Uncooled Infrared Thermal Camera Module with 640x512 Resolution and 12μm Pixel

Uncooled LWIR 640x512 / 12 μm Infrared Thermal Security Camera Module with Multiple Lenses

The MICO612 thermal module is specifically engineered for security and surveillance monitoring cameras. By integrating this module, security cameras can detect heat radiation from objects and capture images 24/7, unaffected by environmental conditions such as darkness, low light, or strong backlight. The uncooled infrared camera core serves as the system's heart, delivering exceptional thermal imaging capabilities for reliable detection and observation in low-light or no-light environments.

Utilizing advanced uncooled sensor technology, the MICO612 infrared camera core produces high-resolution thermal images with outstanding sensitivity and accuracy. Integration of our uncooled infrared camera core with 640x512/12μm technology into security monitoring systems provides numerous advantages, including threat identification in complete darkness, early detection of abnormal temperature patterns, and enhanced situational awareness across various environments.

• Mainstream Compatibility, Cost-Effective - Equipped with self-developed mainstream 640×512/12μm wafer-level infrared detector for wide adoption; Integrated with dedicated ASIC chip for high energy efficiency
• Optimized SWaP Design - Sectional dimension: only 22.2×22.2×27.2mm (excluding lens); Weight: just 30.3±2g; Low power consumption: 680mW
• Easy Development & Quick Integration - Native analog video or digital video output supporting CVBS/USB/MIPI standards; Easy mounting with minimal structural design effort

The MICO612 thermal camera module can be integrated into security cameras with temperature monitoring from short to ultra distance, including PTZ Camera, Box Camera, and Speed Dome Camera.

• Diversified Product Portfolio
• Deep Technical Expertise
• Rigorous Reliability Validation Ensures Quality Assurance
• Focused on Innovation and Practical Implementation in Infrared Sensing
• Professional Technical Support and Joint Development Services

Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device that reacts to infrared radiation and thermal energy, converting it into electrical signals and outputting visible thermal images.

WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package and ceramic package, they are the three main package formats of uncooled infrared detectors.

WLP IR detectors are specially designed to meet the miniaturization and low cost requirements in the application of infrared technology to consumer electronics markets. SensorMicro, with volume fabrication capability, now offers a variety of WLP infrared module solutions to boost more new applications in emerging markets.