Beijing Silk Road Enterprise Management Services Co., Ltd.
| Voltage Rating | 250V |
| Capacitance | 22nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Description | 22nF ±10% 250V Ceramic Capacitor X7R 1206 |
| Mfr. Part # | 1206X7R223K251NT |
| Package | 1206 |
| Model Number | 1206X7R223K251NT |
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Product Specification
| Voltage Rating | 250V | Capacitance | 22nF |
| Temperature Coefficient | X7R | Tolerance | ±10% |
| Description | 22nF ±10% 250V Ceramic Capacitor X7R 1206 | Mfr. Part # | 1206X7R223K251NT |
| Package | 1206 | Model Number | 1206X7R223K251NT |
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, adhering to strict testing conditions for reliable performance.
| Item | Description / Specification | Details | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1. Application Field | ||||||||||
| Primary Applications | Coupling, wave filtering, resonant in high voltage circuits | |||||||||
| Specific Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||||||
| 2. Testing Conditions | ||||||||||
| Normal Condition | Temperature | 15~35 | ||||||||
| Humidity | 45~75%RH | |||||||||
| Atmosphere | 86~106kPa | |||||||||
| Relative Condition | Temperature | 252 | ||||||||
| Humidity | 60~70%RH | |||||||||
| Atmosphere | 86~106kPa | |||||||||
| 3. Part Number Description | ||||||||||
| Item 1: Dimension Code | Examples | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||||||
| Dimensions (mm) | 0201: 0.50*0.25, 0402: 1.00*0.50, 0603: 1.60*0.80, 0805: 2.00*1.25, 1206: 3.20*1.60, 1210: 3.20*2.50, 1808: 4.50*2.00, 1812: 4.50*3.20, 1825: 4.50*6.30, 2211: 5.70*2.8, 2225: 5.70*6.30 | |||||||||
| Item 2: Temperature Characteristic | Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||
| Item 3: Nominal Electrostatic Capacity | Format | 8R0=8.0pF, 100=10pF, 101=100pF | ||||||||
| Item 4: Tolerance of Electrostatic Capacity | Codes | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||
| Item 5: Rated Voltage (DC) | Format | 250=25V, 251=250V, 252=2500V | ||||||||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||
| Item 7: Packing | Codes | T (Tape/Reel), P (Bag packing) | ||||||||
| 4. Construction | ||||||||||
| Item | Description | |||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickle layer | |||||||||
| 5 | Tin layer | |||||||||
| 5. Dimensions (mm) | ||||||||||
| Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| 6. Specification and Testing Method | ||||||||||
| No | Item | Specification / Requirement | Testing Method | |||||||
| 1 | Temperature | -55~+125 | ||||||||
| 2 | Visual / Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital calliper | |||||||
| 3 | Static Capacity | Meet standard specification and tolerance | ||||||||
| NPO characteristic | 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms | |||||||||
| X7R/X7T/X7P characteristic | 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | |||||||||
| 4 | Dissipation Factor (DF) | |||||||||
| NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) | Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms | ||||||||
| X7R/X7T/X7P characteristic | See Note 1 | Cr10uF, 110%KHz, 1V0.1rms Cr10uF, 12024Hz, 0.5V0.1rms | ||||||||
| 5 | IR Insulation Resistance | |||||||||
| NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA | ||||||||
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | |||||||||
| 6 | Hi-pot (DC) | No dielectric breakdown or damage | ||||||||
| Voltage | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time2S | ||||||||
| 7 | Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||
| 8 | Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | |||||||||
| DF | Refer to NO#4 | |||||||||
| IR | Refer to NO#5 | |||||||||
| 9 | Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||
| Electrostatic capacity change rate | C/C10% | Test it under the flexural status. Flexural depth 452 | ||||||||
| 10 | Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||
| 11 | Thermal Shock | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||||||||
| NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | |||||||||
| X7R/X7P characteristic | C/C0.5% | |||||||||
| X7T characteristic | C/C10% | |||||||||
| 12 | Temperature Moisture Exposure | Visual: No visual damage | Test it after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 500+24 hours. | |||||||
| Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C10% | |||||||||
| DF | 2 times initial standard | |||||||||
| IR | NPO: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | |||||||||
| 13 | High Temperature Exposure | Visual: No visual damage | Test it after place 48hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. | |||||||
| Charging and discharging current | 50mA Max. | |||||||||
| Voltage | 100VV250V: 2x Rated voltage 250VV1KV: 1.5x rated voltage 1KVV: 1.2x rated voltage | |||||||||
| Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | |||||||||
| DF | 2 X initial standard | |||||||||
| IR | NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | |||||||||
| 14 | PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Then pressing direction base on the photo. SIZE A B C 0805(2012) 1.2 4 1.65, 1206(3216) 2.2 5 2, 1210(3225) 2.2 5 2.9, 1812(4532) 3.5 7 3.7, 2220(5750) 4.5 8 5.6 | |||||||
| 7. Embossed Plastic Taping | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | |
| 8. Paper Tape Reel Packing | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 9. Reel Dimensions (unit: mm) | ||||||||||
| Unit | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 10. Taping Specification | ||||||||||
| Top tape peeling strength | (a) Paper Taping Reel type: 0.1N < peeling strength < 0.7N | (b) Embossed Taping Standard: 0.1N < peeling strength < 0.7N | ||||||||
| 11. Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) | ||||||||
| 1210 | - | 1000 (T1.85mm), 800 (T1.85mm) | ||||||||
| 1808 | - | 500 | ||||||||
| 1812 | - | 500 | ||||||||
| 12. Precautions For Use | ||||||||||
| Soldering Profile | To avoid crack problems from sudden temperature changes, follow the recommended soldering profile. | |||||||||
| Manual Soldering | Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature contact. | |||||||||
| Optimum Solder Amount for Reflow Soldering | Refer to recommended soldering amounts. | |||||||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | |||||||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips T150 during preheating. | |||||||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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