Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 330nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 330nF ±10% 50V Ceramic Capacitor X7R 0603 |
| Mfr. Part # | TCC0603X7R334K500CT |
| Package | 0603 |
| Model Number | TCC0603X7R334K500CT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 330nF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 330nF ±10% 50V Ceramic Capacitor X7R 0603 | Mfr. Part # | TCC0603X7R334K500CT |
| Package | 0603 | Model Number | TCC0603X7R334K500CT |
This document specifies Multi-Layer Ceramic Capacitors (MLCCs) from the general series. It details product classifications, structure, part numbering system, capacitance range, dimensions, technical requirements, testing conditions, packaging, and usage precautions.
| Document No. | Document Name | Version | Change Date | Pages | Content of Change | Registrant |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | B/0 | 2012/01/11 | 38 | New Set | Qianjun Fang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | B/1 | 2012/08/11 | 36 | Added the carrier tape dimension of 2225 and 1808 sizes | Binbin Wang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | C/0 | 2013/01/10 | 39 | Version Change | Binbin Wang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | D/0 | 2014/01/06 | 39 | Updated the SGS Report | Binbin Wang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | E/0 | 2014/05/06 | 44 | Version Change | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | F/0 | 2015/02/10 | 44 | Version Change | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | G/0 | 2016/05/15 | 44 | Version Change | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | H/0 | 2017/07/01 | 44 | Version Change | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | I/0 | 2020/02/12 | 44 | Version Change | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | J/0 | 2021/01/07 | 39 | Add 0201 size and X6S/X7T dielectrics; deleted dimensions above 1210 size | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | J/1 | 2021/03/25 | 39 | Added the specification model of 0201 size and COG dimension | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | K/0 | 2022/03/18 | 39 | Version Change | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | K/1 | 2022/06/28 | 41 | Version Change | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | K/2 | 2022/08/29 | 59 | Updated the range of capacitance | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | K/3 | 2022/11/28 | 59 | Added requirements of the RoHS, REACH and HF | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | L/0 | 2023/1/16 | 59 | Version Change | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | L/1 | 2023-02-01 | 57 | Update capacity | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | L/2 | 2023-02-24 | 57 | Update 0105 capacity | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | L/3 | 2023-05-13 | 54 | Update capacity, increase the tolerance range of crest welding and reflow welding, and add the introduction of standard remarks | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | M/0 | 2023-09-15 | 61 | Update capacity, Shenzhen base address and medium box package size | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | M/1 | 2023-12-08 | 53 | Update capacity, Belt size | Guoxin Zhang |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | M/2 | 2024-04-11 | 54 | Update capacity | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | M/3 | 2024-08-05 | 54 | Update capacity | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | M/4 | 2024-09-25 | 55 | Update capacity, Dimensions of Reel, Matters needing attention | Jiarui Chen |
| DRAAW108N/0 | Specification for Multilayer Ceramic Chip Set | N/0 | 2025-01-16 | 55 | Update capacity, Belt size | Jiarui Chen |
| Catalog | Details |
| 1. Types of Capacitor and Dielectric Material | COG (or NPO): Class capacitor, stable electrical properties, little change with temperature, voltage, and time. Suited for low-loss, high-stability circuits (filters, oscillators, timing circuits). X7R, X7S, X7T, X6R, X6S, X6T, X5R: Class capacitor, high dielectric constant, higher capacitance than Class . Semi-stable temperature characteristic, used over a wide temperature range (DC-blocking, decoupling, bypassing, frequency discriminating). |
| 2. Product Structure | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer |
| 3. General Product Parts Numbering System | Example: TCC 0805 X5R 105 M 500 F T Attention: Recommended operating temperature drop limit < 20, operating voltage drop limit > 30%. Codes: Ceramic Capacitor Code, Chip Size (e.g., 0105=0.400.20mm, 0201=0.600.30mm, 0402=1.000.50mm, 0603=1.600.80mm, 0805=2.001.25mm, 1206=3.201.60mm, 1210=3.202.50mm, 1812=4.503.20mm, 2220=5.705.00mm), Capacitance (e.g., 105=1010^5 pF), Temperature Characteristic (COG, X7R, X7S, X7T, X6R, X6S, X6T, X5R), Capacitance Tolerance (A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1.0%, G=2.0%, J=5.0%, K=10%, M=20%, Z=-20/+80%), Thickness (Y:0.20mm, A:0.50mm, B:0.60mm, C:0.80mm, D:0.85mm, E:1.00mm, F:1.25mm, H:1.60mm, G:2.00mm, M:2.50mm, Z:0.30mm), Rated Voltage (e.g., 2R5=2.5VDC, 4R0=4.0VDC, 6R3=6.3VDC, 100=10VDC, 160=16VDC, 250=25VDC, 350=35VDC, 500=50VDC, 101=100VDC, 201=200VDC, 251=250VDC, 501=500VDC, 631=630VDC, 102=1000VDC, 202=2000VDC), Packing (B: bulk packaging in a bag, T: tape carrier Packaging of small reel, W: tape carrier Packaging of big reel). |
| Dielectrics Characteristic Group of Product | Material: COG (NPO), X7R, X7S, X7T, X6R, X6S, X6T, X5R Operating Temperature Range: -55~+125 (COG, X7R, X7S, X7T), -55~+105 (X6R, X6S, X6T), -55~+85 (X5R) Temperature Characteristic: 030ppm/ (COG), 15% (X7R, X5R), 22% (X7S, X6S), +22/-33% (X7T, X6T) |
| 4. Product Capacitance Range (0105/0402 Size) | Capacitance values (Cp/VDC) for COG, X7R, X6T, X5R series are available across various voltage ratings (50, 35, 25, 16, 10, 6.3 VDC). Specific values like 0R1, 0R2... 3R6 are listed with 'Y' indicating availability. (Above capacitance for reference only, actual capacitance range depends on the use requirement.) |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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