Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 35V |
| Capacitance | 10uF |
| Temperature Coefficient | X6S |
| Tolerance | ±10% |
| Description | 35V 10uF X6S ±10% 0805 Ceramic Capacitors RoHS |
| Mfr. Part # | 0805X6S106K350NT |
| Package | 0805 |
| Model Number | 0805X6S106K350NT |
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Product Specification
| Voltage Rating | 35V | Capacitance | 10uF |
| Temperature Coefficient | X6S | Tolerance | ±10% |
| Description | 35V 10uF X6S ±10% 0805 Ceramic Capacitors RoHS | Mfr. Part # | 0805X6S106K350NT |
| Package | 0805 | Model Number | 0805X6S106K350NT |
This specification sheet applies to high-voltage chip ceramic capacitors (MLCC type) used for coupling, filtering, and resonance in high-voltage electronic circuits. Applications include switching power supplies, AC-DC power converters, DC-DC power converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts.
| Item | Specification | Test Method |
|---|---|---|
| Application Range | High-voltage electronic circuits for coupling, filtering, resonance. Applications include switching power supplies, AC-DC power converters, DC-DC power converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts. | - |
| Standard Conditions | Normal Temperature: 15~35 Normal Humidity: 45~75%RH Normal Pressure: 86~106kPa | - |
| Standard Relative Conditions | Normal Temperature: 252 Normal Humidity: 60~70%RH Normal Pressure: 86~106kPa | Used when there is doubt or special requirements for measurements under standard conditions. |
| Product Code Structure | Example: 0805 X6S 105 K 160 N T Product Size Code Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage (DC) Terminal Material Packaging Method | - |
| Product Structure | Ceramic Dielectric Internal Electrode External Electrode Nickel Layer Tin Layer | - |
| Product Dimensions (0805 / 2012) | L: 2.000.20 mm (0.080.01 inch) W: 1.250.20 mm (0.050.01 inch) T: 0.800.20 mm (0.030.01 inch) WB: 1.000.20 mm (0.040.01 inch) | - |
| Operating Temperature Range | -55~+105 | Visual inspection of appearance. Caliper measurement of dimensions. |
| Appearance and Dimensions | 1. No visible damage. 2. Dimensions meet specification requirements. | Visual inspection of appearance. Caliper measurement of dimensions. |
| Capacitance | Within specified tolerance. NPO Characteristics: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X5R Characteristics: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF Value) | NPO Characteristics: DF0.56% (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X5R/X6S/X7S/Y5V Characteristics: See Note 1. Measurements at 110%MHz, 1V0.2rms for Cr1000pF; 110%KHz, 1V0.2rms for Cr1000pF (NPO). Measurements at 110%KHz, 1V0.1rms for Cr10uF; 12024Hz, 0.5V0.1rms for Cr10uF (X7R/X5R/X6S/X7S/Y5V). | - |
| Insulation Resistance | NPO Characteristics: IR50000M (C10nF); IR*Cr500S (C10nF) X7R/X6S/X5R Characteristics: IR10000M (C25nF); IR*Cr100S (C25nF) Test voltage: 500V (Rated voltage 500V); Rated voltage (Rated voltage 500V). Test time: 605 sec. Test humidity: 75%. Test temperature: 255. Test charge/discharge current: 50mA. | - |
| Dielectric Strength (DC) | No dielectric breakdown or damage. 2.5x Rated Voltage (Ur=100V) 2.0x Rated Voltage (Ur=200V/250V) 1.5x Rated Voltage (Ur=450/500/630V) 1.2x Rated Voltage (1KVUr2KV) 1.1x Rated Voltage (2KVUr) Ramp time: 1-10S. Holding time: 2S. | - |
| Solderability | >90% tinning rate. No visible damage. Preheat at 80-120 for 10-30 seconds. Lead-free solder, flux used. Solder temperature: 2455. Soldering time: 20.5 seconds. | - |
