| Spectral Range | 8~14μm |
| Start-up Time | 6s |
| Frame Rate | 50Hz |
| NETD | <30mK |
| Payment Terms | T/T |
| Resolution | 384x288 / 12μm |
| Image Algorithm | NUC/DRC/DNS/DDE/SFFC |
| Brand Name | SensorMicro |
| Certification | ISO9001:2015; RoHS; Reach |
| Place of Origin | China |
| Model Number | iSE412 |
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Product Specification
| Spectral Range | 8~14μm | Start-up Time | 6s |
| Frame Rate | 50Hz | NETD | <30mK |
| Payment Terms | T/T | Resolution | 384x288 / 12μm |
| Image Algorithm | NUC/DRC/DNS/DDE/SFFC | Brand Name | SensorMicro |
| Certification | ISO9001:2015; RoHS; Reach | Place of Origin | China |
| Model Number | iSE412 | ||
| High Light | 17uM LWIR Thermal Camera Module ,Industrial Thermography Thermal Camera Module ,400x300 LWIR Thermal Camera | ||
Powered by a 384×288 resolution, 12μm pixel pitch ceramic-packaged thermal detector, the iSE412 infrared camera core achieves superior performance with optimized structural and algorithm design. Its innovative shutterless operation architecture eliminates frequent shutter calibration, effectively suppressing frame stuttering and background noise to realize ultra-smooth real-time imaging. Equipped with advanced image processing technologies such as super-resolution reconstruction and electronic zoom, alongside one-click calibration and customizable OSD functions, the module guarantees clear and adjustable imaging effects. Compatible with diverse lenses, extension components and Micro OLED displays, it supports flexible system customization. With small dimensions and lightweight design, the core maintains stable and reliable detection output under extreme spatial and environmental constraints, catering to high-precision industrial, security and rescue scenario demands.
| Model | iSE412 | |
| IR Detectors Indicators | ||
| Sensitive Material | VOx | |
| Resolution | 384×288 | |
| Pixel Size | 12μm | |
| Spectral Response | 8μm ~ 14μm | |
| Typical NETD | ≤30mK | |
| Image Processing | ||
| Effective Pixels | 384×288 | |
| Digital Frame Rate | 50Hz | |
| Start-up Time | 6s | |
| Digital Video | YUV420/YUV422/RGB888/RAW | |
| Image Algorithm | NUC/DRC/DNS/DDE/SFFC | |
| Shutterless | Supported | |
| Image Display | 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) | |
| Image Direction | Horizontal/Vertical/Diagonal | |
| Digital Zoom | 1x/2x/4x/8x | |
| Image Brightness | Auto/Manual | |
| Image Contrast | Auto/Manual | |
| Compensation Mode | Manual | |
| Electrical | ||
|
Standard External Interface
|
50pin: BP040SB-50-0114-B-R0
|
|
| Communication Interface | TTL-232/USB2.0 | |
| Digital Video Interface | DVP8/BT.656/DVP16/BT.1120/USB2.0/MIPI-DSI-4LANE | |
| Extension Components | USB2.0/SDI/HDMI/GIGE/Cameralink/VPC/MIPI-CSI-2LANE | |
| Electrical Interface | ||
| Supply Voltage | 2.7V~5.3V | |
| Typical Power Consumption | 0.8W@50Hz@23±3℃ | |
| Mechanical/Lens | ||
| Bare Core Size(mm) | 25.4×25.4×22.7 | φ36×24.3 |
| Bare Core Weight(g) | 26±1.5 | 28±1.5 |
| Optical Lens |
Fixed Focus Athermal: 4.9/9.1/13/19mm
|
Fixed Focus Athermal: 25mm/35mm
|
| Shutter Components | Optional | |
| Vibration | 5.35g, Random Vibration, 3-axis | |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times | 1500g@0.4ms |
| Protection Level | IP67(Front Lens) | |
| Environmental Adaptability | ||
| Operating Temperature | -40℃~+70℃ | |
| Storage Temperature | -45℃~+85℃ | |
| Humidity | 5%~95%, non-condensing | |
| Certification | ROHS2.0/REACH | |
The iSE412 thermal camera core is widely used in Industrial Vision, Firefighting and Rescue, Security Surveillance, Outdoor Observation, Machine Vision, Consumer Electronics etc.
A wide range of product formats including infrared detectors, camera cores, and modules to meet various integration requirements.
Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications.
Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges.
Multiple interface options make integration straightforward and enable rapid development across multiple application fields.
Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing. It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2013
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Focusing on infrared thermal imaging technology, SensorMicro is committed to the in-depth development and continuous improvement of infrared products and application solutions. SensorMicro specializes in providing a comprehensive portfolio of core products, including high-performance cooled and unco... Focusing on infrared thermal imaging technology, SensorMicro is committed to the in-depth development and continuous improvement of infrared products and application solutions. SensorMicro specializes in providing a comprehensive portfolio of core products, including high-performance cooled and unco...
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