Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 200V |
| Capacitance | 100pF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 100pF ±10% 200V Ceramic Capacitor X7R 0805 |
| Mfr. Part # | 0805X7R101K201NT |
| Package | 0805 |
| Model Number | 0805X7R101K201NT |
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Product Specification
| Voltage Rating | 200V | Capacitance | 100pF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 100pF ±10% 200V Ceramic Capacitor X7R 0805 | Mfr. Part # | 0805X7R101K201NT |
| Package | 0805 | Model Number | 0805X7R101K201NT |
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They are suitable for medium and high voltage MLCC requirements.
| Item | Description/Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | High voltage circuits | ||||
| Function | Coupling, wave filtering, resonant | ||||
| Typical Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||||
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||
| Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| Part Number Description | Item 1: Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Item 3: Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| Item 4: Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Item 5: Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | ||||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn | ||||
| Item 7: Packing | T (Tape/Reel), P (Bag packing) | ||||
| Construction | 1. Ceramic dielectric | ||||
| 2. Inner electrode | |||||
| 3. Outer electrode | |||||
| 4. Nickle layer | |||||
| 5. Tin layer | |||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification & Testing Method | Temperature Range | -55~+125 | |||
| Visual/Dimension | No Damage, Dimension meet Spec | ||||
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms | X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | |||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). | X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. | |||
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). Test @ Rated voltage, 605s, 75% Humidity, 255, 50mA. | X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). | |||
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur): 2.5xUr (Ur100V), 2.0xUr (200V/250V), 1.5xUr (450/500/630V), 1.2xUr (1KVUr2KV), 1.1xUr (Ur>2KV). Voltage raising time: 110S, maintaining time: 2S. | ||||
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating: 80-120 (10-30s). Solder temp: 2455. Solder time: 20.5s. | ||||
| Resistance to Heat of Soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200 (102s). Solder temp: 2655. Solder time: 51s. Cleaning with solvent. Room temp, 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO: |C/C| 0.5% or 0.5pF. X7R: |C/C| 15%. X7T: -33% C/C22%. X7P: |C/C| 10%. | Refer to NO#4 for DF, NO#5 for IR. | |||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Capacitance change rate: |C/C| 10%. | ||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N. Duration: 101S. | ||||
| Thermal Shock | NPO: |C/C| 2.5% or 0.25pF. X7R/X7P: |C/C| 0.5%. X7T: |C/C| 10%. Pre-condition (X7R): Upper limit temp 1hr, 241 hrs. 5 cycles. Test after 242 hrs. | ||||
| Temperature Moisture Exposure | Visual: No damage. Test after 242 hrs. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacity change rate: NPO: |C/C| 2% or 1pF. X7R/X7T/X7P: |C/C| 10%. DF 2x initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | ||||
| High Temperature Exposure | Visual: No damage. Test after 48 hrs. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacity change rate: NPO: |C/C| 2% or 1pF. X7R/X7T/X7P: |C/C| 20%. DF 2x initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | ||||
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. Sizes and dimensions (A, B, C) provided for 0805 to 2220. | ||||
| Embossed Plastic Taping | Details for 0805 to 1812 types including tape size (A-J) and dimensions. | ||||
| Paper Tape Reel Packing | Details for 1005, 0201, 0402 types (W1, L1, D, C, B, P1, P2, P0, d, t) and 0603, 0805, 1206 types (A-J, T). | ||||
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) with various dimensions (A-G). | ||||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. | ||||
| Packing Quantity | Varies by size and taping type (Paper T/R, Plastic T/R). E.g., 0603 Paper T/R: 4000 pcs, 0805 Plastic T/R: 3000 pcs. | ||||
| Soldering Method | Recommended methods (R-Reflow, W-Wave) based on size, temperature characteristics, rated voltage, and capacitance. | ||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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