LWIR Thermal Imaging Module with 384x288 Resolution and 12μm Pixel Pitch for

The iSE412 thermal camera module integrates a 384×288/12µm ceramic package uncooled infrared detector. Ceramic packaging is a mature infrared detector packaging technology that significantly reduces the volume and weight of the packaged detector.

The iSE412 thermal module features compact design, lightweight structure, and power consumption as low as 0.8W. With enhanced image algorithms, it delivers exceptionally smooth thermal imaging performance.

This module supports super-resolution algorithms, picture-in-picture, customizable OSD, sleep mode, electronic zoom, and one-click calibration. It's compatible with multiple lenses, video interfaces, and Micro OLED displays. With compact 25.4×25.4×22.7mm dimensions and ≤26g bare core weight, it provides stable thermal imaging in limited spaces. Widely applied in industrial vision, firefighting rescue, security surveillance, outdoor observation, machine vision, and consumer electronics.

• Shutterless Design for Smoother Viewing
  • No shutter calibration required during operation, eliminating image stuttering common in traditional shutter-based systems
  • Silent operation ensures discreet use without mechanical noise
• Compact and Lightweight, Flexible for Integration
  • Total system dimensions as small as 25.4×25.4×22.7 mm, bare core weight ≤26±1.5g
  • Space-saving structural design allows flexible system layout and integration
• Feature-Rich, Seamless Integration
  • Supports super-resolution algorithms, picture-in-picture, customizable OSD, sleep mode, one-click calibration, and compatibility with various Micro OLED displays
  • Compatible with multiple optical lenses and extension components for easy secondary development and system customization

The iSE412 thermal imaging module is applied in the field of Industrial Vision, Firefighting and Rescue, Security Surveillance, Outdoor Observation, Machine Vision, Consumer Electronics, and more.

• Deep Technical Expertise - With many years of experience in the research, development, and application of infrared sensor technology, we have built strong capabilities across chip design, wafer fabrication, packaging and testing, as well as system integration.
• Focused on Innovation and Practical Implementation - We are committed to driving technological breakthroughs in thermal imaging, constantly pushing the boundaries in NETD, SWaP, and operating temperature.
• Diversified Product Portfolio - Backed by independent R&D and multiple technical pathways, we offer a comprehensive range of infrared detection components.
• Rigorous Reliability Validation - Supported by a robust quality management system, our products undergo multiple testing procedures to ensure long-term stability and reliability.
• Professional Technical Support - Our engineering team works closely with customers' R&D and product teams to accelerate system integration and improve efficiency.