Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 220nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 220nF ±10% 50V Ceramic Capacitor X7R 0805 |
| Mfr. Part # | 0805X7R224K500NT |
| Package | 0805 |
| Model Number | 0805X7R224K500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 220nF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 220nF ±10% 50V Ceramic Capacitor X7R 0805 | Mfr. Part # | 0805X7R224K500NT |
| Package | 0805 | Model Number | 0805X7R224K500NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, ensuring reliable performance across different operational demands.
| Item | Description | Specification/Requirement | Testing Method | |||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, such as switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||||||||||||||||||||||||||||||||||||
| Testing Condition: Normal condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||||||||||||||||||||||||||||||
| 2. Part Number Description | Example: 1812 X7R 684 M 251 N T Item Descriptions: Dimension Code (e.g., 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225) Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) (V) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | |||||||||||||||||||||||||||||||||||||
| 3. Construction and Dimension | Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | |||||||||||||||||||||||||||||||||||||
| Dimension (mm): (See table below for specific sizes like 0201, 0402, etc., with L, W, T, WB values) |
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| 4. Specification and Testing Method | Temperature: | -55~+125 | Naked eye (Visual inspection), Digital calliper | |||||||||||||||||||||||||||||||||||
| Visual/Dimension: | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||||||||||||||||||||||||||||
| Static Capacity: | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | Frequency and Voltage specified per characteristic | ||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF): | Specified per characteristic (NPO, X7R/X7T/X7P) | Frequency and Voltage specified per characteristic | ||||||||||||||||||||||||||||||||||||
| IR Insulation Resistance: | Specified per characteristic (NPO, X7R/X7T/X7P) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||||||||||||||||||||||||||||
| Hi-pot (DC): | No dielectric breakdown or damage (Voltage based on rated voltage Ur) | Voltage Raising time: 110S, Voltage maintaining time2S | ||||||||||||||||||||||||||||||||||||
| Solderability: | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||||||||||||||||||||||||||||
| 5. Resistance to the heat of soldering | Visual | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||||||||||||||||||||||||||
| Electrostatic capacity change rate | Specified per characteristic (NPO, X7R, X7T, X7P) | |||||||||||||||||||||||||||||||||||||
| DF | Refer to NO#4 | |||||||||||||||||||||||||||||||||||||
| 6. Flexural strength | Visual | No damage | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | |||||||||||||||||||||||||||||||||||
| 7. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||||||||||||||||||||||||||||
| 8. Thermal shock | Visual | No visual damage | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||||||||||||||||||||||||||||||||||
| Electrostatic capacity change rate | Specified per characteristic (NPO, X7R/X7P, X7T) | |||||||||||||||||||||||||||||||||||||
| DF | Refer to NO#4 | |||||||||||||||||||||||||||||||||||||
| 9. Temperature moisture exposure | Visual | No visual damage | Test it after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 50024 hours. | |||||||||||||||||||||||||||||||||||
| Electrostatic capacitance change rate | Specified per characteristic (NPO, X7R/X7T/X7P) | |||||||||||||||||||||||||||||||||||||
| DF | 2 times initial standard | |||||||||||||||||||||||||||||||||||||
| 10. High temperature exposure | Visual | No visual damage | Test it after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. | |||||||||||||||||||||||||||||||||||
| Electrostatic capacitance change rate | Specified per characteristic (NPO, X7R/X7T/X7P) | |||||||||||||||||||||||||||||||||||||
| DF | 2 X initial standard | |||||||||||||||||||||||||||||||||||||
| 11. PCB flexural strength | No crack and other defect | IR | Soldering the MLCC on the PCB, then pressing direction based on the photo. (See Page 7 for SIZE A, B, C values for different sizes) | |||||||||||||||||||||||||||||||||||
| 12. Embossed Plastic Taping Dimensions | (See Page 8 for detailed dimensions A, B, C, D, E, F, G, H, J, T for sizes 0805 to 1812) | |||||||||||||||||||||||||||||||||||||
| 13. Paper Tape Reel Packing Dimensions | (See Page 9 for detailed dimensions W1, L1, D, C, B, P1, P2, P0, d, t for sizes 1005, 0201, 0402, 0603, 0805, 1206) | |||||||||||||||||||||||||||||||||||||
| 14. Reel Dimensions | (See Page 10 for Reel Dimensions A, B, C, D, E, F, G for 7' and 13' Reels) | |||||||||||||||||||||||||||||||||||||
| 15. Taping Specification | Top tape peeling strength | 0.1N < peeling strength < 0.7N | Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||||||||||||||||||||||||||||
| 16. Packing Quantity | (See Page 11 for Packing Quantity in Pcs for Paper T/R and Plastic T/R for various sizes) | |||||||||||||||||||||||||||||||||||||
| 17. ROHS/REACH compliance | RoHS: meet the standard, REACH: meet the standard | |||||||||||||||||||||||||||||||||||||
| 18. Precautions For Use | MLCCs may fail in short circuit or open circuit modes when subjected to severe conditions beyond specified ratings. Follow safety precautions and application notes. Contact engineering or factory for handling precautions. | |||||||||||||||||||||||||||||||||||||
| 19. Soldering Profile | To avoid crack problems by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |||||||||||||||||||||||||||||||||||||
| 20. Manual Soldering | Risk of thermal cracks due to direct contact of soldering iron tip. Handle carefully, pay attention to tip selection and temperature contact. | |||||||||||||||||||||||||||||||||||||
| 21. Recommended Soldering Method | (See Page 13 for recommended methods R-Reflow Soldering, W-Wave Soldering for different sizes, characteristics, and capacitance values) | |||||||||||||||||||||||||||||||||||||
| 22. Temperature profile for soldering | Keep the temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |||||||||||||||||||||||||||||||||||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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