Shanghai Huitian New Material Co., Ltd
| Payment Terms | L/C,T/T |
| Supply Ability | 2000T/Month |
| Delivery Time | 5-8 days |
| Packaging Details | 20kg/barrel |
| Physical Form | Paste |
| Color Part A | Gray fluid |
| Color Part B | White fluid |
| Viscosity Part A | 8,000~14,000 mPa·s |
| Viscosity Part B | 70,00~13,000 mPa·s |
| Mixing Ratio | 1:1 |
| Opearting Time @25 °C | ≥60 |
| Curing Time @80℃ | ≤30 mins |
| Hardness (Shore A) | 20-45 |
| Volume resistivity | 1.0*10^12 Ω∙cm |
| Dielectric strength | ≥14 KV/mm |
| Thermal Conductivity | 2.4-2.6 W/(m•K) |
| Brand Name | HUITIAN |
| Model Number | 5292 |
| Certification | RoHS REACH |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | L/C,T/T | Supply Ability | 2000T/Month |
| Delivery Time | 5-8 days | Packaging Details | 20kg/barrel |
| Physical Form | Paste | Color Part A | Gray fluid |
| Color Part B | White fluid | Viscosity Part A | 8,000~14,000 mPa·s |
| Viscosity Part B | 70,00~13,000 mPa·s | Mixing Ratio | 1:1 |
| Opearting Time @25 °C | ≥60 | Curing Time @80℃ | ≤30 mins |
| Hardness (Shore A) | 20-45 | Volume resistivity | 1.0*10^12 Ω∙cm |
| Dielectric strength | ≥14 KV/mm | Thermal Conductivity | 2.4-2.6 W/(m•K) |
| Brand Name | HUITIAN | Model Number | 5292 |
| Certification | RoHS REACH | Place of Origin | CHINA |
| High Light | gray addition-type potting material ，thermal conductive potting compound ，UL94V-0 electronic potting material | ||
Huitian® 5292 Two-Part Addition-Type Potting Material: Advanced Solution for Electronic Encapsulation
Product Description
5292 is a high-performance two-part addition-type potting silicone rubber designed for critical electronic and electrical applications. With a 1:1 mixing ratio by weight, this adhesive offers exceptional versatility, curing at room temperature or through heat acceleration, making it ideal for demanding environments that require reliable insulation, thermal management, and mechanical protection.
Product Applications
5292 is widely used in:
Electronic & Electrical Components: Potting of inverters, military power supplies, communication power supplies, and instrumentation components.
Industrial Equipment: Protection against moisture, fouling, corrosion, vibration, and electrical interference.
PCB & Metal Substrates: Bonding and sealing for glass, PCBs, aluminum, and other materials without the need for a primer.
Key Product Features
High Thermal Conductivity: Achieves 2.4–2.6 W/m·K (ASTM D5470), ensuring efficient heat dissipation for components.
Flame Retardancy: Meets UL94V-0 standards, providing enhanced safety in high-temperature applications.
Dual Curing Mechanism: Cures at room temperature or speeds up with heat (e.g., ≤30 min at 80°C), suitable for various production schedules.
Excellent Insulation: Volume resistivity ≥1×10¹² Ω·cm and dielectric strength ≥14 kV/mm, ensuring reliable electrical isolation.
Wide Temperature Resistance: Maintains rubber elasticity from -40°C to 200°C, suitable for extreme environmental conditions.
Superior Weather & Aging Resistance: Withstands harsh climates and prolonged use without degradation.
Primer-Free Bonding: Adheres directly to glass, PCBs, aluminum, and other substrates, simplifying application.
User-Friendly Operation: Operating time ≥60 min at 25°C allows for precise handling and defoaming.
Technical Parameters
| Reference standard | Item | Unit | Value |
| Physical properties before curing (25±2℃, 60%±5%RH) | |||
| Q/HTXC 2 | Appearance (A) | -- | Gray fluid |
|
| Appearance (B) | -- | White fluid |
| GB/T2794 | Viscosity (A) | mPa·s | 8,000~14,000 |
|
| Viscosity (B) | mPa·s | 70,00~13,000 |
| GB/T2794 | Mix viscosity(1:1) | mPa·s | 8,000~14,000 |
| Physical properties after curing (25±2℃, 60±5%RH, A:B=1:1) | |||
| Q/HTXC 2 | Operating time (25℃) | min | ≥60 |
| Q/HTXC 2 | Cure time (80℃) | min | ≤30 |
| GB/T 2411 | Density | g/cm3 | 2.7-3.0 |
| GB/T 4509 | Hardness | Shore A | 20-45 |
| GB/T 1695 | Dielectric strength | KV/mm | ≥14 |
| GB/T 1692 | Volume resistivity | Ω·cm | ≥1×1012 |
| ASTM D5470 | Thermal conductivity | W/m·K | 2.4-2.6 |
| ISO 22007 | Thermal conductivity | W/m·K | ≥2.3 |
Directions for Use
Preparation: Stir Components A and B thoroughly (manually or mechanically) to prevent performance issues from filler settlement.
Mixing: Weigh components accurately at a 1:1 ratio, combine in a clean container, and stir until homogeneous.
Defoaming: Apply vacuum (0.08–0.1 MPa) for 10–20 min to remove air bubbles before potting.
Potting: Ensure application surfaces are clean and dry. Pot while the adhesive is still fluid to avoid leveling issues.
Curing:
Room Temperature: Cure naturally (accelerated by higher temperatures).
Heat Curing: Recommended in winter; cure at 80°C for ≤30 min.
Packaging & Storage Conditions
Packaging:
part A (5292 A8): 20 kg/barrel
Part B (5292 B8): 20 kg/barrel
Storage: Store in a cool, dry place at 8–28°C, sealed to prevent contamination.
Shelf Life: 6 months when stored as directed.
Company Details
Business Type:
Manufacturer,Importer,Exporter,Seller
Year Established:
1977
Total Annual:
580,000,000-620,000,000
Employee Number:
1800~2000
Ecer Certification：
Verified Supplier
Huitian New Material (stock code: 300041) is the oldest enterprise in China's adhesive & new material industry, with 46 years of development history, focusing on research and development, constantly breaking through the innovative technology of adhesive new material, taking the lead in solvi... Huitian New Material (stock code: 300041) is the oldest enterprise in China's adhesive & new material industry, with 46 years of development history, focusing on research and development, constantly breaking through the innovative technology of adhesive new material, taking the lead in solvi...
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