Beijing Silk Road Enterprise Management Services Co.,LTD
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Manufacturer of a wide range of products which include XCVC1902-2LSEVSVD1760,XCVM1302-1MSEVFVC1596,XCVM1402-2LSEVFVC1596,etc
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Series | Versal™ AI Core |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 1760-BFBGA, FCBGA |
| Number of I/O | 692 |
| RAM Size | 256KB |
| Speed | 450MHz, 1.08GHz |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| Description | IC VERSAL AICORE FPGA 1760BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | XCVC1902-2LSEVSVD1760 |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Series | Versal™ Prime |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1596-BGA (37.5x37.5) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 1596-BFBGA |
| Number of I/O | 532 |
| RAM Size | - |
| Speed | 600MHz, 1.3GHz |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| Description | IC VERSALPRIME ACAP FPGA 1596BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | XCVM1302-1MSEVFVC1596 |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Series | Versal™ Prime |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1596-BGA (37.5x37.5) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 1596-BFBGA |
| Number of I/O | 748 |
| RAM Size | 256KB |
| Speed | 600MHz, 1.4GHz |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| Description | IC VERSALPRIME ACAP FPGA 1596BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | XCVM1402-2LSEVFVC1596 |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 462K Logic Elements |
| Series | Arria V SX |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 896-FBGA (31x31) |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 896-BBGA, FCBGA |
| Number of I/O | MCU - 208, FPGA - 250 |
| RAM Size | 64KB |
| Speed | 800MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 800MHZ 896FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | 5ASXBB5D4F31C5G |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | A2F500M3G |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Series | SmartFusion® |
| Package | Tray |
| Mfr | Microchip Technology |
| Supplier Device Package | 256-FPBGA (17x17) |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 256-LBGA |
| Number of I/O | MCU - 25, FPGA - 66 |
| RAM Size | 64KB |
| Speed | 100MHz |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| Description | IC SOC CORTEX-M3 100MHZ 256FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | A2F500M3G-1FG256I |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z007 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 23K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 400-CSPBGA (17x17) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 400-LFBGA, CSPBGA |
| Number of I/O | 100 |
| RAM Size | 256KB |
| Speed | 766MHz |
| Core Processor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 766MHZ 400BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | XC7Z007S-2CLG400I |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | 5ASXFB3 |
| Product Status | Obsolete |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 350K Logic Elements |
| Series | Arria V SX |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 1152-FBGA, FC (35x35) |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 1152-BBGA, FCBGA |
| Number of I/O | MCU - 208, FPGA - 385 |
| RAM Size | 64KB |
| Speed | 1.05GHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 1.05GHZ 1152BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | 5ASXFB3G4F35I3N |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Primary Attributes | FPGA - 2800K Logic Elements |
| Series | Stratix® 10 SX |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 1760-FBGA (42.5x42.5) |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 1760-BBGA, FCBGA |
| Peripherals | DMA, WDT |
| RAM Size | 256KB |
| Speed | 1.5GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC FPGA STRATIX 10 1760FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | 1SX280HN3F43I1VG |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z100 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 1156-BBGA, FCBGA |
| Number of I/O | 250 |
| RAM Size | 256KB |
| Speed | 800MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 800MHZ 1156BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | XC7Z100-2FFG1156I |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DMA, PCI, PWM |
| Primary Attributes | FPGA - 254K Logic Modules |
| Series | PolarFire® |
| Package | Tray |
| Mfr | Microchip Technology |
| Supplier Device Package | 536-BGA (16x16) |
| Connectivity | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 536-LFBGA |
| Number of I/O | MCU - 136, FPGA - 168 |
| RAM Size | 2.2MB |
| Speed | - |
| Core Processor | RISC-V |
| Flash Size | 128KB |
| Description | IC SOC RISC-V 536BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union |
| Model Number | MPFS250T-FCSG536T2 |
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