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Wuhan SensorMicro Technology Co., Ltd

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China VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm
China VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm

  1. China VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm
  2. China VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm

VOx High Resolution Thermal Camera Module Uncooled LWIR 1280x1024 / 12μm

  1. MOQ: 1 Piece
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms L/C,T/T
Resolution 1280x1024/12μm
NETD <50mK
Spectral Range 8~14μm
Size 20x20x10.4mm
Brand Name SensorMicro
Model Number PLUG1212R
Certification ISO9001:2015; RoHS; Reach
Place of Origin Wuhan, Hubei Province, China

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  1. Product Details
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Product Specification

Payment Terms L/C,T/T Resolution 1280x1024/12μm
NETD <50mK Spectral Range 8~14μm
Size 20x20x10.4mm Brand Name SensorMicro
Model Number PLUG1212R Certification ISO9001:2015; RoHS; Reach
Place of Origin Wuhan, Hubei Province, China
High Light VOx Thermal Camera Module 12umLWIR Thermal Camera Module 1280x1024VOx LWIR Camera Module
PLUG1212 Infrared Camera Module


VOx Uncooled LWIR 1280x1024 / 12μm Thermal Camera Module for Industrial Temperature Measurement


Product Description


PLUG1212R is one of the PLUG-R series uncooled infrared camera module developed by SensorMicro. It adopts the market preferred focal plane array VOx microbolometer uncooled infrared detector, professional signal processing circuit and image processing platform, completely transforms the target infrared radiation into temperature data. Its temperature measurement is available and temperature range can be customizable raging from -20℃~150 ℃ for industrial temperature measurement.


With large array 1280x1024 resolution, the PLUG1212R uncooled thermal module could present more image details and supports larger field of view. The reduced 12µm pixel size offer better spatial resolution and match shorter optical lens focus to achieve the same range mission.


Main Features


- Pixel pitch: 12μm

- Resolution: 1280x1024

- Spectra Range: 8μm -14μm

- High Sensitivity: NETD<30mK

- Temperature Range: -20℃~150℃, 100℃~550℃

- Temperature Accuracy: ±2℃ or ±2%

- High reliability & Strong Environmental Adaptability.


Product Specifications


Model PLUG1212R
IR Detector Performance
Resolution 1280x1024
Pixel Pitch 12μm
Spectral Range 8~14μm
NETD <30mk
Image Processing
Frame Rate 25Hz
Start-up Time <25s
Analog Video /
Digital Video HDMI/RAW/YUV/BT1120
Extension Component USB/Camerlink
Dimming Mode Linear/Histogram/Mixed
Digital Zoom 1~8X Continual Zoom, Step Size 1/8
Image Display Black Hot/White Hot/Pseudo Color
Image Direction Horizontally/Vertically/Diagonally Flip
Image Algorithm NUC/AGC/IDE
Electrical Specification
Standard External Interface 50pin_HRS Interface
Communication Mode RS232-TTL, 115200bps
Supply Voltage 5±0.5V
Temperature Measurement
Operating Temperature Range -10°C~50°C
Temperature Range -20°C~150°C, 100°C~550°C
Temperature Accuracy ±2°C or ±2% (Take the Maximum Value)
SDK ARM/Windows/Linux SDK, Full Screen Thermography
Physical Characteristics
Dimension (mm) 56x56x40.2
Weight ≤200g
Environmental Adaptation
Operation Temperature -40°C ~ +70°C
Storage Temperature -45°C ~ +85°C
Humidity 5%~95%, Non-condensing
Vibration Random Vibration 5.35grms, 3 Axis
Shock Half-sine Wave, 40g/11ms, 3 Axis 6 Direction
Optics
Optional Lens Fixed Focus Athermal: 19mm/25mm


Industrial Applications


The PLU1212R infrared imaging module is widely used in Power Electricity, Machine Vision, Building Inspection, Metallurgical Petrochemical etc.


Our Core Infrared Detectors



FAQs


1. About ceramic packaging infrared detector

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.


2. Wafer Level Packaging

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.

It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2013

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Focusing on infrared thermal imaging technology, SensorMicro is committed to the in-depth development and continuous improvement of infrared products and application solutions. SensorMicro specializes in providing a comprehensive portfolio of core products, including high-performance cooled and unco... Focusing on infrared thermal imaging technology, SensorMicro is committed to the in-depth development and continuous improvement of infrared products and application solutions. SensorMicro specializes in providing a comprehensive portfolio of core products, including high-performance cooled and unco...

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  • Wuhan SensorMicro Technology Co., Ltd
  • No. 9 Qiming 1st Road, East Lake High-tech Development Zone, Wuhan 430205, P.R.China
  • https://www.infraredcore.com/

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