Berton Electronics Limited
Products
Manufacturer of a wide range of products which include STM32H743VGT6 32-bit Microcontroller with High-Speed Processing Core, Large On,ISPLSI 1048EA-170LQ128,BCM65116SA05,etc
MOQ: 1pcs
Price:
| Payment Terms | T/T |
| PN | STM32H743VGT6 |
| MFR | ST |
| Brand Name | ST |
| Model Number | STM32H743VGT6 |
MOQ:
Price:
| Category | Integrated Circuits (ICs) Embedded CPLDs (Complex Programmable Logic Devices) |
| Number of Macrocells | 192 |
| Product Status | Obsolete |
| Digi-Key Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Package | Tray |
| Series | ispLSI® 1000EA |
| Mfr | Lattice Semiconductor Corporation |
| Supplier Device Package | 128-PQFP (28x28) |
| Voltage Supply - Internal | 4.75V ~ 5.25V |
| Number of Gates | 8000 |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Number of Logic Elements/Blocks | 48 |
| Programmable Type | In System Programmable |
| Package / Case | 128-BQFP |
| Number of I/O | 96 |
| Base Product Number | ISPLSI 1048EA |
| Delay Time tpd(1) Max | 5 ns |
| Description | IC CPLD 192MC 5NS 128QFP |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
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| Package / Case : | - |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | - |
| Speed : | - |
| Supplier Device Package : | - |
| Flash Size : | - |
| RAM Size : | - |
| Connectivity : | - |
| Operating Temperature : | - |
| Package : | Tray |
| Architecture : | - |
| Core Processor : | - |
| Product status : | Obsolete |
| Peripherals : | - |
| Manufacturer : | Broadcom Limited |
| Description | BCA_ZYXEL_CHT |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
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| Package / Case : | 536-LFBGA, CSPBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 150K Logic Modules |
| Speed : | 166MHz |
| Supplier Device Package : | 536-CSPBGA (16x16) |
| Flash Size : | 512KB |
| RAM Size : | 64kB |
| Connectivity : | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | ARM® Cortex®-M3 |
| Product status : | Active |
| Peripherals : | DDR, PCIe, SERDES |
| Series : | SmartFusion®2 |
| Manufacturer : | Microchip Technology |
| Description | IC SOC CORTEX-M3 166MHZ 536BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
MOQ:
Price:
| Package / Case : | 900-BBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Speed : | 500MHz, 600MHz, 1.2GHz |
| Supplier Device Package : | 900-FCBGA (31x31) |
| Flash Size : | - |
| RAM Size : | 256kB |
| Connectivity : | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Product status : | Active |
| Peripherals : | DMA, WDT |
| Series : | Zynq® UltraScale+™ MPSoC EV |
| Manufacturer : | Xilinx Inc |
| Description | IC SOC CORTEX-A53 900FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
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| Package / Case : | 1156-BBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Speed : | 600MHz, 667MHz, 1.5GHz |
| Supplier Device Package : | 1156-FCBGA (35x35) |
| Flash Size : | - |
| RAM Size : | 256kB |
| Connectivity : | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | 0°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Product status : | Active |
| Peripherals : | DMA, WDT |
| Series : | Zynq® UltraScale+™ MPSoC EG |
| Manufacturer : | Xilinx Inc |
| Description | IC SOC CORTEX-A53 1156FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
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| Package / Case : | 1152-BBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | FPGA - 150K Logic Modules |
| Speed : | 166MHz |
| Supplier Device Package : | 1152-FCBGA (35x35) |
| Flash Size : | 512KB |
| RAM Size : | 64kB |
| Connectivity : | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | ARM® Cortex®-M3 |
| Product status : | Active |
| Peripherals : | DDR, PCIe, SERDES |
| Series : | SmartFusion®2 |
| Manufacturer : | Microchip Technology |
| Description | IC SOC CORTEX-M3 166MHZ 1152BGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
MOQ:
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| Package / Case : | 784-BFBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Speed : | 533MHz, 1.3GHz |
| Supplier Device Package : | 784-FCBGA (23x23) |
| Flash Size : | - |
| RAM Size : | 256kB |
| Connectivity : | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Product status : | Active |
| Peripherals : | DMA, WDT |
| Series : | Zynq® UltraScale+™ MPSoC CG |
| Manufacturer : | Xilinx Inc |
| Description | IC SOC CORTEX-A53 784FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
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| Package / Case : | 1517-BBGA, FCBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Speed : | 500MHz, 600MHz, 1.2GHz |
| Supplier Device Package : | 1517-FCBGA (40x40) |
| Flash Size : | - |
| RAM Size : | 256kB |
| Connectivity : | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature : | -40°C ~ 100°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Product status : | Active |
| Peripherals : | DMA, WDT |
| Series : | Zynq® UltraScale+™ MPSoC EG |
| Manufacturer : | Xilinx Inc |
| Description | IC SOC CORTEX-A53 1517FCBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
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| Package / Case : | 256-LBGA |
| Product Category : | Systems on a Chip - SoC |
| Primary Attributes : | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Speed : | 80MHz |
| Supplier Device Package : | 256-FPBGA (17x17) |
| Flash Size : | 512KB |
| RAM Size : | 64kB |
| Connectivity : | EBI/EMI, Ethernet, I²C, SPI, UART/USART |
| Operating Temperature : | 0°C ~ 85°C (TJ) |
| Package : | Tray |
| Architecture : | MCU, FPGA |
| Core Processor : | ARM® Cortex®-M3 |
| Product status : | Active |
| Peripherals : | DMA, POR, WDT |
| Series : | SmartFusion® |
| Manufacturer : | Microchip Technology |
| Description | IC SOC CORTEX-M3 80MHZ 256FBGA |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, |
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