| Voltage Rating | 16V |
| Capacitance | 4.7uF |
| Temperature Coefficient | X5R |
| Tolerance | ±20% |
| Description | 16V 4.7uF X5R ±20% 0603 Ceramic Capacitors RoHS |
| Mfr. Part # | 0603X5R475M160NT |
| Package | 0603 |
| Model Number | 0603X5R475M160NT |
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Product Specification
| Voltage Rating | 16V | Capacitance | 4.7uF |
| Temperature Coefficient | X5R | Tolerance | ±20% |
| Description | 16V 4.7uF X5R ±20% 0603 Ceramic Capacitors RoHS | Mfr. Part # | 0603X5R475M160NT |
| Package | 0603 | Model Number | 0603X5R475M160NT |
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving crucial roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics (C0G, X7R, X5R) and are available in a wide range of dimensions and electrical specifications to meet diverse industrial needs.
| Category | Specification | Details | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Components | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0pF, 10010pF, 101100pF | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. Rated Voltage (DC) | 25025V, 251250V, 2522500V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Construction | Construction Items | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimensions (mm) |
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| Specification and Testing Method | 1. Temperature | -55~+125 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec. (Visual inspection, Digital caliper) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3. Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4. Dissipation Factor (DF) | Refer to Note 1 and detailed specifications in the document. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | Dielectric breakdown or damage. Voltage: 1.1x to 2.5x rated voltage depending on Ur. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area 90%. Visual inspection: No damage. Pre-heating: 80-120, 10-30s. Solder: Lead-free. Temperature: 2455, Time: 20.5s. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | Visual inspection: No damage, soldering area 90%. Pre-heating: 100-200, 102s. Soldering Temperature: 2655, Time: 51s. Cleaning: With solvent. Room temperature: 242 hours. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF. X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | Visual inspection: No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electrostatic capacity change rate: C/C10%. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. 5 cycles. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | Visual inspection: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. (Tested after 242 hours normal temp & humidity). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | Visual inspection: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. (Tested after 48 hours under normal pressure & temperature). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Embossed Plastic Taping | Dimensions provided for tape sizes 0805 to 1812. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Paper Tape Reel Packing | Dimensions provided for 1005, 0201, 0402, 0603, 0805, 1206 types. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reel Dimensions | 7' REEL (1782.0mm), 13' REEL (3302.0mm). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Top Tape Peeling Strength | Paper Taping: Standard values provided. Embossed Taping: 0.1N < peeling strength < 0.7N. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity | Paper T/R: 4000 pcs (0805, 0805). Plastic T/R: Varies by size and thickness (e.g., 3000 pcs for 1210 T1.60mm). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Method Recommendations | RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristic, rated voltage, and capacitance. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Temperature Profile | Preheating: T150 temperature difference between soldering temperature and surface temperature of chips. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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