Uncooled Microbolometer Thermal Camera Core with 1280×1024 Resolution and 12μm

Equipped with a 1280*1024 resolution, 12μm pixel pitch wafer-level infrared detector, the COIN1212 infrared camera core integrates sophisticated signal processing hardware and optimized imaging algorithms to ensure accurate thermal perception and high-definition image output. It features comprehensive compatibility with mainstream serial communication protocols, flexible multi-format video output (DVP, BT.1120) and configurable RAW/YUV data output with serial port control. Boasting wide-field long-range imaging and fine-detail close-range detection capabilities, the modular design greatly reduces secondary development difficulty, serving as a reliable core solution for industrial, transportation, infrastructure and scientific research thermal imaging systems.

• High-Definition Imaging, Precise Detection - 1280*1024/12μm megapixel resolution enables wide field-of-view and long-range HD imaging. Captures fine target details clearly during close-range observation.
• Full-Featured and Cost-Effective - Built with an industry-leading large-format wafer-level infrared detector. Integrated with advanced image processing algorithms to enhance image clarity and visual quality.
• Rapid Integration, Accelerated Development - Supports multiple image output interfaces including DVP and BT.1120. Outputs RAW/YUV image data with serial port control.

The COIN1212 thermal imaging module is applied in the field of Key Infrastructure Monitoring, High-end Manufacturing, Industrial Inspection, Scientific Research etc.

• Product Customization: Adjust configurations and adapt algorithms to meet industry-specific requirements
• On-Site Technical Support & Training: Provide core customers with hands-on system setup and operational training
• Joint Innovation for New Products & Markets: Collaborate with customers to co-develop innovative infrared application solutions

Infrared detectors work by sensing electromagnetic radiation in the infrared range. The exact mechanism of detection varies depending on the type of infrared detector.

Thermal detectors work by measuring the temperature change caused by absorbing the infrared radiation. For example, microbolometers consist of a matrix of tiny resistive elements that are sensitive to heat. When infrared radiation is absorbed by the detector, it causes the temperature of the resistive element to increase, resulting in a change in electrical resistance that can be detected and converted into an image.

Photon detectors, on the other hand, work by converting photons from the infrared radiation into electrical signals. Two common types of photon detectors are photovoltaic detectors and photoconductors. Photovoltaic detectors generate a voltage when infrared photons are absorbed, while photoconductors increase their conductivity when photons are absorbed.

Infrared detectors can also utilize other detection mechanisms, such as pyroelectricity, where changes in temperature induce a charge in a material, or thermoelectric effects, where a temperature difference between two materials generates a voltage.

The output signal from the infrared detector can be processed and displayed as an image, which can be used for a variety of purposes, such as thermal imaging in medical or industrial applications, remote sensing of the environment, and thermal scanning in security systems.