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The 3M CF Card Header, CompactFlash Type I, Low Profile, Surface Mount 7E50 Series is designed for reliable data connectivity in industrial applications. This header features a 4.0 mm low profile height, a single row of solder tails with 0.635 mm spacing, and an ejector option for easy CompactFlash card removal. It meets CFA standards and offers robust physical, electrical, and environmental characteristics suitable for demanding environments.
Product Attributes
Brand: 3M
Product Line: Interconnect Solutions
Series: 7E50 Series
Compatibility: CompactFlash Type I
Mounting Type: Surface Mount
Insulation Material: Liquid Crystal Polymer (LCP)
Insulation Color: Beige
Contact Material: Copper Alloy
Underplating: 100 [ 2.54 m ] Nickel
Wiping Area Plating: Gold Flash over 80/20 Palladium Nickel, Lubricated
Solder Tails Plating: Gold Flash
Flammability: UL 94V-0
Marking: 3M Logo, Part Number, Date Code
Certifications: UL File No.: E68080
RoHS Compliance: Compliant with EU RoHS Directive 2002/95/EC (with specific exemptions for lead and decaBDE as noted in Regulatory Information Appendix)
Technical Specifications
Specification
Value
Low Profile Height
4.0 mm
Solder Tail Spacing
0.635 mm
Current Rating
0.5 A
Insulation Resistance
> 1 109 at 500 VDC; > 1 108 at 500 VDC after Environmental Conditioning
Withstanding Voltage
500 VRMS at Sea Level
Temperature Rating
-55C to +85C
Process Rating
Maximum 260C (per J-STD-020C)
Pin Dim A (Detect)
3.50 [ .138 ]
Pin Dim A (General)
4.25 [ .167 ]
Pin Dim A (Power)
5.00 [ .197 ]
Dimensions (Overall Length)
30.48 [ 1.200 ]
Dimensions (Overall Width)
38.74 [ 1.525 ]
Dimensions (Installed Height)
4.0 [ .16 ]
Ejector Pushing Length
4.1 [ .16 ]
Ejector Ejecting Length
7.0 [ .28 ]
Ejector Sliding Length
7.0 [ .28 ]
Ordering Information Example: N7E50-X516XX-30
Options:
CF Card Polarization / Solder Tabs / Ejector: A = Inverse / with solder tab / ejector acceptable; C = Normal / without solder tab / ejector not acceptable; D = Normal / with solder tab / ejector not acceptable; E = Normal / with solder tab / ejector acceptable
Plating: PG = Au Flash over 25 m" [0.64 mm] PdNi Lubricated with Au Flash tails (Available for "D" product option only); PK = Au Flash over 20 " [0.5 m] PdNi Lubricated with Au flash tails
Recommended PCB Solder Pad Pattern Dimensions: Provided in detailed diagrams.
Regulatory Information Appendix:
E1: EU RoHS Directive 2002/95/EC - Product is RoHS Compliant 2005/95/EC.
E2: EU RoHS Directive 2002/95/EC - Contains lead in compliant pin area in excess of maximum concentration value, compliant by exemption under EU Commission Decision 2005/747/EC.
E3: EU RoHS Directive 2002/95/EC - Contains lead in solder tail area in excess of maximum concentration value.
E4: EU RoHS Directive 2002/95/EC - Contains decaBDE in insulating material in excess of maximum concentration value, compliant by exemption under EU Commission Decision 2005/17/EC.
C1: China RoHS - Product or part does not contain specified hazardous substances in excess of maximum concentration values (0.1% or 0.01%).
C2: China RoHS - Product or part does contain specified hazardous substances in excess of maximum concentration values.
Warranty: Product will be free from defects in material and manufacture for a period of one (1) year from the time of purchase. 3M MAKES NO OTHER WARRANTIES INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
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&nbs... Beijing Silk Road Enterprise Management Services Co.,LTD is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and manufacture.
&nbs...