HK NeoChip Technology Limited
| Category | RF and Wireless RFI and EMI - Shielding and Absorbing Materials |
| Adhesive | - |
| Product Status | Active |
| Thickness - Overall | - |
| Package | Bulk |
| Series | CHO-BOND® 1121 |
| Material | Silicone |
| Mfr | Parker Chomerics |
| Shelf Life Start | Date of Manufacture |
| Width | - |
| Shape | - |
| Length | - |
| Shelf Life | 12 Months |
| Storage/Refrigeration Temperature | 77°F (25°C) |
| Operating Temperature | - |
| Type | EMI Conductive Sealant |
| Base Product Number | 50-01 |
| Description | SILVER COPPER EMI SEALANT 454G |
| Stock | In Stock |
| Shipping Method | LCL, AIR, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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Product Specification
| Category | RF and Wireless RFI and EMI - Shielding and Absorbing Materials | Adhesive | - |
| Product Status | Active | Thickness - Overall | - |
| Package | Bulk | Series | CHO-BOND® 1121 |
| Material | Silicone | Mfr | Parker Chomerics |
| Shelf Life Start | Date of Manufacture | Width | - |
| Shape | - | Length | - |
| Shelf Life | 12 Months | Storage/Refrigeration Temperature | 77°F (25°C) |
| Operating Temperature | - | Type | EMI Conductive Sealant |
| Base Product Number | 50-01 | Description | SILVER COPPER EMI SEALANT 454G |
| Stock | In Stock | Shipping Method | LCL, AIR, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | ||
| High Light | integrated circuits with warranty ，50-01-1121-0000 IC chip ，electronic components IC | ||
Company Details
Business Type:
Distributor/Wholesaler
Year Established:
2025
Total Annual:
100000-500000
Employee Number:
50~70
Ecer Certification：
Verified Supplier
HK NeoChip Technology Limited HK NeoChip Technology Limited
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