| Soldering Heat Resistance | No visible damage, >90% tinning rate. Preheat at 100-200 for 102 seconds. Immersion temperature: 2605. Immersion time: 51 seconds. Clean with solvent. Room temperature, holding time: 242 hours. | - |
| Capacitance Change Rate (Soldering Heat Resistance) | NPO: |C/C|0.5% or 0.5pF (take the larger value) X7R: |C/C|15% X7T: -33% C/C22% X6S: |C/C|22% | - |
| DF Value (Soldering Heat Resistance) | See Item No. 4 | - |
| IR (Soldering Heat Resistance) | See Item No. 5 | - |
| Bending Strength | No visible damage. Test substrate: Al2O3 or PCB. PCB dimensions: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Bending depth: 1mm. Loading speed: 0.5mm/sec. Measurements are taken in a bent state. | - |
| Capacitance Change Rate (Bending Strength) | |C/C|10% | - |
| Terminal Bond Strength | No visible damage. | - |
| Temperature Cycling | NPO: |C/C|2.5% or 0.25pF (take the larger value) X7R/X5R: |C/C|7.5% X6S: |C/C|10% Pre-treatment (X7R characteristics): Upper temperature for 1 hour, hold for 241 hours, initial measurement. 5 temperature cycles. Hold for 242 hours at room temperature and humidity before testing. Steps: Lower temp (303 min), Room temp (2-3 min), Upper temp (303 min), Room temp (2-3 min). | - |
| Humidity Resistance | No visible damage. Hold for 24 hours at room temperature and humidity after test. Temperature: 402. Humidity: 90~95%RH. Time: 50024 hours. | - |
| Capacitance Change Rate (Humidity Resistance) | NPO: |C/C|2% or 1pF (take the larger value) X7R/X6S/X5R: |C/C|10% | - |
| DF Value (Humidity Resistance) | 2 times the initial standard. | - |
| IR (Humidity Resistance) | NPO: IR2500M or IR*Cr25S (take the smaller value) X7R/X6S/X5R: IR1000M or IR*Cr25S (take the smaller value) | - |
| High Temperature Load Test | No visible damage. Hold for 484 hours at room temperature and humidity before testing. Temperature: 853. Time: 100048 hours. Voltage: 2x Rated Voltage (100VV250V); 1.5x Rated Voltage (250VV1KV); 1.2x Rated Voltage (1KVV). Charge/discharge current limited to below 50mA. | - |
| Capacitance Change Rate (High Temp Load) | NPO: |C/C|2% or 1pF (take the larger value) X7R/X6S/X5R: |C/C|20% | - |
| DF Value (High Temp Load) | 2 times the initial standard. | - |
| IR (High Temp Load) | NPO: IR4000M or IR*Cr40S (take the smaller value) X7R/X6S/X5R: IR2000M or IR*Cr50S (take the smaller value) | - |
| Circuit Board Bending Performance | No cracks or other defects. Capacitors soldered to fixture (glass-epoxy resin) using mixed solder. Force applied as shown in Figure 2 after soldering. Soldering should be done by reflow to avoid uneven soldering and thermal shock. | - |
| Packaging Options | T: Tape packaging P: Bulk packaging (PE bag) | - |
| Packaging Dimensions (Tape & Reel) | See pages 8-10 for detailed dimensions for various product sizes (0805 to 1812 for plastic reel, 0201 to 1206 for paper tape). | - |
| Packaging Quantity | 0805: 3000 pcs (Tape) 1206: 3000 pcs (Tape) 1210: 2000 pcs (Tape, T1.35mm), 3000 pcs (Tape, T>1.35mm) 1808: 2000 pcs (Tape, T1.60mm) 1812: 3000 pcs (Tape, T>1.60mm), 2000 pcs (Tape, T1.85mm), 1000 pcs (Tape, T>1.85mm) 1812 and above: 800 pcs, 500 pcs | - |
Note 1: Refer to page 6 for detailed DF exceptions for X7R/X5R/X6S/X7S/Y5V characteristics across various rated voltages and capacitance values.
Note: Initial measurement of capacitance for items NO3, 11, 12, 13: Pre-heat at 150 for 1 hour, then condition at room temperature and humidity for 48 hours before testing.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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