Shenzhen Tengshengda ELECTRIC CO., LTD.
Products
Manufacturer of a wide range of products which include Cinty Integrated Circuits Electronic Components Ic EP4CE30F29C8N,EP4CE6E22C8N QFP144 IC Microcontroller,SKM100GB063D,etc
MOQ: 2
Price:
| Payment Terms | T/T, L/C, Western Union |
| Supply Ability | 80000 Piece/Pieces per Month |
| Delivery Time | 5-8 work days |
| Packaging Details | ESD/Vacuum/Foam/Cartons |
| Type | integrated circuit |
| Series | ST |
| Description | SUPERVISOR, Micro controller |
| Interface | Internal |
| Applications | General Purpose |
| Operating Temperature | -40°C ~ + 125 C |
| Brand Name | Original brand |
| Model Number | EP4CE30F29C8N |
| Certification | Lead free / RoHS Compliant |
| Place of Origin | China |
MOQ: 2
Price:
| Payment Terms | T/T, L/C, Western Union |
| Supply Ability | 80000 Piece/Pieces per Month |
| Delivery Time | 3-8 work days |
| Packaging Details | Standard |
| Type | integrated circuit |
| Series | EP4CE6E22C8N |
| Description | SUPERVISOR, Micro controller |
| Interface | Internal |
| Applications | General Purpose |
| Operating Temperature | -40°C ~ + 125 C |
| Brand Name | Original brand |
| Model Number | EP4CE6E22C8N |
| Certification | Lead free / RoHS Compliant |
| Place of Origin | China |
MOQ:
Price:
| Description | Superfast NPT-IGBT Module |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Package : | MOUDLE |
| Packaging : | Box |
| Product Category : | semiconductors-Integrated Circuits - ICs |
| RoHS : | ROHS compliant |
MOQ:
Price:
| Category | Integrated Circuits (ICs) Embedded DSP (Digital Signal Processors) |
| Type | Fixed/Floating Point |
| Product Status | Discontinued at Digi-Key |
| On-Chip RAM | 320kB |
| Mounting Type | Surface Mount |
| Package | Tube |
| Series | TMS320C674x |
| Clock Rate | 375MHz |
| Voltage - I/O | 3.30V |
| Supplier Device Package | 256-BGA (17x17) |
| Mfr | Texas Instruments |
| Operating Temperature | 0°C ~ 90°C (TJ) |
| Package / Case | 256-BGA |
| Interface | EBI/EMI, Ethernet MAC, I²C, McASP, SPI, UART |
| Voltage - Core | 1.20V |
| Non-Volatile Memory | External |
| Base Product Number | TMS320 |
| Description | IC DSP FIX/FLOAT POINT 176HLQFP |
| Stock | In Stock |
| Shipping Method | LCL, AIR, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
MOQ:
Price:
| Package / Case : | 1517-BBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 570K Logic Elements |
| Speed : | 1.5GHz |
| Supplier Device Package : | 1517-FCBGA (40x40) |
| Flash Size : | - |
| RAM Size : | 256kB |
| Connectivity : | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | 0°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Product status : | Discontinued at Digi-Key |
| Peripherals : | DMA, POR, WDT |
| Series : | Arria 10 SX |
| Manufacturer : | Intel |
| Description | IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
MOQ:
Price:
| Package / Case : | 1517-BBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 350K Logic Elements |
| Speed : | 800MHz |
| Supplier Device Package : | 1517-FBGA, FC (40x40) |
| Flash Size : | - |
| RAM Size : | 64kB |
| Connectivity : | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Product status : | Obsolete |
| Peripherals : | DMA, POR, WDT |
| Series : | Arria V SX |
| Manufacturer : | Intel |
| Description | IC SOC CORTEX-A9 800MHZ 1517FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
MOQ:
Price:
| Package / Case : | 325-TFBGA, CSPBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 25K Logic Modules |
| Speed : | 166MHz |
| Supplier Device Package : | 325-CSPBGA (11x11) |
| Flash Size : | 256kB |
| RAM Size : | 64kB |
| Connectivity : | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | ARM® Cortex®-M3 |
| Product status : | Active |
| Peripherals : | DDR, PCIe, SERDES |
| Series : | SmartFusion®2 |
| Manufacturer : | Microchip Technology |
| Description | IC SOC CORTEX-M3 166MHZ 325BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
MOQ:
Price:
| Package / Case : | 672-FBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 40K Logic Elements |
| Speed : | 700MHz |
| Supplier Device Package : | 672-UBGA (23x23) |
| Flash Size : | - |
| RAM Size : | 64kB |
| Connectivity : | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | -40°C ~ 125°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Product status : | Active |
| Peripherals : | DMA, POR, WDT |
| Series : | Automotive, AEC-Q100, Cyclone® V SE |
| Manufacturer : | Intel |
| Description | IC SOC CORTEX-A9 700MHZ 672UBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
MOQ:
Price:
| Package / Case : | - |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | - |
| Speed : | 2.4GHz, 5GHz |
| Supplier Device Package : | - |
| Flash Size : | - |
| RAM Size : | - |
| Connectivity : | - |
| Operating Temperature : | - |
| Package : | Tray |
| Architecture : | - |
| Core Processor : | - |
| Product status : | Active |
| Peripherals : | - |
| Series : | - |
| Manufacturer : | Broadcom Limited |
| Description | CABLE MODEM |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
MOQ:
Price:
| Package / Case : | 1760-BBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Speed : | 600MHz, 667MHz, 1.5GHz |
| Supplier Device Package : | 1760-FCBGA (42.5x42.5) |
| Flash Size : | - |
| RAM Size : | 256kB |
| Connectivity : | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | 0°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Product status : | Active |
| Peripherals : | DMA, WDT |
| Series : | Zynq® UltraScale+™ MPSoC EG |
| Manufacturer : | Xilinx Inc |
| Description | IC SOC CORTEX-A53 1760FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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