Angel Technology Electronics Co
| Description | BIWIN eMCP Chips is based on MCP (Multi-Chip Packaging) which integrates an eMMC chip and a low-power DRAM solution into |
| Stock | In Stock |
| Payment Terms | T/T, Western Union |
| Shipping Method | Express |
| Category | Electronic components-eMMC 5.1 |
| Family | BIWIN eMCP Chips |
| Frequency | LPDDR 2 / LPDDR 3: 533 MHz / 800 MHz / 1200 MHz |
| Application | In-vehicle Smart Phone |
| Operating Temperature | -20°C ~ 85°C |
| Selection Part numbers | BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP |
| Product specifications Interface | eMMC: eMMC 5.0 & eMMC 5.1 LPDDR 2 / LPDDR 3: 32bit |
| Dimensions | 11.50 × 13.00 mm |
| Working Voltage | eMMC: VCC=3.3 V VCCQ=1.8 V LPDDR 2: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V LPDDR 3: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V |
| Capacity | 8 GB + 4 Gb / 8 GB + 8 Gb 16 GB + 8 Gb / 16 GB + 16 Gb |
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Product Specification
| Description | BIWIN eMCP Chips is based on MCP (Multi-Chip Packaging) which integrates an eMMC chip and a low-power DRAM solution into | Stock | In Stock |
| Payment Terms | T/T, Western Union | Shipping Method | Express |
| Category | Electronic components-eMMC 5.1 | Family | BIWIN eMCP Chips |
| Frequency | LPDDR 2 / LPDDR 3: 533 MHz / 800 MHz / 1200 MHz | Application | In-vehicle Smart Phone |
| Operating Temperature | -20°C ~ 85°C | Selection Part numbers | BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP |
| Product specifications Interface | eMMC: eMMC 5.0 & eMMC 5.1 LPDDR 2 / LPDDR 3: 32bit | Dimensions | 11.50 × 13.00 mm |
| Working Voltage | eMMC: VCC=3.3 V VCCQ=1.8 V LPDDR 2: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V LPDDR 3: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V | Capacity | 8 GB + 4 Gb / 8 GB + 8 Gb 16 GB + 8 Gb / 16 GB + 16 Gb |
BIWIN eMCP Chips BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP IC
Application:
In-vehicle / Smart Phone
Description:
As the capacity of smart phone operating system and applications increases, especially with the increasing popularity of the Android operating system, smart phones have higher requirements of storage capacity. BIWIN's eMCP is based on MCP (Multi-Chip Packaging), which integrates an eMMC chip and a low-power DRAM solution into once IC package, effectively simplifying the manufacturing process and development cost of customers' products and shortening the development time of their products, thereby speeding up the launch of end products.
Specification:
| Interface | eMMC: eMMC 5.0 & eMMC 5.1 |
| LPDDR 2 / LPDDR 3: 32bit | |
| Dimensions | 11.50 × 13.00 mm |
| Max. Sequential Read | eMMC 5.0: 130 MB/s |
| eMMC 5.1: 300 MB/s | |
| Max. Sequential Write | eMMC 5.0: 50 MB/s |
| eMMC 5.1: 160 MB/s | |
| Frequency | LPDDR 2 / LPDDR 3: 533 MHz / 800 MHz / 1200 MHz |
| Capacity | 8 GB + 4 Gb / 8 GB + 8 Gb |
| 16 GB + 8 Gb / 16 GB + 16 Gb | |
| Working Voltage | eMMC: VCC=3.3 V VCCQ=1.8 V |
| LPDDR 2: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V | |
| LPDDR 3: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V | |
| Working Temperature | -20℃ to 85℃ |
| Approved Verification Platforms | Spreadtrum: 7731E, 9832E, 9820E, SC9850K, SC7731C, SC7731G, SC8825, SC9820, SC9832, SC9832A, SC9832E, SC9850, SC9853, SC9863A… |
| Qualcomm: 8909, APQ8009W, MSM8909W… | |
| MediaTek: MT6580, MT6735, MT6737, MT6739, MT6761, MT6570, MT6570N, MT6572, MT6735... | |
| Packaging | FBGA162 / FBGA221 |
| Application | In-vehicle / Smart Phone |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent
Year Established:
2006
Total Annual:
80 millions-500 millions
Employee Number:
20~200
Ecer Certification：
Verified Supplier
Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.Angel Technology provide one stop service for electronic components,PCB and PCB Assembly(SMT). The Mission Of Angel Technology Electronics Co h... Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.Angel Technology provide one stop service for electronic components,PCB and PCB Assembly(SMT). The Mission Of Angel Technology Electronics Co h...
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