf

Company Details

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Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...

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