Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 10nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 10nF ±10% 50V Ceramic Capacitor X7R 0402 |
| Mfr. Part # | 0402X7R103K500NT |
| Package | 0402 |
| Model Number | 0402X7R103K500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 10nF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 10nF ±10% 50V Ceramic Capacitor X7R 0402 | Mfr. Part # | 0402X7R103K500NT |
| Package | 0402 | Model Number | 0402X7R103K500NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage circuits, including applications such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. It offers wave filtering and resonant capabilities in medium and high voltage applications.
| Item | Description/Specification | Testing Method | |||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| General Conditions | |||||||||||||||||||||||||||||||||||||||||
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | |||||||||||||||||||||||||||||||||||||||
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |||||||||||||||||||||||||||||||||||||||
| Part Number Description | |||||||||||||||||||||||||||||||||||||||||
| Part Number Structure | Example: 1812 X7R 684 M 251 N T | N/A | |||||||||||||||||||||||||||||||||||||||
| Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | N/A | |||||||||||||||||||||||||||||||||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |||||||||||||||||||||||||||||||||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | N/A | |||||||||||||||||||||||||||||||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |||||||||||||||||||||||||||||||||||||||
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | N/A | |||||||||||||||||||||||||||||||||||||||
| Terminal Composition | Au/Ag-Ni-Sn | N/A | |||||||||||||||||||||||||||||||||||||||
| Packing | T Tape/Reel, P Bag packing(PE) | N/A | |||||||||||||||||||||||||||||||||||||||
| Construction and Dimension | |||||||||||||||||||||||||||||||||||||||||
| Construction Items | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | N/A | |||||||||||||||||||||||||||||||||||||||
| Dimension (mm) | See table below | Digital calliper | |||||||||||||||||||||||||||||||||||||||
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| Specification and Testing Method | |||||||||||||||||||||||||||||||||||||||||
| Temperature | -55~+125 | N/A | |||||||||||||||||||||||||||||||||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||||||||||||||||||||||||||||||||
| Static Capacity | Meet standard specification and tolerance | See table below | |||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | See table below | See table below | |||||||||||||||||||||||||||||||||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | Pre-heating 150 for 1 hour, then 48 hours under normal conditions. | |||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | 5 cycles of thermal shock. Test after 242 hours at normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10%. DF: 2 times initial standard. IR: NPO: 2500M or IR*Cr25S; X7R/X7T/X7P: 1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours at normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20%. DF: 2 X initial standard. IR: NPO: 4000M or IR*Cr40S; X7R/X7T/X7P: 2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test after 48 hours under normal conditions. | |||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction as per photo. | |||||||||||||||||||||||||||||||||||||||
| Embossed Plastic Taping | |||||||||||||||||||||||||||||||||||||||||
| Taping Specification | Dimensions for 0805 to 1812 types | N/A | |||||||||||||||||||||||||||||||||||||||
| Reel Dimensions | 7REEL: 1782.0, 13REEL: 3302.0 | N/A | |||||||||||||||||||||||||||||||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Standard measurement | |||||||||||||||||||||||||||||||||||||||
| Packing Quantity | |||||||||||||||||||||||||||||||||||||||||
| Paper T/R (Pcs) | 0201: 10000, 0402: 10000, 0603: 5000, 0805: 4000, 1206: 2000 | N/A | |||||||||||||||||||||||||||||||||||||||
| Plastic T/R (Pcs) | 0805: 3000, 1206: 3000 (T1.35mm), 2000 (T>1.35mm), 1210: 2000 (T1.60mm), 3000 (T>1.60mm), 1808: 2000, 1812: 1000 (T1.85mm), 800 (T>1.85mm) | N/A | |||||||||||||||||||||||||||||||||||||||
| Precautions For Use | |||||||||||||||||||||||||||||||||||||||||
| Soldering Profile | Follow the temperature profile graph (refer to enclosure). | N/A | |||||||||||||||||||||||||||||||||||||||
| Manual Soldering | Handle soldering iron carefully to avoid thermal cracks. | N/A | |||||||||||||||||||||||||||||||||||||||
| Recommended Soldering Method | |||||||||||||||||||||||||||||||||||||||||
| Soldering Method | RReflow Soldering, WWave Soldering | N/A | |||||||||||||||||||||||||||||||||||||||
| Temperature Profile for Soldering | Keep temperature difference between soldering temperature and surface temperature of chips T150. | N/A | |||||||||||||||||||||||||||||||||||||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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