Angel Technology Electronics Co
| Description | eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging |
| Stock | In Stock |
| Payment Terms | T/T, Western Union |
| Shipping Method | Express |
| Category | Electronic components-Memory |
| Family | BIWIN eSSD BGA IC Chip |
| Application | In-vehicle/ Notebook |
| Operating Temperature | Consumer Grade: 0℃ - 70℃ Industrial Grade: -25℃ - 85℃ |
| Selection Part numbers | BWS3BTCDC-60G BWS3BTCDC-120G |
| Product specifications Interface | eSSD is characterized by its low power consumption and since it's a non-volatile memory device |
| Dimensions | PCIe 4.0 x 2: 11.50 × 13.00 mm PCIe 3.0 x 2: 11.50 × 13.00 mm / 12.00 × 16.00 mm SATA III: 16.00 × 20.00 mm |
| Working Voltage | PCIe 4.0 x 2: VCC=2.5 V, VCCQ =1.2 V, VCCK=0.8 V PCIe 3.0 x 2: VCC=3.3 V, VCCQ =1.2 V, VCCK=0.9 V SATA III: VCC=3.3 V, VCCQ =1.8 V, VCCK=1.1 V |
| Capacity | PCIe 4.0 x 2: 256 GB - 1 TB PCIe 3.0 x 2: 128 GB - 256 GB SATA III: 32GB - 256 GB |
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Product Specification
| Description | eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging | Stock | In Stock |
| Payment Terms | T/T, Western Union | Shipping Method | Express |
| Category | Electronic components-Memory | Family | BIWIN eSSD BGA IC Chip |
| Application | In-vehicle/ Notebook | Operating Temperature | Consumer Grade: 0℃ - 70℃ Industrial Grade: -25℃ - 85℃ |
| Selection Part numbers | BWS3BTCDC-60G BWS3BTCDC-120G | Product specifications Interface | eSSD is characterized by its low power consumption and since it's a non-volatile memory device |
| Dimensions | PCIe 4.0 x 2: 11.50 × 13.00 mm PCIe 3.0 x 2: 11.50 × 13.00 mm / 12.00 × 16.00 mm SATA III: 16.00 × 20.00 mm | Working Voltage | PCIe 4.0 x 2: VCC=2.5 V, VCCQ =1.2 V, VCCK=0.8 V PCIe 3.0 x 2: VCC=3.3 V, VCCQ =1.2 V, VCCK=0.9 V SATA III: VCC=3.3 V, VCCQ =1.8 V, VCCK=1.1 V |
| Capacity | PCIe 4.0 x 2: 256 GB - 1 TB PCIe 3.0 x 2: 128 GB - 256 GB SATA III: 32GB - 256 GB |
BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook
Application:
In-vehicle / Notebook
eSSD is characterized by its low power consumption and since it's a non-volatile memory device, it can maintain stored data without power supply. It also has a wide range of operating temperature, high shock and vibration tolerance.
Specification:
| Interface | PCIe 4.0 x 2 |
| PCIe 3.0 x 2 | |
| SATA III | |
| Dimensions | PCIe 4.0 x 2: 11.50 × 13.00 mm |
| PCIe 3.0 x 2: 11.50 × 13.00 mm / 12.00 × 16.00 mm | |
| SATA III: 16.00 × 20.00 mm | |
| Max. Sequential Read | PCIe 4.0 x 2: 3500 MB/s |
| PCIe 3.0 x 2: 1900 MB/s | |
| SATA III: 470 MB/s | |
| Max. Sequential Write | PCIe 4.0 x 2: 3200 MB/s |
| PCIe 3.0 x 2: 650 MB/s | |
| SATA III: 350 MB/s | |
| Frequency | / |
| Capacity | PCIe 4.0 x 2: 256 GB - 1 TB |
| PCIe 3.0 x 2: 128 GB - 256 GB | |
| SATA III: 32GB - 256 GB | |
| Working Voltage | PCIe 4.0 x 2: VCC=2.5 V, VCCQ =1.2 V, VCCK=0.8 V |
| PCIe 3.0 x 2: VCC=3.3 V, VCCQ =1.2 V, VCCK=0.9 V | |
| SATA III: VCC=3.3 V, VCCQ =1.8 V, VCCK=1.1 V | |
| Working Temperature | Consumer Grade: 0℃ - 70℃ |
| Industrial Grade: -25℃ - 85℃ | |
| Approved Verification Platforms | / |
| Packaging | PCIe 4.0 x 2: FBGA345 |
| PCIe 3.0 x 2: FBGA291 / FBGA345 | |
| SATA III: FBGA157 | |
| Application | In-vehicle / Notebook |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent
Year Established:
2006
Total Annual:
80 millions-500 millions
Employee Number:
20~200
Ecer Certification：
Verified Supplier
Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.Angel Technology provide one stop service for electronic components,PCB and PCB Assembly(SMT). The Mission Of Angel Technology Electronics Co h... Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.Angel Technology provide one stop service for electronic components,PCB and PCB Assembly(SMT). The Mission Of Angel Technology Electronics Co h...
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