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System On Chip (SoC)

Manufacturer of a wide range of products which include ATECC608A-MAHDA-S,TLE9104SHXUMA1,XA7Z020-1CLG400Q,etc

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Category Integrated Circuits (ICs) Specialized ICs
Product Status Active
Digi-Key Programmable Not Verified
Mounting Type Surface Mount
Package Tape & Reel (TR) Cut Tape (CT) Digi-Reel®
Series CryptoAuthentication™
Supplier Device Package 8-UDFN (2x3)
Applications Networking and Communications
Mfr Microchip Technology
Package / Case 8-UFDFN Exposed Pad
Type Authentication Chip
Base Product Number ATECC608
Description IC AUTHENTICATION CHIP 8UDFN
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Specialized ICs
Product Status Active
Digi-Key Programmable Not Verified
Mounting Type Surface Mount
Package Tape & Reel (TR) Cut Tape (CT) Digi-Reel®
Series Automotive, AEC-Q100
Supplier Device Package PG-DSO-20-88
Applications -
Mfr Infineon Technologies
Package / Case 20-BFSOP (0.295", 7.50mm Width) Exposed Pad
Type Powertrain Switch
Base Product Number TLE9104
Description IC POWERTRAIN SWITCH DSO20-88
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XA7Z020
Product Status Active
Peripherals DMA
Primary Attributes Artix™-7 FPGA, 85K Logic Cells
Series Automotive, AEC-Q100, Zynq®-7000 XA
Package Tray
Mfr AMD
Supplier Device Package 400-CSPBGA (17x17)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 125°C (TJ)
Architecture MCU, FPGA
Package / Case 400-LFBGA, CSPBGA
Number of I/O 130
RAM Size 256KB
Speed 667MHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 667MHZ 400BGA
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Primary Attributes FPGA - 2500K Logic Elements
Series Stratix® 10 SX
Package Tray
Mfr Intel
Supplier Device Package 2912-FBGA, FC (55x55)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 2912-BBGA, FCBGA
Peripherals DMA, WDT
RAM Size 256KB
Speed 1.5GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
Description IC FPGA STRATIX 10 2912FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DDR, DMA, PCIe
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Series Versal™ Prime
Package Tray
Mfr AMD
Supplier Device Package 1369-BGA (35x35)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MPU, FPGA
Package / Case 1369-BFBGA
Number of I/O 424
RAM Size 256KB
Speed 600MHz, 1.3GHz
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
Description IC VERSALPRIME ACAP FPGA 1369BGA
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S060
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 60K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 325-FCBGA (11x11)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 325-TFBGA, FCBGA
Number of I/O 200
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 325BGA
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number A2F060M3E
Product Status Obsolete
Peripherals DMA, POR, WDT
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Series SmartFusion®
Package Tray
Mfr Microsemi Corporation
Supplier Device Package 256-FPBGA (17x17)
Connectivity EBI/EMI, I²C, SPI, UART/USART
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 256-LBGA
Number of I/O MCU - 26, FPGA - 66
RAM Size 16KB
Speed 80MHz
Core Processor ARM® Cortex®-M3
Flash Size 128KB
Description IC SOC CORTEX-M3 80MHZ 256FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number A2F200
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Series SmartFusion®
Package Tray
Mfr Microchip Technology
Supplier Device Package 256-FPBGA (17x17)
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 256-LBGA
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Speed 100MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 100MHZ 256FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XC7Z014
Product Status Active
Peripherals DMA
Primary Attributes Artix™-7 FPGA, 65K Logic Cells
Series Zynq®-7000
Package Tray
Mfr AMD
Supplier Device Package 400-CSPBGA (17x17)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 400-LFBGA, CSPBGA
Number of I/O 125
RAM Size 256KB
Speed 667MHz
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 667MHZ 400BGA
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S060
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 60K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 325-FCBGA (11x11)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 325-TFBGA, FCBGA
Number of I/O 200
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 325BGA
Stock In Stock
Shipping Method LCL, AIR, FCL
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram

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