Uncooled Thermal Imaging Module with 640x512 Resolution 12μm Pixel Pitch and 0

The iTL612 PLUS ultra-miniature infrared camera core adopts ApexCore 640×512/12μm wafer-level infrared detector as the core sensing component. Its overall dimension is 17.3×17.3×24.2mm (including 9.1mm standard lens), with a net weight of 13.7±0.5g and typical power consumption as low as 0.65W.

The module achieves a thermal sensitivity index of ≤25mK, and applies next-generation professional image processing algorithms to optimize imaging definition and detail restoration. In terms of expandability, the product supports multiple interchangeable lens options to adapt to different detection distances and scenarios.

It is compatible with DVP8, LVDS, MIPI, USB 2.0 and BT.656 multi-channel image output interfaces, and supports RAW, YUV, Matrix-TEMP multi-type data output with standard serial port control function, fully meeting the development and integration requirements of various miniaturized infrared thermal imaging systems.

• Unmatched Lightness and Minimal Load
  • Ultra-Miniature Size: 17.3×17.3×24.2 mm (including 9.1 mm lens)
  • Ultra-Lightweight: 13.7±0.5g (including 9.1 mm lens)
  • Ultra-Low Power Consumption: As low as 0.65W
• Powered by ApexCore, More Sensitive and Clearer
  • Developed based on the next-generation ApexCore infrared detector, with thermal sensitivity as low as ≤25 mK
  • Enhanced with next-generation image processing algorithms for clearer imaging
• Easy Development & Seamless Integration
  • Multiple lens options available to suit various application scenarios
  • Supports multiple image output interfaces: DVP8, LVDS, MIPI, USB 2.0, and BT.656
  • RAW/YUV/Matrix-TEMP data output with serial port control

The iTL612 PLUS thermal camera module can be used in the fields of Forest Firefighting, Power Maintenance, Photovoltaic Inspection, Security Monitoring, Wearable Devices, Portable Devices etc.

• Diverse Product Portfolio: A wide range of product formats including infrared detectors, camera cores, and modules to meet various integration requirements.
• Rich Product Variety: Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications.
• Outstanding Performance: Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges.
• Easy Integration: Multiple interface options make integration straightforward and enable rapid development across multiple application fields.

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.

By showing heat distribution and subtle details through color, thermal anomalies and body heat can be quickly identified. With ironbow pseudo color, hotter objects appear as light warm colors, while cooler objects appear as deep cool colors. It is mainly used for temperature measurement.