| Payment Terms | L/C,T/T |
| Resolution | 640x512 / 12μm |
| NETD | <40mK |
| Spectral Range | 8~14μm |
| Size | 17.3×17.3mm |
| Weight | <2.5g |
| Package | Wafer Level Packaging |
| Brand Name | SensorMicro |
| Model Number | GST612W |
| Certification | ISO9001:2015; RoHS; Reach |
| Place of Origin | Wuhan, Hubei Province, China |
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Product Specification
| Payment Terms | L/C,T/T | Resolution | 640x512 / 12μm |
| NETD | <40mK | Spectral Range | 8~14μm |
| Size | 17.3×17.3mm | Weight | <2.5g |
| Package | Wafer Level Packaging | Brand Name | SensorMicro |
| Model Number | GST612W | Certification | ISO9001:2015; RoHS; Reach |
| Place of Origin | Wuhan, Hubei Province, China | ||
| High Light | 640x512 Uncooled Infrared Detectors ,40mK Uncooled Infrared Detectors ,LWIR Infrared Imaging Sensor | ||
640x512 / 12 μm VOx Uncooled Infrared Detectors, LWIR Thermal Sensor with Clear Thermal Imaging
The Apex612W uncooled LWIR infrared detector is optimized for SWaP-C (Size, Weight, Power, Cost) requirements. With 640x512 resolution and 12μm pixel size, it captures long wavelength infrared energy from 8 to 14μm.
This VOx microbolometer detector produces superior images with up to 327,680 pixels without compromising on size, making it a mainstream product suitable for various applications including thermography, security monitoring, firefighting, autonomous driving, and personal vision systems.
We supply cooled and uncooled infrared detectors and thermal imaging modules for secondary development requirements in infrared thermal camera systems.
| Model | Apex612W |
|---|---|
| Sensitive Material | VOx |
| Package | Wafer-Level |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Response | 8μm~14μm |
| NETD | <40mK |
| Output Signal | Built-in 14 bits ADC |
| Thermal Response Time | <12ms |
| Max. Frame Rate | 50Hz |
| Power Consumption | <150mW |
| Size(mm) | 17.3×17.3 |
| Weight(g) | <2.5g |
| Operating Temperature | -40℃ ~ +85℃ |
Infrared waves cannot be seen with the human eye. Infrared detectors and thermal imaging sensors are optical-electrical devices that react to infrared radiation and thermal energy, converting it into electrical signals and outputting visible thermal images.
WLP refers to wafer level packaging. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to create individual infrared sensors. Together with metal packaging and ceramic packaging, these are the three main package formats for uncooled infrared detectors.
WLP IR detectors are specifically designed to meet miniaturization and low-cost requirements for infrared technology applications in consumer electronics markets. We offer various WLP infrared module solutions to support new applications in emerging markets.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2013
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Focusing on infrared thermal imaging technology, SensorMicro is committed to the in-depth development and continuous improvement of infrared products and application solutions. SensorMicro specializes in providing a comprehensive portfolio of core products, including high-performance cooled and unco... Focusing on infrared thermal imaging technology, SensorMicro is committed to the in-depth development and continuous improvement of infrared products and application solutions. SensorMicro specializes in providing a comprehensive portfolio of core products, including high-performance cooled and unco...
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