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System On Chip (SoC)

Manufacturer of a wide range of products which include MCP3421A1T-E/CH,AD7478ARTZ-REEL7,1SX250LN3F43E2VG,etc

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Category Integrated Circuits (ICs) Data Acquisition Analog to Digital Converters (ADC)
Number of Inputs 1
Operating Temperature -40°C ~ 125°C
Input Type Differential
Package / Case SOT-23-6
Number of Bits 18
Sampling Rate (Per Second) 3.75
Number of A/D Converters 1
Configuration PGA-ADC
Voltage - Supply, Analog 2.7V ~ 5.5V
Package Tape & Reel (TR) Cut Tape (CT) Digi-Reel®
Reference Type Internal
Ratio - S/H:ADC -
Architecture Sigma-Delta
Product Status Active
Features PGA
Mounting Type Surface Mount
Data Interface I²C
Voltage - Supply, Digital 2.7V ~ 5.5V
Supplier Device Package SOT-23-6
Mfr Microchip Technology
Series -
Base Product Number MCP3421
Description IC ADC 18BIT SIGMA-DELTA SOT23-6
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Data Acquisition Analog to Digital Converters (ADC)
Number of Inputs 1
Operating Temperature -40°C ~ 85°C
Input Type Single Ended
Package / Case SOT-23-6
Number of Bits 8
Sampling Rate (Per Second) 1M
Number of A/D Converters 1
Configuration S/H-ADC
Voltage - Supply, Analog 2.7V ~ 5.25V
Package Tape & Reel (TR) Cut Tape (CT) Digi-Reel®
Reference Type Supply
Ratio - S/H:ADC 1:1
Architecture SAR
Product Status Active
Features -
Mounting Type Surface Mount
Data Interface SPI, DSP
Voltage - Supply, Digital 2.7V ~ 5.25V
Supplier Device Package SOT-23-6
Mfr Analog Devices Inc.
Series -
Base Product Number AD7478
Description IC ADC 8BIT SAR SOT23-6
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, WDT
Primary Attributes FPGA - 2500K Logic Elements
Series Stratix® 10 SX
Package Tray
Mfr Intel
Supplier Device Package 1760-FBGA, FC (42.5x42.5)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1760-BBGA, FCBGA
Number of I/O 688
RAM Size 256KB
Speed 1.5GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A53 1.5GHZ 1760BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 480K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 780-FBGA, FC (29x29)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 780-BBGA, FCBGA
Number of I/O 360
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 780FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, WDT
Primary Attributes FPGA - 650K Logic Elements
Series Stratix® 10 SX
Package Tray
Mfr Intel
Supplier Device Package 1152-FBGA (35x35)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1152-BBGA, FCBGA
Number of I/O 392
RAM Size 256KB
Speed 1.5GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
Description IC FPGA STRATIX10SX 1152FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 660K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 1152-FBGA, FC (35x35)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1152-BBGA, FCBGA
Number of I/O 396
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S010
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 10K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 400-VFBGA (17x17)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 400-LFBGA
Number of I/O 195
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 400VFBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, PCI, PWM
Primary Attributes FPGA - 254K Logic Modules
Series PolarFire®
Package Tray
Mfr Microchip Technology
Supplier Device Package 484-FCBGA (19x19)
Connectivity CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C
Architecture MPU, FPGA
Package / Case 484-BFBGA, FCBGA
Number of I/O MCU - 136, FPGA - 372
RAM Size 2.2MB
Speed -
Core Processor RISC-V
Flash Size 128kB
Description IC SOC RISC-V 484FCBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Discontinued at Digi-Key
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 480K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 1152-FBGA, FC (35x35)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1152-BBGA, FCBGA
Number of I/O 396
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DDR, DMA, PCIe
Primary Attributes Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Series Zynq® UltraScale+™ RFSoC
Package Tray
Mfr AMD
Supplier Device Package 1156-FCBGA (35x35)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1156-BBGA, FCBGA
Number of I/O 366
RAM Size 256KB
Speed 533MHz, 1.333GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
Description IC ZUP RFSOC A53 FPGA 1156BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union

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