Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 24pF |
| Temperature Coefficient | C0G |
| Tolerance | ±5% |
| Description | 50V 24pF C0G ±5% 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603C0G240J500NT |
| Package | 0603 |
| Model Number | 0603C0G240J500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 24pF |
| Temperature Coefficient | C0G | Tolerance | ±5% |
| Description | 50V 24pF C0G ±5% 0603 Ceramic Capacitors RoHS | Mfr. Part # | 0603C0G240J500NT |
| Package | 0603 | Model Number | 0603C0G240J500NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of dimensions and temperature characteristics, with options for different tolerances, rated voltages, and terminal compositions. They are offered in tape/reel or bag packing.
| Item | Description/Specification | Details |
|---|---|---|
| 1. Application Field | ||
| Primary Applications | Coupling, wave filtering, resonant in high voltage circuits | |
| Specific Devices | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |
| 2. Testing Conditions | ||
| Normal Condition | Temperature | 15~35 |
| Humidity | 45~75%RH | |
| Atmosphere | 86~106kPa | |
| Relative Condition | Temperature | 252 |
| Humidity | 60~70%RH | |
| Atmosphere | 86~106kPa | |
| 3. Part Number Description | ||
| Item 1 | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Dimensions (inch) | 0.02*0.01 to 0.22*0.25 | |
| Dimensions (mm) | 0.50*0.25 to 5.70*6.30 | |
| Item 2 | Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) |
| Item 3 | Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) |
| Item 4 | Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| Item 5 | Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) |
| Item 6 | Terminal Composition | Au/Ag-Ni-Sn (From the inside out) |
| Item 7 | Packing | T (Tape/Reel), P (Bag packing) |
| 4. Construction and Dimension | ||
| Construction Items | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimension (mm) | Part number | L W T WB |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | |
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | |
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | |
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | |
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | |
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | |
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | |
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | |
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | |
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | |
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | |
| 5. Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF) |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Run 5 cycles. Test after placing 242 hours at normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on diagram. |
| 6. Embossed Plastic Taping | ||
| Type | Tape size (mm) A B C D E F G H J T | |
| 0805 | 1.550.20 2.350.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.50 Max | |
| 1206 | 1.950.20 3.600.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.85 Max | |
| 1210 | 2.700.10 3.420.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.55 -0/+0.10 3.2 Max | |
| 1808 | 2.200.10 4.950.10 12.000.10 5.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.50 -0/+0.10 3.0 Max | |
| 1812 | 3.660.10 4.950.10 12.000.10 5.500.05 1.750.10 8.000.10 2.000.05 4.000.10 1.55 -0/+0.10 4.0 Max | |
| 6. Paper Tape Reel Packing | ||
| Code | Paper size (mm) W1 L1 D C B P1 P2 P0 d t | |
| 1005 | 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below | |
| 0201 | 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | |
| 0402 | 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | |
| 0603 | 1.100.10 1.900.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | |
| 0805 | 1.450.15 2.300.15 8.00.15 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | |
| 1206 | 1.800.20 3.400.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | |
| 7. Reel Dimensions | ||
| Unit: mm | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max |
| 8. Taping Specification | ||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| 9. Packing Quantity | ||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) |
| 1210 | - | 1000 (T1.85mm), 800 (T1.85mm) |
| 1812 | - | 500 |
| 10. Precautions For Use | ||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |
| Manual Soldering | Handle soldering iron carefully, pay attention to the selection of soldering iron tip and temperature contact. | |
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | |
| Soldering Temperature Profile | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips as T150. | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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