Shenzhen Hongxinwei Technology Co., Ltd
Products
Manufacturer of a wide range of products which include 8K Ultra HD Mobile Camera SOC 10 Bit H.265 HISILICON HI3559ARFCV100,High Performance SONY Camera Soc Home Security Camera Soc CXD4145GG,24 BIT Transmitter Chip With EGA VGA W...
MOQ: 10PCS
Price: Negotiation
| Payment Terms | T/T, Western Union |
| Supply Ability | 10000PCS |
| Delivery Time | 2-3DAYS |
| Packaging Details | TRY |
| Type | Video Decoder PGA256 |
| Application | video recorder |
| Date code | 2018 |
| Brand Name | HISILICON |
| Model Number | HI3559ARFCV100 |
| Certification | ＲＯＳＨ |
| Place of Origin | ＣＮ |
MOQ: 1PCS
Price: Negotiation
| Payment Terms | T/T, Western Union |
| Supply Ability | 11900PCS/MONTH |
| Delivery Time | 5-10DAYS |
| Packaging Details | 1190PCS/BOX |
| Product Name | IP Camera Soc |
| Brand Name | SONY |
| Model Number | CXD4155GG CXD4145GG |
| Certification | ROHS |
| Place of Origin | TAIWAN |
MOQ: 1250PCS
Price: Negotiation
| Payment Terms | T/T, Western Union |
| Supply Ability | 3750PCS/MONTH |
| Delivery Time | 3-5DAYS |
| Packaging Details | 1250PCS/BOX |
| Product Name | Transmitter Chip |
| Brand Name | SONY |
| Model Number | CXB1457R |
| Certification | ROHS |
| Place of Origin | JAPAN |
MOQ: 10pcs
Price: Negotiation
| Payment Terms | T/T, Western Union |
| Supply Ability | 18600pcs |
| Delivery Time | 2-3days |
| Packaging Details | tray |
| Body size | 12 mm x 12 mm (0.47 in. x 0.47 in.) |
| ball pitch | 0.65 mm (0.03 in.)TFBGA 273 pins |
| Operating voltages | 1.35 V or 1.5 V DDR3/3L SDRAM |
| date code | 2019 |
| Brand Name | HISILICON |
| Model Number | HI3516CRBCV300 |
| Certification | Rosh |
| Place of Origin | China |
MOQ: 10pcs
Price: Negotiation
| Payment Terms | T/T, Western Union |
| Supply Ability | 5000pcs |
| Delivery Time | 2-3dys |
| Packaging Details | tray |
| Body size | 12 mm x 12 mm (0.47 in. x 0.47 in.) |
| ball pitch | 0.65 mm (0.03 in.)TFBGA 273 |
| Operating voltages | 0.9 V core voltage 3.3 V±10% I/O voltage 1.35 V or 1.5 V DDR3/3L SDRAM |
| date code | 2019 |
| Brand Name | HISILICON |
| Model Number | HI3516CV300 |
| Certification | Rosh |
| Place of Origin | China |
MOQ: 10PCS
Price: Negotiation
| Payment Terms | T/T, Western Union |
| Supply Ability | 4500PCS |
| Delivery Time | 2-3DAYS |
| Packaging Details | TRAY |
| Body size | 27 mm x 27 mm (1.06 in. x 1.06 in.) |
| Ball pitch | 0.8 mm (0.03 in.) |
| Package | RoHS, EDHS-PBGA |
| Operating temperature | 0°C (32°F) t~ 70°C (158°F) |
| Brand Name | HISILICON |
| Model Number | HI3531RFCV100 |
| Certification | Rosh |
| Place of Origin | China |
MOQ: 10pcs
Price: Negotiation
| Payment Terms | T/T, Western Union |
| Supply Ability | 3000pcs |
| Delivery Time | 2-3days |
| Packaging Details | tray |
| Body size | Body size of 12 mm x 12 mm (0.47 in. x 0.47 in.) |
| ball pitch | 0.65 mm (0.03 in.) ball pitch,TFBGA RoHS package with 280 pins |
| Power consumption | Typical power consumption at 1080p@30 fps: 900 mW |
| Operating voltage | 0.9 V core voltage,3.3 V I/O voltage (±10%),1.5 (1.35) V/1.2 V DDR3(L)/4 SDRAM |
| Brand Name | HISILICON |
| Model Number | HI3516ARFCV200 |
| Certification | Rosh |
| Place of Origin | China |
MOQ: 10PCS
Price: Negotiation
| Payment Terms | Western Union, T/T |
| Supply Ability | 5000PCS |
| Delivery Time | 2-3DAYS |
| Packaging Details | TRAY |
| Body size | 38mm*38mm |
| PHY | RM II 100M |
| DDR | 2G/16BIT DDR |
| FLASH | SPI nor flash 16MB |
| Operating temperature | 0°C–70°C |
| Brand Name | Hisilicon |
| Model Number | HI3519RFCV101 |
| Certification | Rosh |
| Place of Origin | China |
MOQ: 2000PCS
Price: Negotiation
| Payment Terms | T/T |
| Supply Ability | 10000PCS+2WEEKS |
| Delivery Time | 2WEEKS |
| Packaging Details | 50PCS/BAG+400PCS/BOX |
| Brand Name | HXW |
| Model Number | USB5PIN04160W |
| Certification | ROHS |
| Place of Origin | CHINA |
MOQ: 10pcs
Price: Negotiation
| Payment Terms | T/T, Western Union |
| Supply Ability | 6000PCS/MONTH |
| Delivery Time | 3-5DAYS |
| Packaging Details | TRAY |
| Body size | 15 mm x 15 mm (0.59 in. x 0.59 in.) |
| Lead pitch | 0.65 mm and 0.4 mm hybrid pitch |
| Operating temperature | 0°C–70°C |
| voltage | 0.8 V core voltage,1.8 V or 3.3 V I/O voltage |
| interface voltage | 1.2 V DDR4 SDRAM ,1.1 V LPDDR4 SDRAM |
| Brand Name | HISILICON |
| Model Number | Hi3519AV100 |
| Certification | Rohs |
| Place of Origin | China |
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