Payment Terms | L/C, D/A, D/P, T/T |
Supply Ability | 20pcs 15-30 work days |
Delivery Time | 15-30 work days |
Packaging Details | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
NAME | 275 TOPS 64GB EMMC 5.1 AGX Orin Nvidia Jetson Compute Module For Healthcare Agriculture |
Keyword | 275 TOPS 64GB EMMC 5.1 AGX Orin Nvidia Jetson Compute Module For Healthcare Agriculture |
AI Performance | 275 TOPS |
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
Memory | 64GB 256-bit LPDDR5 204.8GB/s |
Storage | 64GB eMMC 5.1 |
Networking | 1x GbE 1x 10GbE |
Power | 15W - 40W |
Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
Brand Name | NVIDIA |
Model Number | AGX Orin 64G Module |
Place of Origin | USA |
View Detail Information
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Product Specification
Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | 20pcs 15-30 work days |
Delivery Time | 15-30 work days | Packaging Details | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
NAME | 275 TOPS 64GB EMMC 5.1 AGX Orin Nvidia Jetson Compute Module For Healthcare Agriculture | Keyword | 275 TOPS 64GB EMMC 5.1 AGX Orin Nvidia Jetson Compute Module For Healthcare Agriculture |
AI Performance | 275 TOPS | GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 | Memory | 64GB 256-bit LPDDR5 204.8GB/s |
Storage | 64GB eMMC 5.1 | Networking | 1x GbE 1x 10GbE |
Power | 15W - 40W | Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
Brand Name | NVIDIA | Model Number | AGX Orin 64G Module |
Place of Origin | USA | ||
High Light | AGX nvidia jetson compute module ,eMMC nvidia jetson compute module ,eMMC jetson compute module |
275 TOPS 64GB EMMC 5.1 AGX Orin Nvidia Jetson Compute Module For Healthcare Agriculture
NVIDIA Jetson AGX Orin 64GB Module
All NVIDIA Jetson modules and developer kits are supported by the same software stack, enabling you to develop once and deploy everywhere. Jetson Software is designed to provide end-to-end acceleration for AI applications and accelerate your time to market. We bring the same powerful NVIDIA technologies that power data center and cloud deployments to the edge.
The Jetson family of modules all use the same NVIDIA CUDA-X software, and support cloud-native technologies like containerization and orchestration to build, deploy, and manage AI at the edge.
With Jetson, customers can accelerate all modern AI networks, easily roll out new features, and leverage the same software for different products and applications.
Brand | NVIDIA |
Module | NVIDIA Jetson AGX Orin 64GB |
AI Performance | 275 TOPS |
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
Memory | 64GB 256-bit LPDDR5 204.8GB/s |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
GPU Max Frequency | 1.3 GHz |
DLA Max Frequency | 1.6 GHz |
CPU Max Frequency | 2.2 GHz |
Safety Cluster Engine | - |
Display | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
Storage | 64GB eMMC 5.1 |
Camera | Up to 6 cameras (16 via virtual channels) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps) |
Video Encode | 2x 4K60 (H.265) 4x 4K30 (H.265) 8x 1080p60 (H.265) 16x 1080p30 (H.265) |
Video Decode | 1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265) |
PCIe | Up to 2 x8 + 1 x4 + 2 x1 (PCIe Gen4, Root Port, & Endpoint) |
Power | 15W - 60W |
Other I/O | 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs |
Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification:
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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