Angel Technology Electronics Co
| Description | BIWIN UFS Chips is a next-generation embedded memory chip |
| Stock | In Stock |
| Payment Terms | T/T, Western Union |
| Shipping Method | Express |
| Category | Electronic components-Memory |
| Family | BIWIN UFS IC Chips |
| Interface | UFS 2.1 / UFS 2.1 / UFS 3.1 |
| Application | Note-Book, Smart Phone |
| Operating Temperature | -20°C ~ 85°C |
| Selection Part numbers | UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G |
| Dimensions | 11.50 × 13.00 mm |
| Working Voltage | UFS 2.1: VCC=3.3 V, VCCQ=1.8 V UFS 2.1: VCC=3.3 V, VCCQ=1.8 V UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V |
| Capacity | UFS 2.1: 128 GB - 256 GB UFS 2.1: 128 GB - 256 GB UFS 3.1: 128GB - 512GB |
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Product Specification
| Description | BIWIN UFS Chips is a next-generation embedded memory chip | Stock | In Stock |
| Payment Terms | T/T, Western Union | Shipping Method | Express |
| Category | Electronic components-Memory | Family | BIWIN UFS IC Chips |
| Interface | UFS 2.1 / UFS 2.1 / UFS 3.1 | Application | Note-Book, Smart Phone |
| Operating Temperature | -20°C ~ 85°C | Selection Part numbers | UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G |
| Dimensions | 11.50 × 13.00 mm | Working Voltage | UFS 2.1: VCC=3.3 V, VCCQ=1.8 V UFS 2.1: VCC=3.3 V, VCCQ=1.8 V UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V |
| Capacity | UFS 2.1: 128 GB - 256 GB UFS 2.1: 128 GB - 256 GB UFS 3.1: 128GB - 512GB |
UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G UFS IC Chips
UFS
As a next-generation embedded memory chip, the BIWIN UFS chip is three times faster than the latest eMMC 5.1 standard. In addition, UFS 2.1's faster performance could effectively ensure the safe transmission of data without unnecessary lag caused by reading and writing operations, which is the key to the higher speed achieved in UFS 2.1. In addition to its huge advantages in transfer speed, BIWIN UFS 2.1 also has excellent power consumption characteristics.
Application:
Notebook / Smart Phone
Specification:
| Interface | UFS 2.1 / UFS 2.1 / UFS 3.1 |
| Dimensions | 11.50 × 13.00 mm |
| Max. Sequential Read | UFS 2.1: 500 MB/s |
| UFS 2.1: 500 MB/s | |
| UFS 3.1: 1200 MB/s | |
| Max. Sequential Write | UFS 2.1: 856 MB/s |
| UFS 2.1: 856 MB/s | |
| UFS 3.1: 300 MB/s | |
| Frequency | / |
| Capacity | UFS 2.1: 128 GB - 256 GB |
| UFS 2.1: 128 GB - 256 GB | |
| UFS 3.1: 128GB - 512GB | |
| Working Voltage | UFS 2.1: VCC=3.3 V, VCCQ=1.8 V |
| UFS 2.1: VCC=3.3 V, VCCQ=1.8 V | |
| UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V | |
| Working Temperature | -20℃ - 85℃ |
| Approved Verification Platforms | UFS 2.1: Qualcomm: 835, 845... |
| UFS 2.1: Qualcomm: 835, 845… | |
| UFS 3.1: Qualcomm, MediaTek... | |
| Packaging | FBGA153 |
| Application | Notebook / Smart Phone |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent
Year Established:
2006
Total Annual:
80 millions-500 millions
Employee Number:
20~200
Ecer Certification：
Verified Supplier
Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.Angel Technology provide one stop service for electronic components,PCB and PCB Assembly(SMT). The Mission Of Angel Technology Electronics Co h... Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.Angel Technology provide one stop service for electronic components,PCB and PCB Assembly(SMT). The Mission Of Angel Technology Electronics Co h...
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