Xingyicheng (Shenzhen) Technology Co., Ltd.
| Payment Terms | L/C,T/T,Western Union |
| Supply Ability | 10000 Piece |
| Delivery Time | 7-10 Work Days |
| CPU | Onboard Intel Alder Lake 11th generation processor |
| I/O | 4 X USB 3.0, 4 X USB 2.0, 2 X COM, 1 X LPT |
| Support operating system | Windows, Linux |
| Display | 1 X HD-MI, 1 X VGA |
| Rear Interface | 1*JAE 80PIN：HD-MI2.0 out(4K/60Hz) |
| Show Output | HD-MI/DP supports synchronous and asynchronous dual displays |
| Audio | Realtek ALC662 6-channel HD Audio |
| Network | LAN-Intel I219 10M/100M/1000M Ethernet and WIFI-1*M.2 2230 for Wifi+BT |
| Host Size | Bare metal: 195*180*42mm Packing box size: 282*257*79mm |
| Storage | 1*M.2 2280 interface supports NVME and SATA dual protocols 1* 2.5" SATA HDD/SDD |
| Weight | Net weight≈1.2 Kg Gross weight≈1.4 Kg |
| Front Interface | 1*HD-MI2.0 out(4K/60Hz) 1*DP 1.4 out 5*USB3.0 1*USB 2.0 2* RJ45 1*Power 1* Reset 1*Line out 1*Mic in 1*Type-C(USB3.0&DP video output) |
| Power Input | 19V 4.74A |
| Working Humidity | 10% - 95% @40°C non-condensing |
| Memory | 2 X SO-DIMM DDR4 2400/2666MHz memory |
| Storage Temperature | -40°C~ 80°C |
| Graphics Card | Intel® Iris® Xe Graphics |
| Packaging Details | Standard carton package : carton+ plastic bag+ foam+ honeycomb paperboard+ pack thread. |
| Operating Temperature | 0°C~ 45°C |
| Certification | CE FCC |
| Brand Name | MTHGH |
| Place of Origin | China |
| Model Number | XYC |
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Product Specification
| Payment Terms | L/C,T/T,Western Union | Supply Ability | 10000 Piece |
| Delivery Time | 7-10 Work Days | CPU | Onboard Intel Alder Lake 11th generation processor |
| I/O | 4 X USB 3.0, 4 X USB 2.0, 2 X COM, 1 X LPT | Support operating system | Windows, Linux |
| Display | 1 X HD-MI, 1 X VGA | Rear Interface | 1*JAE 80PIN：HD-MI2.0 out(4K/60Hz) |
| Show Output | HD-MI/DP supports synchronous and asynchronous dual displays | Audio | Realtek ALC662 6-channel HD Audio |
| Network | LAN-Intel I219 10M/100M/1000M Ethernet and WIFI-1*M.2 2230 for Wifi+BT | Host Size | Bare metal: 195*180*42mm Packing box size: 282*257*79mm |
| Storage | 1*M.2 2280 interface supports NVME and SATA dual protocols 1* 2.5" SATA HDD/SDD | Weight | Net weight≈1.2 Kg Gross weight≈1.4 Kg |
| Front Interface | 1*HD-MI2.0 out(4K/60Hz) 1*DP 1.4 out 5*USB3.0 1*USB 2.0 2* RJ45 1*Power 1* Reset 1*Line out 1*Mic in 1*Type-C(USB3.0&DP video output) | Power Input | 19V 4.74A |
| Working Humidity | 10% - 95% @40°C non-condensing | Memory | 2 X SO-DIMM DDR4 2400/2666MHz memory |
| Storage Temperature | -40°C~ 80°C | Graphics Card | Intel® Iris® Xe Graphics |
| Packaging Details | Standard carton package : carton+ plastic bag+ foam+ honeycomb paperboard+ pack thread. | Operating Temperature | 0°C~ 45°C |
| Certification | CE FCC | Brand Name | MTHGH |
| Place of Origin | China | Model Number | XYC |
| High Light | Mini PC OPS Tiger Lake ，8G Android Ops Module ，Mini PC OPS 11th | ||
Engineered for high-end digital signage and interactive flat panel display (IFP) systems, this high-performance module is powered by an 11th Generation Tiger Lake-H processor with flexible RAM options up to 64GB and massive storage scalability.
The OPS PC Module is built to deliver superior processing capability for demanding commercial deployments. Featuring high-performance Tiger Lake-H 11th generation processors (I5-11260H / I5-11400H / I7-11600H / 11800H), flexible DDR4 RAM configurations, and robust storage choices ranging up to 1TB SSD or 1TB HDD.
This robust solution is ideal for bulk procurement, offering exceptional stability, a compact 190mm * 190mm * 42mm footprint, and seamless integration into smart displays and interactive touch systems.
| Processor Tier | Intel Core I3/i5/i7 (Tiger Lake-H 11th Gen options available) |
|---|---|
| Primary Storage | 1 X 2.5" SATA HDD/SSD, 1 X MSATA |
| Network Controller | 2 X Intel I210AT Gigabit Ethernet |
| Memory Support | 2 X DDR3L SO-DIMM 1333/1600MHz, Up To 16GB |
| Display Outputs | 1 X HDMI, 1 X VGA |
| Audio Controller | Realtek ALC662 6-channel HD Audio |
| Peripheral I/O | 4 X USB 3.0, 4 X USB 2.0, 2 X COM, 1 X LPT |
| System Chipset | Intel H81/Q87/B85/H110 |
| Hardware Weight | 1.2kg |
| Operating Temperature | 0°C~60°C |
The OPS I5 PC Module is the perfect solution for small businesses and professionals who need a powerful, yet compact computer module. This module offers an ideal combination of storage, memory, and power in a size that is compact enough to fit into almost any space.
Featuring 1 x 2.5" SATA HDD/SSD and 1 x MSATA, allowing you to store and access large amounts of data. With dimensions of 190mm * 190mm * 42mm and weight of just 1.2kg, it provides a space-efficient, high-performance computing solution for digital signage and interactive displays.
We offer customized services for our smart OPS PC Module, which functions as an Android OPS Module powered by advanced Intel processors. Tailor your bulk orders with specific thermal thresholds, dimensions, and expansion ports.
We are committed to providing our customers with the highest quality of technical support and service. Our support options include:
Our products undergo strict packaging protocols to ensure safe global transit. Each unit is wrapped securely, boxed with protective padding, and labeled clearly for wholesale distribution and distributor deployment worldwide.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Exporter,Seller,Other
Year Established:
2017
Total Annual:
10000-2000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
Company Profile Xingyicheng (Shenzhen) Technology Co., Ltd. is a professional Interactive Flat Panel Display (IFPD) manufacturer, Smart Board manufacturer and Digital Signage solution provider based in Shenzhen, China. Since 2008, we have specialized in the research, development and manufacturing ... Company Profile Xingyicheng (Shenzhen) Technology Co., Ltd. is a professional Interactive Flat Panel Display (IFPD) manufacturer, Smart Board manufacturer and Digital Signage solution provider based in Shenzhen, China. Since 2008, we have specialized in the research, development and manufacturing ...
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