| Voltage Rating | 50V |
| Capacitance | 8.2pF |
| Temperature Coefficient | C0G |
| Description | 50V 8.2pF C0G 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603C0G8R2C500NT |
| Package | 0603 |
| Model Number | 0603C0G8R2C500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 8.2pF |
| Temperature Coefficient | C0G | Description | 50V 8.2pF C0G 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603C0G8R2C500NT | Package | 0603 |
| Model Number | 0603C0G8R2C500NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.
| Item | Description/Specification | Testing Method | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Description Example | 1812 X7R 684 M 251 N T | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimension Codes & Sizes (L*W) |
| - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Characteristic Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Tolerance of Electrostatic Capacity Codes | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Rated Voltage (DC) Codes | 250 (25V), 251 (250V), 252 (2500V) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Codes | T (Tape/Reel), P (Bag packing) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimensions (mm) |
| Digital Caliper | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Range | -55~+125 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static Capacity Test |
| - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) |
| - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Insulation Resistance (IR) |
| Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) |
| Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate |
| Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock |
| Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure |
| Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure |
| Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on provided diagrams. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Embossed Plastic Taping Dimensions (mm) |
| - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Paper Tape Reel Packing Dimensions (mm) |
| - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reel Dimensions (mm) | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity |
| - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering | See detailed table in original document for specific size/characteristic combinations. |
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling questions.
Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and chip surface temperature T 150.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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