Angel Technology Electronics Co
| Description | BIWIN ePOP Chips combines MMC and Mobile LPDDR in a single package with different capacities |
| Stock | In Stock |
| Payment Terms | T/T, Western Union |
| Shipping Method | Express |
| Category | Electronic components-Memory |
| Family | BIWIN EPOP Chips |
| Frequency | LPDDR 2 / LPDDR 3: 533 MHz / 800 MHz / 1200 MHz |
| Application | In-vehicle Smart Phone |
| Operating Temperature | -20°C ~ 85°C |
| Selection Part numbers | BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP |
| Product specifications Interface | eMMC: eMMC 5.0 & eMMC 5.1 LPDDR 2 / LPDDR 3: 32bit |
| Dimensions | 11.50 × 13.00 mm |
| Working Voltage | eMMC: VCC=3.3 V VCCQ=1.8 V LPDDR 2: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V LPDDR 3: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V |
| Capacity | 8 GB + 4 Gb / 8 GB + 8 Gb 16 GB + 8 Gb / 16 GB + 16 Gb |
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Product Specification
| Description | BIWIN ePOP Chips combines MMC and Mobile LPDDR in a single package with different capacities | Stock | In Stock |
| Payment Terms | T/T, Western Union | Shipping Method | Express |
| Category | Electronic components-Memory | Family | BIWIN EPOP Chips |
| Frequency | LPDDR 2 / LPDDR 3: 533 MHz / 800 MHz / 1200 MHz | Application | In-vehicle Smart Phone |
| Operating Temperature | -20°C ~ 85°C | Selection Part numbers | BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP |
| Product specifications Interface | eMMC: eMMC 5.0 & eMMC 5.1 LPDDR 2 / LPDDR 3: 32bit | Dimensions | 11.50 × 13.00 mm |
| Working Voltage | eMMC: VCC=3.3 V VCCQ=1.8 V LPDDR 2: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V LPDDR 3: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V | Capacity | 8 GB + 4 Gb / 8 GB + 8 Gb 16 GB + 8 Gb / 16 GB + 16 Gb |
BWCD24L-04G BWCD24M-08 EPOP LPDDR4X IC Chips For Smart Wear AR/VR
BWCD24L-04G
BWCD24M-08G
BWCK1EZH-32G-X
BWCL1EZC-32G-X
BWCK1EZC05-64G
BWCK1KZC02-64G
ePOP combines MMC and Mobile LPDDR in a single package, with different capacities. These products are widely used in mobile and wearable applications. With leading wafer packaging technologies, including advanced wafer grinding, lamination and wirebonding techniques, BIWIN integrates RAM and ROM in a single device, which not only improves performance and energy efficiency, but also saves space on printed circuit boards (PCB), thus shortening the development time for customers.
ePOP is an ideal solution for portable and wearable devices, such as smartphones, tablets, PMP, PDA and other media devices.
Application:
Smart Wear
AR/VR
Description:
ePoP LPDDR4X integrates LPDDR4X DRAM and eMMC 5.1 storage into a Package-on-Package (PoP) solution with a 144-ball FBGA package. With a compact size of just 8.00 x 9.50 mm, it achieves sequential read and write speeds up to 290 MB/s and 140 MB/s, with frequency up to 4266 Mbps. BIWIN ePoP LPDDR4X offers capacity up to 64 GB+32 Gb. It is a next-generation storage solution designed for high-end smartwatches. Compared to previous generations, this solution features a 128.6% increase in frequency, a 32% reduction in size, and is certified by the Qualcomm 5100 platform.
Specification:
| Interface | eMMC: eMMC 5.0 / eMMC 5.1 |
| LPDDR 2 / LPDDR 3: 32bit | |
| LPDDR 4 / LPDDR 4x: 16bit | |
| Dimensions | 10.0 × 10.00 mm (136b) |
| 8.00 × 9.50 mm (144b) | |
| 8.60 × 10.40 mm (144b) | |
| 12.00 × 13.00 mm (320b) | |
| Max. Sequential Read | eMMC: 320 MB/s |
| Max. Sequential Write | eMMC: 260 MB/s |
| Frequency | LPDDR 2 / LPDDR 3: 1200 MHz |
| LPDDR 4x: 1200 MHz - 1866 MHz | |
| Capacity | 4 GB + 4 Gb |
| 8 GB + 4 Gb / 8 GB + 8 Gb | |
| 16 GB + 8 Gb | |
| 32 GB + 16 Gb | |
| 64 GB + 16 Gb | |
| Working Voltage | eMMC: VCC=3.3 V, VCCQ=1.8 V |
| LPDDR 2 / LPDDR 3: VDD1=1.8 V, VDD2=VDDCA=VDDQ=1.2 V | |
| LPDDR 4: VDD1=1.8 V, VDD2=VDDQ=1.1 V | |
| LPDDR 4x: VDD1=1.8 V, VDD2=1.1 V, VDDQ=0.6 V | |
| Working Temperature | -20℃ - 85℃ |
| Approved Verification Platforms | SnapDragon Wear 3100 / 5100 |
| MSM8909W... | |
| Packaging | FBGA136 / FBGA144 / FBGA320 |
| Application | Smart Wear AR/VR |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent
Year Established:
2006
Total Annual:
80 millions-500 millions
Employee Number:
20~200
Ecer Certification：
Verified Supplier
Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.Angel Technology provide one stop service for electronic components,PCB and PCB Assembly(SMT). The Mission Of Angel Technology Electronics Co h... Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.Angel Technology provide one stop service for electronic components,PCB and PCB Assembly(SMT). The Mission Of Angel Technology Electronics Co h...
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