Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 50V |
| Capacitance | 22pF |
| Temperature Coefficient | C0G |
| Tolerance | ±5% |
| Description | 22pF ±5% 50V Ceramic Capacitor C0G 0805 |
| Mfr. Part # | 0805C0G220J500NT |
| Package | 0805 |
| Model Number | 0805C0G220J500NT |
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Product Specification
| Voltage Rating | 50V | Capacitance | 22pF |
| Temperature Coefficient | C0G | Tolerance | ±5% |
| Description | 22pF ±5% 50V Ceramic Capacitor C0G 0805 | Mfr. Part # | 0805C0G220J500NT |
| Package | 0805 | Model Number | 0805C0G220J500NT |
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are engineered for medium and high voltage requirements, offering reliable performance in demanding electronic systems.
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | N/A | |
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | N/A |
| Dimension (mm) - British System | 0201 (0.02*0.01 inch) | L*W (mm): 0.50*0.25 | |
| Dimension (mm) - British System | 0402 (0.04*0.02 inch) | L*W (mm): 1.00*0.50 | |
| Dimension (mm) - British System | 0603 (0.06*0.03 inch) | L*W (mm): 1.60*0.80 | |
| Dimension (mm) - British System | 0805 (0.08*0.05 inch) | L*W (mm): 2.00*1.25 | |
| Dimension (mm) - British System | 1206 (0.12*0.06 inch) | L*W (mm): 3.20*1.60 | |
| Dimension (mm) - British System | 1210 (0.12*0.10 inch) | L*W (mm): 3.20*2.50 | |
| Dimension (mm) - British System | 1808 (0.18*0.08 inch) | L*W (mm): 4.50*2.00 | |
| Dimension (mm) - British System | 1812 (0.18*0.12 inch) | L*W (mm): 4.50*3.20 | |
| Dimension (mm) - British System | 1825 (0.18*0.25 inch) | L*W (mm): 4.50*6.30 | |
| Dimension (mm) - British System | 2211 (0.22*0.11 inch) | L*W (mm): 5.70*2.8 | |
| Dimension (mm) - British System | 2225 (0.22*0.25 inch) | L*W (mm): 5.70*6.30 | |
| Specification and Testing Method | Temperature | -55~+125 | N/A |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). X7R/X7T/X7P: See Note 1. | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr>10uF). | |
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | Initial capacitance testing: Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | |
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452. | |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S. | |
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |
| Temperature moisture exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |
| High temperature exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48hours under normal pressure & temperature. | |
| Taping Specification | Embossed Plastic Taping | Details for 0805 to 1812 types (Tape size A, B, C, D, E, F, G, H, J, T) | N/A |
| Paper Tape Reel Packing | Details for 1005, 0201, 0402, 0603, 0805, 1206 types (Paper size W1, L1, D, C, B, P1, P2, P0, d, t; Tape size A, B, C, D, E, F, G, H, J, T) | N/A | |
| Packing Quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000, 1005: 4000, 1206: 4000. Plastic T/R (Pcs): 0805: 3000, 1206: 3000, 1210: 2000, 1808: 2000, 1812: 1000. | N/A |
| Precautions For Use | Soldering Profile | Follow the temperature profile in the adjacent graph. | N/A |
| Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature contact. | N/A | |
| Recommended Soldering Method | Size & Characteristic | NPO / R, X7R/X5R/X7S/X6S / R, Y5V / R (for larger capacitance values, R/W) | RReflow Soldering, WWave Soldering |
| Soldering Temperature Profile | Preheating | Temperature difference between soldering temperature and surface temperature of chips: T150. | N/A |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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