Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 5kV |
| Capacitance | 100pF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 100pF ±10% 5kV Ceramic Capacitor X7R 1808 |
| Mfr. Part # | 1808X7R101K502NT |
| Package | 1808 |
| Model Number | 1808X7R101K502NT |
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Product Specification
| Voltage Rating | 5kV | Capacitance | 100pF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 100pF ±10% 5kV Ceramic Capacitor X7R 1808 | Mfr. Part # | 1808X7R101K502NT |
| Package | 1808 | Model Number | 1808X7R101K502NT |
This product is a high-voltage Multi-Layer Ceramic Capacitor (MLCC) designed for applications such as coupling, wave filtering, and resonance in high-voltage circuits. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
| Item | Description/Specification | Testing Method | |
|---|---|---|---|
| Application Field | |||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||
| Testing Conditions | |||
| Normal Condition | Temperature: 15~35 Humidity: 45~75%RH Normal atmosphere: 86~106kPa | ||
| Relative Condition | Temperature: 252 Humidity: 60~70%RH Atmosphere: 86~106kPa | ||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||
| 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) 0402 (0.04*0.02 inch / 1.00*0.50 mm) 0603 (0.06*0.03 inch / 1.60*0.80 mm) 0805 (0.08*0.05 inch / 2.00*1.25 mm) 1206 (0.12*0.06 inch / 3.20*1.60 mm) 1210 (0.12*0.10 inch / 3.20*2.50 mm) 1808 (0.18*0.08 inch / 4.50*2.00 mm) 1812 (0.18*0.12 inch / 4.50*3.20 mm) 1825 (0.18*0.25 inch / 4.50*6.30 mm) 2211 (0.22*0.11 inch / 5.70*2.8 mm) 2225 (0.22*0.25 inch / 5.70*6.30 mm) | ||
| 2. Temperature Characteristic | C0G (030 PPM/) X7R (15%) X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | 8R0 = 8.0 pF 100 = 10 pF 101 = 100 pF | ||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||
| 5. Rated Voltage (DC) | 250 = 25V 251 = 250V 252 = 2500V | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| 7. Packing | T: Tape/Reel P: Bag packing (PE) | ||
| Construction and Dimension | |||
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | ||
| Dimension (mm) | Part number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.30 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.800.30 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 0.800.30 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 0.800.30 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 1.000.40 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.000.40 | ||
| Specification and Testing Method | |||
| Temperature | -55~+125 | ||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital calliper | |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF) | |
| IR Insulation Resistance | NPO: IR50000M (C10nF); IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V,...2.5 x rated voltage; Ur=200V/250V,...2.0 x rated voltage; Ur=450/500/630V,...1.5 x rated voltage; 1KVUr2KV,...1.2 x rated voltage; 2KVUr,...1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after place 242 hours normal temp & humidity. | |
| High Temperature Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage); 250VV1KV (1.5x rated voltage); 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. IR measurement. | |
| Embossed Plastic Taping Dimensions (mm) | |||
| Code | Tape size A, B, C, D, E, F, G, H, J, T | ||
| 0805 | 1.550.20, 2.350.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.50 Max | ||
| 1206 | 1.950.20, 3.600.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.1, 1.50 -0/+0.10, 1.85 Max | ||
| 1210 | 2.700.10, 3.420.10, 8.000.10, 3.500.05, 1.750.10, 4.000.10, 2.000.05, 4.000.10, 1.55 -0/+0.10, 3.2 Max | ||
| 1808 | 2.200.10, 4.950.10, 12.000.10, 5.500.05, 1.750.10, 4.000.10, 2.000.05, 4.000.10, 1.50 -0/+0.10, 3.0 Max | ||
| 1812 | 3.660.10, 4.950.10, 12.000.10, 5.500.05, 1.750.10, 8.000.10, 2.000.05, 4.000.10, 1.55 -0/+0.10, 4.0 Max | ||
| Paper Tape Reel Packing Dimensions (mm) | |||
| Code | Paper size W1, L1, D, C, B, P1, P2, P0, d, t | ||
| 1005 | 0.240.02, 0.450.02, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.30 Below | ||
| 0201 | 0.370.10, 0.670.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.80 Below | ||
| 0402 | 0.650.10, 1.150.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.80 Below | ||
| 0603 | 1.100.10, 1.900.10, 8.000.10, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max | ||
| 0805 | 1.450.15, 2.300.15, 8.00.15, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max | ||
| 1206 | 1.800.20, 3.400.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max | ||
| Reel Dimensions (mm) | |||
| Unit | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||
| Taping Specification | |||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping (b) Embossed Taping | |
| Packing Quantity | |||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |
| 0603 | 4000 | ||
| 0805 | 4000 | 3000 (T1.35mm) | |
| 1206 | 3000 (T>1.35mm) | ||
| 1210 | 2000 (T1.60mm) | ||
| 1808 | 3000 (T>1.60mm) | ||
| 1812 | 2000 | ||
| 1812 above | 1000 (T1.85mm) | ||
| 1000 (T>1.85mm) | |||
| 800 | |||
| 500 | |||
| Recommended Soldering Method | |||
| Size | Temperature Characteristics | Capacitance | Soldering Method |
| 1005 | NPO / X7R/X5R/X7S/X6S | / | R |
| 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / | R |
| 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / | R |
| 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / C1uf R / C1uf R/W | R/W |
| 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / C4.7uf R / C4.7uf R/W (X7R/X5R/X7S/X6S) / C1uf R / C1uf R/W (Y5V) | R/W |
| 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / C10uf R / C10uf R/W | R/W |
| 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / | R |
Note: RReflow Soldering, WWave Soldering
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.
Soldering Temperature Profile: Keep the temperature difference between soldering temperature and chip surface temperature T 150 during preheating.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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