Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 63V |
| Capacitance | 4.7uF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 63V 4.7uF X7R ±10% 1210 Ceramic Capacitors RoHS |
| Mfr. Part # | 1210X7R475K630NT |
| Package | 1210 |
| Model Number | 1210X7R475K630NT |
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Product Specification
| Voltage Rating | 63V | Capacitance | 4.7uF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 63V 4.7uF X7R ±10% 1210 Ceramic Capacitors RoHS | Mfr. Part # | 1210X7R475K630NT |
| Package | 1210 | Model Number | 1210X7R475K630NT |
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | |||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||
| 2. Testing Conditions | |||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | |||
| Item | Description | Code/Value | |
| 1 | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | (See Page 1 for L*W in inches and mm) |
| 2 | Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3 | Nominal Electrostatic Capacity | (pF) | 8R0=8.0, 100=10, 101=100 |
| 4 | Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5 | Rated Voltage (DC) | (V) | 250=25, 251=250, 252=2500 |
| 6 | Terminal Composition | Au/Ag-Ni-Sn | |
| 7 | Packing | T: Tape/Reel, P: Bag packing (PE) | |
| 4. Construction and Dimension | |||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | ||
| Dimension (mm) | (See Page 2 for detailed dimensions for each size code) | ||
| 5. Specification and Testing Method | |||
| 1 | Temperature | -55~+125 | |
| 2 | Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| 3 | Static Capacity | Meet standard specification and tolerance | (See Page 3 for NPO and X7R/X7T/X7P characteristics, frequency, and voltage) |
| 4 | Dissipation Factor (DF) | (See Page 3 for NPO and X7R/X7T/X7P characteristics, frequency, and voltage) | |
| 5 | IR Insulation Resistance | (See Page 3 for NPO and X7R/X7T/X7P characteristics, testing conditions) | |
| 6 | Hi-pot (DC) | No dielectric breakdown or damage | (See Page 3 for voltage ratings and test conditions) |
| 7 | Solderability | Soldering area 90% | (See Page 5 for pre-heating, solder, and cleaning conditions) |
| 8 | Resistance to the heat of soldering | No visual damage, soldering area 90% | (See Page 5 for pre-heating, solder, cleaning, and exposure conditions) |
| 9 | Flexural Strength | (See Page 5 for test conditions and electrostatic capacity change rate) | |
| 10 | Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11 | Thermal Shock | (See Page 6 for NPO, X7R/X7P, X7T characteristics and test cycles) | |
| 12 | Temperature Moisture Exposure | (See Page 6 for test conditions, electrostatic capacitance change rate, DF, and IR) | |
| 13 | High Temperature Exposure | (See Page 6 for test conditions, electrostatic capacitance change rate, DF, and IR) | |
| 14 | PCB Flexural Strength | No crack and other defect | (See Page 7 for test conditions and IR) |
| 6. Embossed Plastic Taping | |||
| Embossed Tape Reel Packing | (See Page 8 for dimensions for 0805 to 1812 types) | ||
| 7. Paper Tape Reel Packing | |||
| Paper Tape Reel Packing | (See Page 9 for dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types) | ||
| 8. Packing Quantity | |||
| Packing Quantity | (See Page 11 for Paper T/R and Plastic T/R quantities by size) | ||
| 9. Precautions For Use | |||
| Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | ||
| Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature contact. | ||
| Recommended Soldering Method | (See Page 13 for size, temperature characteristics, rated voltage, capacitance, and soldering method R/W) | ||
| Soldering Temperature Profile | Keep temperature difference T 150 between soldering temperature and surface temperature of chips during preheating. | ||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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