Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 2.2pF |
| Temperature Coefficient | C0G |
| Description | 50V 2.2pF C0G 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603C0G2R2C500NT |
| Package | 0603 |
| Model Number | 0603C0G2R2C500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 2.2pF |
| Temperature Coefficient | C0G | Description | 50V 2.2pF C0G 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603C0G2R2C500NT | Package | 0603 |
| Model Number | 0603C0G2R2C500NT |
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs are available in medium and high voltage ratings.
| Item | Description | Specification/Requirement | Testing Method | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Description | Item | Description | Example | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | 1812 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | X7R | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | 684 (680000pF = 680nF) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | M (20%) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | 251 (250V) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimension (mm) |
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| Specification and Testing Method | Temperature | -55~+125 | Naked eye (Visual inspection), Digital calliper | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static Capacity | Meet standard specification and tolerance | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Refer to NO#3 for initial capacitance testing (Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | Visual: No visual damage Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | Visual: No visual damage Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on photo. IR measurement. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Embossed Plastic Taping |
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| Paper Tape Reel Packing |
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| Reel Dimensions |
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| Taping Specification | Top tape peeling strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity |
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| Precautions For Use: MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings, potentially leading to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Consult engineering for handling questions. Follow recommended soldering profiles and methods to avoid thermal cracks and ensure optimal performance. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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