Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 5.1nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 50V 5.1nF X7R ±10% 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603X7R512K500NT |
| Package | 0603 |
| Model Number | 0603X7R512K500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 5.1nF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 50V 5.1nF X7R ±10% 0603 Ceramic Capacitors RoHS | Mfr. Part # | 0603X7R512K500NT |
| Package | 0603 | Model Number | 0603X7R512K500NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, with options for different tolerances, rated voltages, and terminal compositions. They are manufactured to meet RoHS and REACH compliance standards.
| Item | Description / Specification | Testing Method / Condition | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) | ||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | ||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See page 1 for L*W (inch/mm) | ||||||||
| 2. Temperature Characteristic | C0G, X7R, X5R | See page 1 | ||||||||
| 3. Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | See page 1 | ||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | See page 1 | ||||||||
| 5. Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | See page 1 | ||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn | (From the inside out) | ||||||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | See page 1 | ||||||||
| Construction | ||||||||||
| 1. Ceramic dielectric | ||||||||||
| 2. Inner electrode | ||||||||||
| 3. Outer electrode | ||||||||||
| 4. Nickle layer | ||||||||||
| 5. Tin layer | ||||||||||
| Dimension (mm) | ||||||||||
| Part number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | ||||||||||
| 1. Temperature | -55~+125 | |||||||||
| 2. Visual/ Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| 3. Static Capacity | Meet standard specification and tolerance | See page 3 for NPO and X7R/X7T/X7P characteristics, frequency, and voltage | ||||||||
| 4. Dissipation Factor (DF) | See page 3 for NPO and X7R/X7T/X7P characteristics, frequency, and voltage | See page 3 | ||||||||
| 5. IR Insulation Resistance | NPO: 50000M or IR*Cr500S (C>10nF). X7R/X7T/X7P: 10000M or IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage | See page 3 for voltage multiplier based on Ur | ||||||||
| 7. Solderability | Soldering area 90% | Pre-heating 80-120 (10-30s), Lead free solder, flux, Soldering temp 2455 (20.5s) | ||||||||
| 8. Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating 100-200 (102s), Soldering temp 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | ||||||||
| 9. Flexural Strength | No damage. Electrostatic capacity change rate: C/C10% | Base board: Al2O3 /PCB, Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. | ||||||||
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| 11. Thermal Shock | See page 6 for capacity change rate based on characteristic. | Pre-condition (X7R h characteristic): Upper limit temp 1hr, place 241 hrs, start testing. Run 5 cycles. Test after 242hrs normal temp & humidity. | ||||||||
| 12. Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: See page 6. DF: 2 times initial standard. IR: See page 6. | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242hrs normal temp & humidity. | ||||||||
| 13. High Temperature Exposure | Visual: No visual damage. Capacity change rate: See page 6. DF: 2 X initial standard. IR: See page 6. | Temperature: 1253, Time: 100048 hours. Voltage: See page 6. Test after 48hrs normal pressure & temperature. | ||||||||
| 14. PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on photo. See page 7 for dimensions A, B, C for various sizes. | ||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Unit | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||
| Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T>1.35mm) | ||||||||
| 1210 | - | 2000 (T1.60mm) | ||||||||
| 1808 | - | 3000 (T>1.60mm) | ||||||||
| 1812 | - | 2000 | ||||||||
| 1812 | - | 1000 (T1.85mm) | ||||||||
| 800 (T>1.85mm) | ||||||||||
| 500 | ||||||||||
| Precautions For Use | ||||||||||
| Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |||||||||
| Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |||||||||
| Optimum Solder Amount for Reflow Soldering | ||||||||||
| Recommended Soldering Amounts | ||||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Capacitance | Soldering Method | |||||||
| 1005 | NPO / X7R/X5R/X7S/X6S | / | R | |||||||
| 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / | R | |||||||
| 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / | R | |||||||
| 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / C1uf (X7R/X5R/X7S/X6S, Y5V) | R/W (NPO), R (X7R/X5R/X7S/X6S, Y5V C1uf), R/W (X7R/X5R/X7S/X6S, Y5V C1uf) | |||||||
| 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / C4.7uf (X7R/X5R/X7S/X6S), C1uf (Y5V) | R/W (NPO), R (X7R/X5R/X7S/X6S C4.7uf), R/W (X7R/X5R/X7S/X6S C4.7uf), R (Y5V C1uf), R/W (Y5V C1uf) | |||||||
| 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / C10uf (X7R/X5R/X7S/X6S, Y5V) | R/W (NPO), R (X7R/X5R/X7S/X6S C10uf), R/W (X7R/X5R/X7S/X6S C10uf), R (Y5V C10uf), R/W (Y5V C10uf) | |||||||
| 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / | R (NPO), R (X7R/X5R/X7S/X6S), R (Y5V) | |||||||
| Soldering Method Key: RReflow Soldering, WWave Soldering | ||||||||||
| Soldering Temperature Profile | ||||||||||
| Preheating temperature difference (Soldering temp - Surface temp of chips) | T 150 | |||||||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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