COIN Series Thermal Camera Module with 384x288/17μm LWIR Uncooled Infrared

COIN417G3 is one of the COIN series uncooled infrared modules developed by SensorMicro. It integrates 384×288/17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm.

It features ultra-low power consumption and full compatibility with industry-standard interfaces, making it highly versatile for applications such as industrial vision, night-time surveillance, outdoor observation, and AIoT. This camera core offers strong support for secondary development and system integration, accelerating the time-to-market of infrared imaging systems.

• Comprehensive Functionality, Cost-Effective Design
  • Developed using a high cost-performance wafer-level packaging detector
  • Integrated with advanced image processing algorithms to enhance image quality
• Outstanding Performance, Superior Imaging
  • High sensitivity with a typical NETD≤30mK
  • Next-generation image algorithms deliver clearer, sharper thermal images
• Flexible Extension, Rapid Integration
  • Multiple optical lens options available to suit diverse application scenarios
  • Supports USB2.0/DVP/LVDS/BT.656 image output interfaces
  • Outputs RAW/YUV image data with serial port control

The COIN417G3 thermal imaging module is widely used in Industrial Vision, Security Monitoring, Firefighting & rescue, Outdoors, Machine Vision, ADAS etc.

SensorMicro was founded with a simple but powerful belief: Innovation should serve real-world needs.

SensorMicro exists to empower people and systems to see beyond the surface--into the patterns, the problems, and the possibilities that lie beneath.

By turning invisible heat into visible truth, we help industries make smarter decisions, protect what matters most, and navigate complexity with clarity.

Heeding to our insistence on being self-made and customer-first has become a sure recipe for SensorMicro's momentum. As our business spans much of the globe, we've charged ahead on all fronts--from security, firefighting, industrial inspection, medical care, and machine vision, to environmental monitoring and key aspects of carbon neutrality--helping partners unlock the full potential of intelligent infrared sensing, and connecting the dots of life.

We are more than an infrared technology company. We are a community of people committed to building a sustainable, ethical, and human-centered future. Every pixel of innovation we create is a promise -- a promise to protect, to empower, and to serve.

Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.

WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.

WLP IR detectors are specially designed to meet the miniaturization and low cost requirement in the application of infrared technology to consumer electronics market. We are now offering a variety of WLP infrared module solutions to boost more new applications of emerging markets.