| Voltage Rating | 2kV |
| Capacitance | 2.7nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 2.7nF ±10% 2kV Ceramic Capacitor X7R 1206 |
| Mfr. Part # | 1206X7R272K202NT |
| Package | 1206 |
| Model Number | 1206X7R272K202NT |
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Product Specification
| Voltage Rating | 2kV | Capacitance | 2.7nF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 2.7nF ±10% 2kV Ceramic Capacitor X7R 1206 | Mfr. Part # | 1206X7R272K202NT |
| Package | 1206 | Model Number | 1206X7R272K202NT |
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Function | Coupling, wave filtering, resonant | |
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Type | Medium and High voltage MLCC | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Terminal Composition | Au/Ag-Ni-Sn | |
| Packing Options | Tape/Reel (T), Bag packing (P) | |
| Dimensions (British System / Metric System) | 0201 / 0603 | L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25 |
| 0402 / 1005 | L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50 | |
| 0603 / 1608 | L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80 | |
| 0805 / 2012 | L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25 | |
| 1206 / 3216 | L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60 | |
| 1210 / 3225 | L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50 | |
| 1808 / 4520 | L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00 | |
| 1812 / 4532 | L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20 | |
| 1825 / 4563 | L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30 | |
| 2211 / 5728 | L*W (inch): 0.22*0.11, L*W (mm): 5.70*2.8 | |
| 2220 / 5750 | L*W (inch): 0.22*0.20, L*W (mm): 5.70*5.00 | |
| 2225 / 5763 | L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30 | |
| Testing Conditions | Normal | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Specifications & Testing Methods | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec | |
| Static Capacity | Meets standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | |
| Dissipation Factor (DF) | Refer to specification for NPO and X7R/X7T/X7P characteristics | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur). | |
| Solderability | Soldering area 90%. Pre-heating: 80-120 (10-30s), Solder temp: 2455 (20.5s) | |
| Resistance to the heat of soldering | No damage, soldering area 90%. Pre-heating: 100-200 (102s), Solder temp: 2655 (51s). Cleaning and testing after 242 hours at room temperature. | |
| Electrostatic Capacity Change Rate | Varies by characteristic (NPO, X7R, X7T, X7P). | |
| Flexural Strength | No damage. Electrostatic capacity change rate 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N (101S). | |
| Thermal Shock | Capacity change rate and DF/IR values within specified limits based on characteristic (NPO, X7R/X7P, X7T). 5 cycles. | |
| Temperature Moisture Exposure | No visual damage. Capacity change rate, DF, and IR within specified limits based on characteristic. Tested at 402, 90~95%RH for 50024 hours. | |
| High Temperature Exposure | No visual damage. Capacity change rate, DF, and IR within specified limits based on characteristic. Tested at 1253 for 100048 hours with specified voltage. | |
| PCB Flexural Strength | No crack and other defect. | |
| Embossed Plastic Taping Dimensions | Details provided for 0805 to 1812 types (Tape size, A, B, C, D, E, F, G, H, J, T). | |
| Paper Tape Reel Packing Dimensions | Details provided for 1005, 0201, 0402, 0603, 0805, 1206 types (Paper size, W1, L1, D, C, B, P1, P2, P0, d, t). | |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0). | |
| Top Tape Peeling Strength | Paper Taping: Standard values. Embossed Taping: 0.1N < peeling strength < 0.7N. | |
| Packing Quantity | Varies by size and tape type (Paper T/R, Plastic T/R). | |
| Soldering Method Recommendations | RReflow Soldering, WWave Soldering. Recommended based on size, characteristics, rated voltage, and capacitance. | |
| Soldering Temperature Profile | Preheating temperature difference T 150. | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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