| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, such as switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). |
| 2. Testing Condition | Normal condition | Temperature: 15~35, Humidity: 45~75%RH, Normal atmosphere: 86~106kPa | (No special requirements) |
| Relative condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | Any testing data does not match testing specification |
| 3. Part Number Description | Example: 1812 X7R 684 M 251 N T - Dimension Code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
- Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%)
- Nominal Electrostatic Capacity: 8R08.0, 10010, 101100 (pF)
- Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
- Rated Voltage (DC): 250 25, 251 250, 252 2500 (V)
- Terminal Composition: Au/Ag-Ni-Sn
- Packing: T Tape/Reel, P Bag packing (PE)
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| 4. Construction and Dimension | Construction | - Ceramic dielectric
- Inner electrode
- Outer electrode
- Nickle layer
- Tin layer
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| Dimension (mm) | | Part number | Dimension (mm) L | Dimension (mm) W | Dimension (mm) T | WB | | 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | | 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | | 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | | 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | | 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | | 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | | 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | | 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | | 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | | 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | | 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| 5. Specification and Testing Method | | No | Item | Specification/Requirement | Testing method | | 1 | Temperature | -55~+125 | - | | 2 | Visual/ Dimension | 1, No Damage 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | | 3 | Static capacity | Meet standard specification and tolerance | - NPO characteristic: Capacity Frequency Voltage 1000pF 1MHz10% 1.00.2Vrms; 1000 pF 1KHz10% 1.00.2Vrms
- X7R/X7T/X7P characteristic: Capacity Frequency Voltage 10uF 1KHz10% 1.00.2Vrms; 10uF 120Hz24 0.50.1Vrms
| | 4 | Dissipation factor (DF) | - NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
- X7R/X7T/X7P characteristic: see Note 1
| - Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms
- Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms.
- Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms.
- Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms
| | 5 | IR Insulation Resistance | - NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF
- X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF
| Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | | 6 | Hi-pot (DC) | No dielectric breakdown or damage | - Ur=100V,...............2.5 x rated voltage
- Ur=200V/250V,.... 2.0 x rated voltage
- Ur=450/500/630V,1.5 x rated voltage
- 1KVUr2KV,.......1.2 x rated voltage
- 2KVUr,...............1.1 x rated voltage
- Voltage Raising time: 110S, Voltage maintaining time2S
| | 7 | Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | | 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | | 9 | Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. | | 10 | Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | | 11 | Thermal shock | - NPO Characteristic; C/C2.5% or 0.25pF (larger reading)
- X7R/X7P- characteristic: C/C0.5%
- X7T characteristic: C/C10%
| Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | | 12 | Temperature moisture exposure | - Visual: No visual damage
- Electostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%
- DF: 2 times initial standard
- IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
| Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity | | 13 | High temperature exposure | - Visual: No visual damage
- Electostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
- DF: 2 X initial standard
- IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
| Charging and discharging current 50mA Max. Temperature 1253, Time 100048 hours. Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | | 14 | PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, Then pressing direction base on the photo. | |
| 6. EMBOSSED PLASTIC TAPING | | Code | Tape size | A | B | C | D | E | F | G | H | J | T | | 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | | 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | | 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | | 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | | 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | Paper tape reel packing: | Code | Papersize | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t | | 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below | | 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | | 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | | Code | Papersize | A | B | C | D | E | F | G | H | J | T | | 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | | 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | | 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | Reel Dimensions (unit: mm): | Unit:mm | A | B | C | D | E | F | G | | 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | | 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | Taping specification: - Top tape peeling strength: 0.1N < peeling strength < 0.7N
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| 7. Packing quantity | | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | | 0603 | 4000 | | | 0805 | 4000 | 3000 (T1.35mm) | | 1206 | | 3000 (T>1.35mm) | | 1210 | | 2000 (T1.60mm) | | 1808 | | 3000 (T>1.60mm) | | 1812 | | 2000 | | 1812 | | 1000 (T1.85mm) | | | 1000 (T>1.85mm) | | | 800 | | | 500 | |
| 8. Precautions For Use | MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. To avoid failure, follow these precautions: - Soldering Profile: Follow the temperature profile graph to prevent cracks from sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully to avoid direct contact with the ceramic body and select appropriate tips and temperatures.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
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| 9. Recommended Soldering Method | | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | | 1005 | NPO | / | / | R | | X7R/X5R/X7S/X6S | / | / | R | | 0201 | NPO | / | / | R | | X7R/X5R/X7S/X6S | / | / | R | | Y5V | / | / | R | | 0402 | NPO | / | / | R | | X7R/X5R/X7S/X6S | / | / | R | | Y5V | / | / | R | | 0603 | NPO | / | / | R/W | | X7R/X5R/X7S/X6S | / | C1uf | R | | | / | C1uf | R/W | | Y5V | / | C1uf | R | | | / | C1uf | R/W | | 0805 | NPO | / | / | R/W | | X7R/X5R/X7S/X6S | / | C4.7uf | R | | | / | C4.7uf | R/W | | Y5V | / | C1uf | R | | | / | C1uf | R/W | | 1206 | NPO | / | / | R/W | | X7R/X5R/X7S/X6S | / | C10uf | R | | | / | C10uf | R/W | | Y5V | / | C10uf | R | | | / | C10uf | R/W | | 1210 | NPO | / | / | R | | X7R/X5R/X7S/X6S | / | / | R | | Y5V | / | / | R | Soldering method: RReflow Soldering, WWave Soldering |
| 10. The temperature profile for soldering | While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. |
