| Voltage Rating | 100V |
| Capacitance | 33pF |
| Temperature Coefficient | C0G |
| Tolerance | ±5% |
| Description | 33pF ±5% 100V Ceramic Capacitor C0G 0805 |
| Mfr. Part # | 0805C0G330J101NT |
| Package | 0805 |
| Model Number | 0805C0G330J101NT |
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Product Specification
| Voltage Rating | 100V | Capacitance | 33pF |
| Temperature Coefficient | C0G | Tolerance | ±5% |
| Description | 33pF ±5% 100V Ceramic Capacitor C0G 0805 | Mfr. Part # | 0805C0G330J101NT |
| Package | 0805 | Model Number | 0805C0G330J101NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications, including coupling, wave filtering, and resonance in various power supply circuits. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, meeting stringent testing conditions and offering reliable performance.
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | ||
| Testing Condition: Normal Condition (Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa) | |||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Nominal Electrostatic Capacity | Example | 8R08.0, 10010, 101100 (pF) | N/A |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A |
| Rated Voltage (DC) | Example | 250 25, 251 250, 252 2500 (V) | N/A |
| Packing | Code | T Tape/Reel, P Bag packing (PE) | N/A |
| Construction and Dimension | Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | N/A |
| Dimension (mm) | Part Number, L, W, T, WB | See table on Page 2 | Digital Calliper |
| Temperature Characteristic | -55~+125 | N/A | |
| Static Capacity | Meet standard specification and tolerance | Frequency, Voltage dependent (See Page 3 for details) | |
| Dissipation Factor (DF) | See Page 3 for details | Frequency, Voltage dependent | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | N/A |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | Visual |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF larger reading; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | N/A |
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | Visual |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | N/A |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | N/A |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | N/A |
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. | N/A |
| PCB Flexural Strength | No crack and other defect | See Page 7 for dimensions (A, B, C) for different sizes. | IR |
| Embossed Plastic Taping | Taping Specification | See Page 8 for dimensions (A, B, C, D, E, F, G, H, J, T) for different sizes. | N/A |
| Paper Tape Reel Packing | Taping Specification | See Page 9 for dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for different sizes. | N/A |
| Reel Dimensions | 7REEL, 13REEL | See Page 10 for dimensions (A, B, C, D, E, F, G) | N/A |
| Top Tape Peeling Strength | Paper Taping, Embossed Taping | 0.1N < peeling strength < 0.7N | N/A |
| Packing Quantity | Paper T/R (Pcs), Plastic T/R (Pcs) | See Page 11 for quantities by size. | N/A |
| Soldering Method | RReflow Soldering, WWave Soldering | See Page 13 for recommended methods by size, characteristic, rated voltage, and capacitance. | N/A |
| Soldering Temperature Profile | See Page 14 for temperature profile details. Keep temperature difference T150. | N/A | |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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