SM-8550-0-MPSP1581-MT-01-0-AB AI Processor Chip SM8550 Snapdragon 8 Gen 2 Mobile

Product Specification

SM-8550-0-MPSP1581-MT-01-0-AB AI Processor Chip SM8550 Snapdragon Premium 5G SoC Chip​

Product Description Of SM-8550-0-MPSP1581-MT-01-0-AB

SM-8550-0-MPSP1581-MT-01-0-AB is the Snapdragon 8 Gen 2 Mobile Processor, manufactured using a 4nm process technology. It delivers high-performance computing, AI acceleration, and multimedia processing capabilities, finding extensive application in smartphones, smart devices, and AI algorithm acceleration scenarios.

Specification Of SM-8550-0-MPSP1581-MT-01-0-AB
Type: Snapdragon 8 Gen 2 Mobile Platform
USB Version 3.1; USB Type-C Support
Storage: UFS 4.0
Memory: Support for LP-DDR5x memory up to 4200 MHz
Memory Density: Up to 24 GB

CPU: 8-core Kryo processor configuration comprising 1×Cortex-X3 (3.2GHz), 2×Cortex-A715 (2.8GHz), 2×Cortex-A710 (2.8GHz), and 3×Cortex-A510 (2.0GHz), enabling efficient multitasking.
‌GPU and AI‌: Integrates Adreno 740 GPU (680MHz) and Hexagon NPU, delivering 48TOPS AI processing power. Supports 32-channel FHD video processing and local AI algorithm acceleration.‌‌
‌Connectivity and Interfaces‌: Supports Wi-Fi 7, Bluetooth 5.3, and external 5G modules. Offers extensive interfaces including USB 3.0, HDMI 4K, and dual Gigabit Ethernet, suitable for both industrial and consumer-grade devices.‌‌
‌Energy Efficiency‌: Designed using a 4nm process, delivering outstanding performance and power efficiency.

Features Of SM-8550-0-MPSP1581-MT-01-0-AB
Kryo™ CPU built on Arm Cortex technology
Adreno™ 740 GPU delivers peak graphics performance and efficiency
Spectra™ Image Signal Processor enables ultimate photography and videography
Adreno VPU 8550 for high-quality, ultra-high-definition video encoding and decoding
Adreno 1295 DPU supports on-device and external ultra-high-definition display
3G/4G/5G Modem – Millimetre Wave and Sub-6 GHz Bands (Rel 16 Integrated Modem)

Supports Snapdragon Sound™ Technology for:
Spatial audio with head tracking2 for complete surround sound immersion
Ultra-low latency Bluetooth streaming <48ms
CD-quality lossless music streaming
32kHz super wideband voice call quality with aptX Voice
Featuring our integrated Snapdragon® X70 5G Modem-RF System
5G Dual-SIM Dual-Active (DSDA) enables the simultaneous use of two 5G+5G or 5G+4G SIM cards for ultimate user flexibility
5G Ultra-Low Latency Suite helps achieve unmatched 5G low-latency for hyper-responsive 5G user experiences and applications
Blazing download speeds up to 10 Gigabit per second for flawless entertainment and nonstop productivity
FastConnect™ 7800 Mobile Connectivity System delivers the first announced Wi-Fi 7 commercial solution featuring HBS Multi-Link for uninterrupted connectivity
Snapdragon Secure features the latest in isolation, cryptography, key management, attestation, and more.
Enhanced Face Unlock security system including liveness detection for increased privacy

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FAQ
Q. Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q:Which Certificates do you have?
A:We are ISO 9001:2015 Certified Company and member of ERAI.
Q:Can you support small quantity order or sample?Is the sample free?
A:Yes,we support sample order and small order.Sample cost is different according to your order or project.
Q:How to ship my order? Is it safe?
A:We use express to ship,such as DHL,Fedex,UPS,TNT,EMS.We can also use your suggested forwarder.Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q:What about the lead time?
A:We can ship stock parts within 5 working days.If without stock,we will confirm lead time for you based on your order quantity.