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Beijing Silk Road Enterprise Management Services Co., Ltd.

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China Multilayer Chip Ceramic Capacitor CCTC TCC1206X7R104K501HT X7R Dielectric 104
China Multilayer Chip Ceramic Capacitor CCTC TCC1206X7R104K501HT X7R Dielectric 104

  1. China Multilayer Chip Ceramic Capacitor CCTC TCC1206X7R104K501HT X7R Dielectric 104

Multilayer Chip Ceramic Capacitor CCTC TCC1206X7R104K501HT X7R Dielectric 104

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Voltage Rating 500V
Capacitance 100nF
Temperature Coefficient X7R
Tolerance ±10%
Description 100nF ±10% 500V Ceramic Capacitor X7R 1206
Mfr. Part # TCC1206X7R104K501HT
Package 1206
Model Number TCC1206X7R104K501HT

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Product Specification

Voltage Rating 500V Capacitance 100nF
Temperature Coefficient X7R Tolerance ±10%
Description 100nF ±10% 500V Ceramic Capacitor X7R 1206 Mfr. Part # TCC1206X7R104K501HT
Package 1206 Model Number TCC1206X7R104K501HT

Product Overview

The TCC1206X7R104K501HT is a Multilayer Chip Ceramic Capacitor (MLCC) with X7R dielectric material. X7R is a Class II dielectric, offering a higher capacitance compared to Class I dielectrics and stable temperature characteristics. This capacitor is suitable for applications requiring a wide capacitance range and less stringent stability requirements, such as DC-blocking, decoupling, bypassing, and frequency discriminating circuits.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Ceramic Dielectric, Nickel Layer, Tin Layer
  • Color: Not specified
  • Certifications: RoHS, REACH, Halogen-free (implied by revision history)

Technical Specifications

SpecificationDetailsTesting Condition
Product NameMultilayer Chip Ceramic Capacitor
Part NumberTCC1206X7R104K501HT
Approval Sheet No.DRAAW108M/1-2023
Dielectric MaterialX7R (Class II)
Capacitance104 (0.10F)Within specified tolerance
Capacitance Tolerance10%
Rated Voltage500VDC
Temperature Characteristic15% (-55 to +125)Capacitance change within 15% from -55 to +125, compared to 25 value.
Dimensions (L x W x T)3.20mm x 1.60mm x 1.60mm
AppearanceVisual inspection
Dissipation Factor (DF)7.0%1.00.2Vrms, 1KHz10% @ 253, <70%RH. (Requires aging treatment for Class II)
Insulation Resistance (IR)1GTest voltage: 400V; Charge time: 605 sec; Temperature: 25
Dielectric Strength750VDC for 5 seconds (Max. current 50mA)
AdhesionNo removal of terminations or other defects.Pressurizing force: 6N, Duration: 101 sec.
Solderability of Termination95% min. coverage of both terminal electrodes, <5% pin holes or rough spots. No remarkable visual damage.Solder temperature: 2455, Dipping time: 21 sec. (Preheated: 120~150/60sec)
Resistance to Leaching95% min. coverage of both terminal electrodes, <5% pin holes or rough spots. No remarkable visual damage.Solder temperature: 2705, Dipping time: 101 sec.
BendingNo remarkable visual damage; Capacitance change 10%.Capacitor mounted on test jig, bent 1mm at 1.0mm/s.
Resistance to Soldering HeatNo remarkable visual damage, Cp change within 7.5%, DF and IR meet initial standard value.Soldering temperature: 2705, Preheating: 120~150/60sec, Dipping time: 101 sec. (Measurement after 484 hrs recovery, with aging treatment for high dielectric constant type)
Temperature CycleNo remarkable visual damage, Cp change within 7.5%.5 cycles: -55 (30min) -> 25 (2-3min) -> +125 (30min) -> 25 (2-3min). (Measurement after 484 hrs recovery, with aging treatment for high dielectric constant type)
Moisture Resistance (Steady State)No remarkable visual damage, Cp change within 12.5%, DF 2x initial value, IR 100M.402, 90~95% RH, 500 12hrs. (Measurement after 484 hrs recovery, with aging treatment for high dielectric constant type)
Damp Heat with LoadNo remarkable visual damage, Cp change 12.5%, DF 2x initial value, IR 50M.402, 90~95% RH, 100% rated voltage, 50mA max current, 500 12hrs. (Measurement after 48h recovery at room temp after 1h at 150, with initial measurement after soldering and 48h recovery)
Life TestNo remarkable visual damage, Cp change 12.5%, DF 2x initial value, IR 50M.Max. Operating Temp. 3, 100% rated voltage, 50mA max current, 1000 hrs. (Measurement after 48h recovery at room temp after 1h at 150, with initial measurement after soldering and 48h recovery)
Packing (Tape Packing)Dimensions of Packing Paper Type A, B, C, D, TSpecific dimensions vary by chip size (e.g., 1206: 2.000.04 L, 1.600.15 W, 1.1max T)

2410121439_CCTC-TCC1206X7R104K501HT_C5448934.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    >>300

  • Ecer Certification:

    Verified Supplier

Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...

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  • Beijing Silk Road Enterprise Management Services Co., Ltd.
  • 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
  • https://www.icpassive.com/

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