FH8069004541900 AI Processor Chip Core™ i7-1185GRE with 12MB Smart Cache 4.40

Product Specification

FH8069004541900 AI Processor Chip Core™ i7-1185GRE Processor 12MB Smart Cache​

Product Description Of FH8069004541900

FH8069004541900 Core™ i7-1185GRE Processor, utilising advanced manufacturing processes and architectural design, combines high performance with low power consumption. It is suitable for scenarios demanding both computational power and stability, such as embedded systems, industrial control equipment, and portable development platforms.
FH8069004541900 incorporates 12MB of Smart Cache, with a maximum single-core Turbo Boost frequency of 4.40 GHz. It efficiently handles complex computational tasks and multi-threaded processing demands, delivering robust computational support for electronic devices.

Specification Of FH8069004541900

Processor Number: i7-1185GRE

Lithography: 10 nm SuperFin
Total Cores: 4
Total Threads: 8
Max Turbo Frequency: 4.40 GHz
Processor Base Frequency 1.80 GHz
Cache: 12 MB Smart Cache
Bus Speed: 4 GT/s
TDP: 15 W
Configurable TDP-up Base Frequency: 2.80 GHz
Configurable TDP-up: 28 W
Configurable TDP-down Base Frequency: 1.20 GHz
Configurable TDP-down: 12 W
Max Memory Size: 64 GB
Memory Types: DDR4-3200, LPDDR4x-4267, In-Band ECC
Max # of Memory Channels: 2
Sockets Supported: FCBGA1449
Operating Temperature: -40°C ~ 100°C

Features Of FH8069004541900

High-performance computing: A 4-core, 8-thread configuration paired with a maximum Turbo Boost frequency of 4.40 GHz enables smooth operation of industrial software, embedded algorithms, lightweight AI inference tasks, and more, delivering outstanding multitasking efficiency.
Efficient Cache Design: 12MB large-capacity L3 cache effectively reduces data read/write latency, accelerating processor processing of frequently accessed data and optimising device responsiveness.
Low-Power Advantage: 28W TDP design maintains computational output while reducing overall device power consumption and thermal load, suitable for compact fanless cooling solutions.
Flexible Memory Support: Compatible with both DDR4 and LPDDR4X memory specifications, meeting diverse device requirements for memory bandwidth, power consumption, and cost.
Stable and Reliable: Supports long-term supply cycles for embedded applications with excellent temperature adaptability, ensuring stable operation in industrial environments. Ideal for scenarios demanding high device durability.

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FAQ
Q. Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q:Which Certificates do you have?
A:We are ISO 9001:2015 Certified Company and member of ERAI.
Q:Can you support small quantity order or sample?Is the sample free?
A:Yes,we support sample order and small order.Sample cost is different according to your order or project.
Q:How to ship my order? Is it safe?
A:We use express to ship,such as DHL,Fedex,UPS,TNT,EMS.We can also use your suggested forwarder.Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q:What about the lead time?
A:We can ship stock parts within 5 working days.If without stock,we will confirm lead time for you based on your order quantity.